Patents by Inventor Toshikatsu Hiroe

Toshikatsu Hiroe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device having a mirror portion
    Patent number: 7476913
    Abstract: A light emitting device has a cup portion with a bottom surface opening, and one electrode of a light emitting element is connected to the cup portion. The other electrode of the light emitting element is connected to a lead set up from an inner space to outside the cup portion using the opening of the cup portion. Each electrode and lead of the light emitting device can be electrically connected without bonding wires. This prevents shadows or light unevenness from reflecting the shape of the bonding wire, thereby enhancing light-emission efficiency. As an alternative to setting up the lead from inside to the outside of the cup portion, the lead existing outside the cup portion and the other electrode are electrically connected via the bonding wire through the cup portion's opening. Thus, light outputted outside of the light emitting device is not intercepted by the bonding wire.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: January 13, 2009
    Assignees: Renesas Technology Corp., Hitachi Cable Precision Co., Ltd., Hitachi Cable, Ltd.
    Inventors: Hiroyuki Isobe, Gen Murakami, Toshikatsu Hiroe
  • Light Emitting Device and Process for Manufacturing the Same
    Publication number: 20080128724
    Abstract: A light emitting device in which the bottom surface of a cup portion is configured to have an opening, and one electrode of a light emitting element is electrically connected to the cup portion, and the other electrode of the light emitting element is electrically connected to a lead which is set up through an inner space from outside the cup portion by making use of the opening of the cup portion. As a result of this configuration, each electrode and each lead of the light emitting device can be electrically connected to each other without using a bonding wire. This makes it possible to prevent occurrence of a shadow or light unevenness reflecting shape of the bonding wire, thereby allowing an enhancement in light-emission efficiency.
    Type: Application
    Filed: August 10, 2004
    Publication date: June 5, 2008
    Inventors: Hiroyuki Isobe, Gen Murakami, Toshikatsu Hiroe
  • Insulating film with improved punching characteristics and lead frame using the same
    Patent number: 5837368
    Abstract: The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70 kgf/20 mm for the purpose of suppressing the burrs and the chips.
    Type: Grant
    Filed: December 4, 1996
    Date of Patent: November 17, 1998
    Assignee: Hitachi Cable, Ltd.
    Inventors: Toshikatsu Hiroe, Kenichi Kaneko, Noboru Imai, Hiroyuki Takasaka, Toshio Kawamura
  • Insulating film with improved punching characteristics and lead frame using the same
    Patent number: 5593774
    Abstract: The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70 kgf/20 mm for the purpose of suppressing the burrs and the chips.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: January 14, 1997
    Assignee: Hitachi Cable, Ltd.
    Inventors: Toshikatsu Hiroe, Kenichi Kaneko, Noboru Imai, Hiroyuki Takasaka, Toshio Kawamura