Abstract: A gas amount measuring device including a vacuum container, a first pipe, an air release valve being attached to the first pipe, a second pipe, a calibration gas generator being attached to the first pipe, a third pipe, a vacuum gauge, a first valve, a leak valve, a second valve, a turbomolecular pump, a third valve, and a roughing pump being attached to the third pipe in order from a vacuum container side, a first bypass pipe connecting the third pipe between the vacuum container and the first valve to the third pipe between the leak valve and the second valve, a fourth valve being attached to the first bypass pipe, and a second bypass pipe connecting the third pipe between the leak valve and the second valve to the third pipe between the third valve and the roughing pump, a fifth valve being attached to the second bypass pipe.

Abstract: There is provided a gas separation apparatus for separating a specified gas from a gas to be treated containing a plurality of gases. The gas separation apparatus includes a plurality of serially-connected separation units that separate the specified gas from other gases by using a column, and a suction unit that controls an inside of the column to a reduced pressure. At least two of the plurality of separation units differ from each other in at least one separation condition.

Abstract: A gas amount measuring device including a vacuum container, a first pipe, an air release valve being attached to the first pipe, a second pipe, a calibration gas generator being attached to the first pipe, a third pipe, a vacuum gauge, a first valve, a leak valve, a second valve, a turbomolecular pump, a third valve, and a roughing pump being attached to the third pipe in order from a vacuum container side, a first bypass pipe connecting the third pipe between the vacuum container and the first valve to the third pipe between the leak valve and the second valve, a fourth valve being attached to the first bypass pipe, and a second bypass pipe connecting the third pipe between the leak valve and the second valve to the third pipe between the third valve and the roughing pump, a fifth valve being attached to the second bypass pipe.

Abstract: There is provided a gas separation apparatus for separating a specified gas from a gas to be treated containing a plurality of gases. The gas separation apparatus includes a plurality of serially-connected separation units that separate the specified gas from other gases by using a column, and a suction unit that controls an inside of the column to a reduced pressure. At least two of the plurality of separation units differ from each other in at least one separation condition.

Abstract: The present invention provides a method of producing a bonded body of a beryllium member and a copper or copper alloy member, in which the bonding strength and thermal cycle resistance property are further increased. When the beryllium member and the copper or copper alloy member are bonded to each other, a thin layer of titanium, chromium, molybdenum, or silicon is formed as a diffusion inhibition layer on the surface of the beryllium; a copper layer is formed as a bonding layer on the surface of the diffusion inhibition layer; a thin layer of aluminum or zinc is formed as a bonding promotion layer on the surface of the bonding layer; and the beryllium member and the copper or copper alloy member are diffusion bonded to each other with the intermediate layer formation side being the bonding surface.

Abstract: The present invention provides a method of producing a bonded body of a beryllium member and a copper or copper alloy member, in which the bonding strength and thermal cycle resistance property are further increased. When the beryllium member and the copper or copper alloy member are bonded to each other, a thin layer of titanium, chromium, molybdenum, or silicon is formed as a diffusion inhibition layer on the surface of the beryllium; a copper layer is formed as a bonding layer on the surface of the diffusion inhibition layer; a thin layer of aluminum or zinc is formed as a bonding promotion layer on the surface of the bonding layer; and the beryllium member and the copper or copper alloy member are diffusion bonded to each other with the intermediate layer formation side being the bonding surface.