Patents by Inventor Toshihisa Yamane

Toshihisa Yamane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130011573
    Abstract: At least one inert-gas supply section is provided in a coating section and a light-irradiating section that are sealingly coupled to each other at a side of the coating section where a base material enters, the coating section coating a photopolymerizable composition onto the base material and the light-irradiating section applying light to the photopolymerizable composition layer after coating. Inert gas supplied from a first inert-gas supply section is sprayed from the inert-gas chamber toward the base material, and is supplied into each of the coating section and the light irradiating section.
    Type: Application
    Filed: June 26, 2012
    Publication date: January 10, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tooru NAKASHIMA, Toshihisa YAMANE
  • Patent number: 8226398
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, including: one or a plurality of extruders; a die into which one or a plurality of resin materials are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and the stabilizers rotate in one direction around the central axis of the cylindrically-shaped resin materials.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: July 24, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Kooki Ooyama, Shinsuke Ikishima, Naoto Hayashi, Tadao Torii, Toshihisa Yamane, Yuuki Katou
  • Publication number: 20120112380
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, including: one or a plurality of extruders; a die into which one or a plurality of resin materials are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and the stabilizers rotate in one direction around the central axis of the cylindrically-shaped resin materials.
    Type: Application
    Filed: November 15, 2011
    Publication date: May 10, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kooki OOYAMA, Shinsuke IKISHIMA, Naoto HAYASHI, Tadao TORII, Toshihisa YAMANE, Yuuki KATOU
  • Patent number: 8092204
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, the apparatus including: one or a plurality of extruders; a die into which one or a plurality of resin materials including at least a resin material for forming a pressure-sensitive adhesive layer and extruded respectively from the extruders are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: January 10, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Kooki Ooyama, Shinsuke Ikishima, Naoto Hayashi, Tadao Torii, Toshihisa Yamane, Yuuki Katou
  • Publication number: 20110233827
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, the apparatus including: one or a plurality of extruders; a die into which one or a plurality of resin materials including at least a resin material for forming a pressure-sensitive adhesive layer and extruded respectively from the extruders are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and
    Type: Application
    Filed: July 8, 2010
    Publication date: September 29, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kooki OOYAMA, Shinsuke IKISHIMA, Naoto HAYASHI, Tadao TORII, Toshihisa YAMANE, Yuuki KATOU