Abstract: A variant of Erysipelothrix rhusiopathiae surface protective antigen SpaA protein or of a shortened form of SpaA (?SpaA) in which a portion of SpaA protein is deleted for protection from Erysipelothrix rhusiopathiae infection and a process for preparing the same are provided. Introduction of amino acid substitution at a specific site in the amino acid sequence of SpaA or ?SpaA protein provides a variant of SpaA or ?SpaA protein which is immunogenic and is expressed in E. coli as inclusion bodies. The variant of SpaA or ?SpaA protein of the present invention may easily be recovered and purified since it is expressed in E. coli as inclusion bodies.

Abstract: A method and a kit for detecting an antibody to Avibacterium paragallinarum are provided. A method for detecting an antibody to Avibacterium paragallinarum which comprises detecting an antibody induced by an outer-membrane protein of Avibacterium paragallinarum serotype A and/or serotype C by ELISA with a solid phase to which a peptide consisting of an amino acid sequence of non-homologous region of said outer-membrane protein or a portion thereof is immobilized, and a detection kit used for said method.

Abstract: A variant of Erysipelothrix rhusiopathiae surface protective antigen SpaA protein or of a shortened form of SpaA (?SpaA) in which a portion of SpaA protein is deleted for protection from Erysipelothrix rhusiopathiae infection and a process for preparing the same are provided. Introduction of amino acid substitution at a specific site in the amino acid sequence of SpaA or ?SpaA protein provides a variant of SpaA or ?SpaA protein which is immunogenic and is expressed in E. coli as inclusion bodies. The variant of SpaA or ?SpaA protein of the present invention may easily be recovered and purified since it is expressed in E. coli as inclusion bodies.

Abstract: A method and a kit for detecting an antibody to Avibacterium paragallinarum are provided. A method for detecting an antibody to Avibacterium paragallinarum which comprises detecting an antibody induced by an outer-membrane protein of Avibacterium paragallinarum serotype A and/or serotype C by ELISA with a solid phase to which a peptide consisting of an amino acid sequence of non-homologous region of said outer-membrane protein or a portion thereof is immobilized, and a detection kit used for said method.

Abstract: A variant of Erysipelothrix rhusiopathiae surface protective antigen SpaA protein or of a shortened form of SpaA (?SpaA) in which a portion of SpaA protein is deleted for protection from Erysipelothrix rhusiopathiae infection and a process for preparing the same are provided. Introduction of amino acid substitution at a specific site in the amino acid sequence of SpaA or ?SpaA protein provides a variant of SpaA or ?SpaA protein which is immunogenic and is expressed in E. coli as inclusion bodies. The variant of SpaA or ?SpaA protein of the present invention may easily be recovered and purified since it is expressed in E. coli as inclusion bodies.

Abstract: A variant of Erysipelothrix rhusiopathiae surface protective antigen SpaA protein or of a shortened form of SpaA (?SpaA) in which a portion of SpaA protein is deleted for protection from Erysipelothrix rhusiopathiae infection and a process for preparing the same are provided. Introduction of amino acid substitution at a specific site in the amino acid sequence of SpaA or ?SpaA protein provides a variant of SpaA or ?SpaA protein which is immunogenic and is expressed in E. coli as inclusion bodies. The variant of SpaA or ?SpaA protein of the present invention may easily be recovered and purified since it is expressed in E. coli as inclusion bodies.

Abstract: There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

Abstract: There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

Abstract: A semiconductor module includes first and second semiconductor chips having first and second element surfaces where first and second electrode pads are provided. The first semiconductor chip is provided on a second main surface of a substrate with the first element surface facing the substrate. The second semiconductor chip is provided on the first semiconductor chip with a surface opposite to the second element surface facing a surface opposite to the first element surface. First and second wiring patterns are provided on the first and second main surfaces and connected to each other. The first and second wiring patterns have first and second connection parts. First and second connection wire connect the first and second electrode pads to the first and second connection parts respectively. An external terminal is provided on the first wiring pattern. A sealing member covers the second connection wire.

Abstract: There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

Abstract: The present invention aims at providing a method for preparing dermonecrotic toxin, an improved toxoid of dermonecrotic toxin produced by Bordetelia and a toxoid mixture comprising said improved toxoid of dermonecrotic toxin produced by Bordetella and a toxoid of dermonecrotic toxin produced by Pasteurella. There is provided a method for partially purifying dermonecrotic toxin which comprises bringing a dermonecrotic toxin-containing solution into contact with a chromatographic gel sulfated by direct sulfation or a chromatographic gel to which a sulfated molecule is covalently bonded to thereby make the dermonecrotic toxin adsorbed on the gel, and eluting the adsorbed dermonecrotic toxin from the gel.