Patents by Inventor Toshikazu Kozono

Toshikazu Kozono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6960269
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a centering device insertable within a common center hole of the superimposed substrates. The centering device includes at least two contact pins configured to simultaneously contact an inside circumferential edge of the common center hole, where the contact pins retractably extend in substantially opposite directions to press against the inside circumferential edge of the common center hole and align the superimposed substrates. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the adhesive layer between the aligned substrates, the provisional bonding device partially bonding and provisionally fastening the aligned substrates.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: November 1, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Patent number: 6793748
    Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: September 21, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Fujioka, Akinobu Katayama, Toshikazu Kozono, Kiyoshi Mayahara
  • Publication number: 20040149380
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, and forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the adhesive layer to partially bond and provisionally fasten the first substrate and the second substrate.
    Type: Application
    Filed: January 22, 2004
    Publication date: August 5, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Patent number: 6733606
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate. The manufacturing apparatus and method further include an adhesive supply source adapted to supply the adhesive to the adhesive applying device at a first predetermined temperature and a defoaming tank adapted to remove bubbles from the adhesive at a second predetermined temperature, which is higher than the first predetermined temperature.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: May 11, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Patent number: 6733604
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a suction device adapted to suction the adhesive layer formed between the first substrate and the second substrate with a predetermined suction force. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the suctioned adhesive layer to partially bond and provisionally fasten the first substrate and the second substrate.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: May 11, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Publication number: 20030006004
    Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.
    Type: Application
    Filed: May 21, 2002
    Publication date: January 9, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Fujioka, Akinobu Katayama, Toshikazu Kozono, Kiyoshi Mayahara
  • Publication number: 20020011299
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a centering device insertable within a common center hole of the superimposed substrates. The centering device includes at least two contact pins configured to simultaneously contact an inside circumferential edge of the common center hole, where the contact pins retractably extend in substantially opposite directions to press against the inside circumferential edge of the common center hole and align the superimposed substrates. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the adhesive layer between the aligned substrates, the provisional bonding device partially bonding and provisionally fastening the aligned substrates.
    Type: Application
    Filed: June 25, 2001
    Publication date: January 31, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Publication number: 20010035254
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate. The manufacturing apparatus and method further include an adhesive supply source adapted to supply the adhesive to the adhesive applying device at a first predetermined temperature and a defoaming tank adapted to remove bubbles from the adhesive at a second predetermined temperature, which is higher than the first predetermined temperature.
    Type: Application
    Filed: June 25, 2001
    Publication date: November 1, 2001
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Publication number: 20010035262
    Abstract: A apparatus and method for manufacturing a laminated optical disc that include an adhesive applying device adapted to apply an adhesive to a first substrate, forming an adhesive layer having a specific thickness between the first substrate and a second substrate superimposed onto the first substrate, and a suction device adapted to suction the adhesive layer formed between the first substrate and the second substrate with a predetermined suction force. The manufacturing apparatus and method may further include a provisional bonding device adapted to partially cure the suctioned adhesive layer to partially bond and provisionally fasten the first substrate and the second substrate.
    Type: Application
    Filed: June 25, 2001
    Publication date: November 1, 2001
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Patent number: 6309485
    Abstract: A method and apparatus for the manufacture of laminated compact disc. When forming an adhesive layer between a first substrate and a second substrate, and laminating the first substrate and second substrate to produce a disc, temperature and other conditions are adjusted based on the adhesive layer thickness of the manufactured optical disc, thus the viscosity of adhesive is changed to match each process. Accordingly, high quality discs can be consistently manufactured, and the operating efficiency of the manufacturing apparatus can be improved. Moreover, an optical disc free of bubbles mixed in the adhesive layer of a laminated optical disc can be stably manufactured.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: October 30, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisaki Miyamoto, Kiyoshi Inoue, Hirokazu Itou, Toshikazu Kozono
  • Patent number: 6183577
    Abstract: A method for manufacturing an optical information medium has a step of bending at least one of a first board and a second board having a center hole, a step of applying a radiation-curing resin onto the bent board in a doughnut form while the bent board is rotated, and a step of lapping the other board on the bent board and rotating the paired boards integrally.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: February 6, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshikazu Kozono, Toshio Yanai, Manabu Nakanishi, Kiyoshi Inoue