Patents by Inventor Toshihisa Nagasawa
Toshihisa Nagasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7443654Abstract: A surface-mounting thin type capacitor includes a capacitor element having a shape of and two end portions which form a side surface of the capacitor element. Two anode terminals are disposed on lower surfaces of the end portions along the side surface to form a mounting surface substantially perpendicular to the side surface. A cathode terminal is disposed at a middle part of the capacitor element to form the mounting surface together with the anode terminals. The cathode terminal is not between the anode terminals spatially and thereby manufacturing process of the capacitor is simplified and it is easy to change the intended use of the capacitor.Type: GrantFiled: August 9, 2005Date of Patent: October 28, 2008Assignees: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Tadamasa Asami, Toshihisa Nagasawa, Kenji Araki, Akihiro Kawai, Yuichi Maruko
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Patent number: 7433175Abstract: In a solid electrolytic capacitor, a second dielectric layer made of an oxide of valve action metal is formed on first side, second side, and third side surfaces of an anode portion of an anode member. Between the second dielectric layer and a conductive polymer layer of the cathode layer, an electrical insulating resin layer is formed.Type: GrantFiled: August 1, 2006Date of Patent: October 7, 2008Assignee: NEC TOKIN CorporationInventors: Tadamasa Asami, Toshihisa Nagasawa, Akihiro Kawai, Yuichi Maruko, Yuji Aoki
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Patent number: 7326261Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.Type: GrantFiled: March 1, 2007Date of Patent: February 5, 2008Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
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Publication number: 20070148900Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.Type: ApplicationFiled: March 1, 2007Publication date: June 28, 2007Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Toshihisa NAGASAWA, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
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Patent number: 7206193Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.Type: GrantFiled: October 27, 2005Date of Patent: April 17, 2007Assignees: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
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Publication number: 20070030629Abstract: In a solid electrolytic capacitor, a second dielectric layer made of an oxide of valve action metal is formed on first side, second side, and third side surfaces of an anode portion of an anode member. Between the second dielectric layer and a conductive polymer layer of the cathode layer, an electrical insulating resin layer is formed.Type: ApplicationFiled: August 1, 2006Publication date: February 8, 2007Applicant: NEC TOKIN CorporationInventors: Tadamasa Asami, Toshihisa Nagasawa, Akihiro Kawai, Yuichi Maruko, Yuji Aoki
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Patent number: 7113390Abstract: In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.Type: GrantFiled: January 18, 2005Date of Patent: September 26, 2006Assignees: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Yuichi Maruko, Akihiro Kawai, Toshihisa Nagasawa, Tadamasa Asami
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Publication number: 20060087795Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.Type: ApplicationFiled: October 27, 2005Publication date: April 27, 2006Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Toshihisa Nagasawa, Kenji Araki, Hitoshi Takata, Akihiro Kawai, Shinji Arai
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Publication number: 20060044737Abstract: A surface-mounting thin type capacitor includes a capacitor element having a shape of and two end portions which form a side surface of the capacitor element. Two anode terminals are disposed on lower surfaces of the end portions along the side surface to form a mounting surface substantially perpendicular to the side surface. A cathode terminal is disposed at a middle part of the capacitor element to form the mounting surface together with the anode terminals. The cathode terminal is not between the anode terminals spatially and thereby manufacturing process of the capacitor is simplified and it is easy to change the intended use of the capacitor.Type: ApplicationFiled: August 9, 2005Publication date: March 2, 2006Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Tadamasa Asami, Toshihisa Nagasawa, Kenji Araki, Akihiro Kawai, Yuichi Maruko
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Publication number: 20050162814Abstract: In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.Type: ApplicationFiled: January 18, 2005Publication date: July 28, 2005Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Yuichi Maruko, Akihiro Kawai, Toshihisa Nagasawa, Tadamasa Asami
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Patent number: 6920035Abstract: A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal plate 67 that are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.Type: GrantFiled: July 13, 2004Date of Patent: July 19, 2005Assignees: Nec Tokin Corporation, Nec Tokin Toyama, Ltd.Inventors: Toshihisa Nagasawa, Akihiro Kawai, Yuichi Maruko
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Patent number: 6882521Abstract: A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.Type: GrantFiled: December 16, 2003Date of Patent: April 19, 2005Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.Inventors: Makoto Tsutsui, Toshihisa Nagasawa
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Publication number: 20050013093Abstract: A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal plate 67 that are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.Type: ApplicationFiled: July 13, 2004Publication date: January 20, 2005Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Toshihisa Nagasawa, Akihiro Kawai, Yuichi Maruko
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Publication number: 20040160730Abstract: A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.Type: ApplicationFiled: December 16, 2003Publication date: August 19, 2004Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.Inventors: Makoto Tsutsui, Toshihisa Nagasawa
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Patent number: 6392868Abstract: An electric double-layer capacitor has a pair of thrust plates for thrusting a stacked cell pair and a gasket for encapsulating the stacked cell pair together with the thrust plates. The thrust plate has slanted side surfaces for effecting a close contact with a packaging overcoat. The thrust plates and the mounting gasket are coupled together by an interdigitaion relationship.Type: GrantFiled: February 26, 2001Date of Patent: May 21, 2002Assignee: NEC CorporationInventors: Masako Ohya, Kazuya Mimura, Yutaka Nakazawa, Satoshi Abe, Satoshi Arai, Takashi Yasuda, Toshihisa Nagasawa, Koji Sakata, Mitsuru Ogawa
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Publication number: 20010021097Abstract: An electric double-layer capacitor has a pair of thrust plates for thrusting a stacked cell pair and a gasket for encapsulating the stacked cell pair together with the thrust plates. The thrust plate has slanted side surfaces for effecting a close contact with a packaging overcoat. The thrust plates and the mounting gasket are coupled together by an interdigitaion relationship.Type: ApplicationFiled: February 26, 2001Publication date: September 13, 2001Inventors: Masako Ohya, Kazuya Mimura, Yutaka Nakazawa, Satoshi Abe, Satoshi Arai, Takashi Yasuda, Toshihisa Nagasawa, Koji Sakata, Mitsuru Ogawa
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Patent number: D587198Type: GrantFiled: February 26, 2008Date of Patent: February 24, 2009Assignee: NEC TOKIN CorporationInventor: Toshihisa Nagasawa
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Patent number: D587199Type: GrantFiled: February 26, 2008Date of Patent: February 24, 2009Assignee: NEC TOKIN CorporationInventor: Toshihisa Nagasawa