Patents by Inventor Toshikazu Matsuda

Toshikazu Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11858310
    Abstract: An air conditioner for a vehicle includes: a case having an air passage; a heat exchanger having a core portion in which heat is exchanged between air and a heat medium; a support portion provided in the case to support a lower portion of the heat exchanger; and a cushioning material interposed between the lower portion of the heat exchanger and the support portion. The lower portion of the heat exchanger has a pipe side adjacent to an inflow pipe or an outflow pipe for the heat medium and an opposite-to-pipe side located on an opposite side of the pipe side. The support portion includes a pipe side support that supports the pipe side, and an opposite-to-pipe side support that supports the opposite-to-pipe side. A surface area of the opposite-to-pipe side support in contact with the cushioning material is larger than that of the pipe side support.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: January 2, 2024
    Assignee: DENSO CORPORATION
    Inventors: Masao Yasunaga, Toshikazu Matsuda
  • Publication number: 20210362560
    Abstract: An air conditioner for a vehicle includes: a case having an air passage; a heat exchanger having a core portion in which heat is exchanged between air and a heat medium; a support portion provided in the case to support a lower portion of the heat exchanger; and a cushioning material interposed between the lower portion of the heat exchanger and the support portion. The lower portion of the heat exchanger has a pipe side adjacent to an inflow pipe or an outflow pipe for the heat medium and an opposite-to-pipe side located on an opposite side of the pipe side. The support portion includes a pipe side support that supports the pipe side, and an opposite-to-pipe side support that supports the opposite-to-pipe side. A surface area of the opposite-to-pipe side support in contact with the cushioning material is larger than that of the pipe side support.
    Type: Application
    Filed: August 5, 2021
    Publication date: November 25, 2021
    Inventors: Masao YASUNAGA, Toshikazu MATSUDA
  • Patent number: 10969180
    Abstract: An air-conditioning unit includes an air-conditioning case and a heat exchanger. The heat exchanger includes a plurality of tubes and a header tank. The air-conditioning case includes a holder in which the header tank is held while being inserted therein. The holder includes a first rib and a plurality of second ribs for pressing a tank outer wall of the header tank toward an internal space of the header tank. The first rib extends in a tube stacking direction. The plurality of second ribs are each connected to the first rib, are formed to extend from the first rib away from the tubes, and are arranged side by side at a predetermined inter-rib spacing in the tube stacking direction. The inter-rib spacing is larger than a length of the second ribs extending from the first rib away from the tubes in a tube longitudinal direction.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 6, 2021
    Assignee: DENSO CORPORATION
    Inventor: Toshikazu Matsuda
  • Patent number: 10864798
    Abstract: A link mechanism includes a first link member, a second link member, a third link member, and a link cover. The first link member is connected to a motor and rotated by the motor. The second link member is connected to an open/close door which opens and closes a blowout opening through which air is blown to adjust the temperature inside the passenger compartment. The third link member has a rotation shaft supported by a fixing member, and connects the first link member and the second link member with each other. The link cover is arranged to cover the periphery of the first link member. The link cover has a protrusion protruding toward the third link member.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: December 15, 2020
    Assignee: DENSO CORPORATION
    Inventor: Toshikazu Matsuda
  • Publication number: 20190232756
    Abstract: A link mechanism includes a first link member, a second link member, a third link member, and a link cover. The first link member is connected to a motor and rotated by the motor. The second link member is connected to an open/close door which opens and closes a blowout opening through which air is blown to adjust the temperature inside the passenger compartment. The third link member has a rotation shaft supported by a fixing member, and connects the first link member and the second link member with each other. The link cover is arranged to cover the periphery of the first link member. The link cover has a protrusion protruding toward the third link member.
    Type: Application
    Filed: June 1, 2017
    Publication date: August 1, 2019
    Inventor: Toshikazu MATSUDA
  • Publication number: 20190162488
    Abstract: An air-conditioning unit includes an air-conditioning case and a heat exchanger. The heat exchanger includes a plurality of tubes and a header tank. The air-conditioning case includes a holder in which the header tank is held while being inserted therein. The holder includes a first rib and a plurality of second ribs for pressing a tank outer wall of the header tank toward an internal space of the header tank. The first rib extends in a tube stacking direction. The plurality of second ribs are each connected to the first rib, are formed to extend from the first rib away from the tubes, and are arranged side by side at a predetermined inter-rib spacing in the tube stacking direction. The inter-rib spacing is larger than a length of the second ribs extending from the first rib away from the tubes in a tube longitudinal direction.
    Type: Application
    Filed: January 30, 2019
    Publication date: May 30, 2019
    Inventor: Toshikazu MATSUDA
  • Patent number: 8827318
    Abstract: A first component and a second component are connected with each other in a manner that a first passage of the first component and a second passage of the second component communicate with each other through a communication part. A seal component is disposed between the first component and the second component to provide a sealing between the first passage and the second passage. A ring component is arranged to surround the communication part, and is located adjacent to the communication part rather than the seal component. The ring component restricts the communication part from having an excess increase in a cross-sectional area.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: September 9, 2014
    Assignee: Denso Corporation
    Inventors: Hiroshi Watanabe, Akihito Higashihara, Toshikazu Matsuda
  • Patent number: 8526267
    Abstract: To suppress a timing window from being narrowed undesirably by the harmonic component of a signal output from a semiconductor component without imposing a burden on the semiconductor component that controls access. A capacitor element is arranged in series with a specific transmission path branching from a predetermined node of a signal transmission path and reaching to a ground plane, the signal transmission path supplying an enable control signal that indicates the validity of a clock signal and a command and address signal output from a semiconductor component that controls access on a substrate to another semiconductor component to be accessed on the substrate. The capacitor element functions as a short-circuit path to the ground plane for the harmonic component of the enable control signal and makes smaller the through rate and makes larger the timing window of the enable control signal compared to those when the capacitor element is not provided.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: September 3, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Motoo Suwa, Toshikazu Matsuda
  • Publication number: 20120299292
    Abstract: A first component and a second component are connected with each other in a manner that a first passage of the first component and a second passage of the second component communicate with each other through a communication part. A seal component is disposed between the first component and the second component to provide a sealing between the first passage and the second passage. A ring component is arranged to surround the communication part, and is located adjacent to the communication part rather than the seal component. The ring component restricts the communication part from having an excess increase in a cross-sectional area.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 29, 2012
    Applicant: DENSO CORPORATION
    Inventors: Hiroshi Watanabe, Akihito Higashihara, Toshikazu Matsuda
  • Publication number: 20110317475
    Abstract: To suppress a timing window from being narrowed undesirably by the harmonic component of a signal output from a semiconductor component without imposing a burden on the semiconductor component that controls access. A capacitor element is arranged in series with a specific transmission path branching from a predetermined node of a signal transmission path and reaching to a ground plane, the signal transmission path supplying an enable control signal that indicates the validity of a clock signal and a command and address signal output from a semiconductor component that controls access on a substrate to another semiconductor component to be accessed on the substrate. The capacitor element functions as a short-circuit path to the ground plane for the harmonic component of the enable control signal and makes smaller the through rate and makes larger the timing window of the enable control signal compared to those when the capacitor element is not provided.
    Type: Application
    Filed: June 28, 2011
    Publication date: December 29, 2011
    Inventors: Motoo SUWA, Toshikazu MATSUDA
  • Patent number: 6623585
    Abstract: The present invention provides a process whereby high quality, well-coalesced spandex can be made by dry-spinning a high-melting thermoplastic polyurethane, bundling the as-spun filaments into a side-by-side relationship, and passing the bundled filaments over or through a guide. The spandex made by this method has high-heat settability, high denier uniformity, good knittability and weavability, and provides fabrics having good surface uniformity.
    Type: Grant
    Filed: February 23, 2001
    Date of Patent: September 23, 2003
    Assignee: DuPont-Toray Co. Ltd.
    Inventors: Masao Umezawa, Hideki Nakanishi, Toshikazu Matsuda
  • Patent number: 6403712
    Abstract: Dry-spun polyurethane-based spandex ® containing 1-10 weight percent poly(vinylpyrrolidone) and a process of their preparation, are provided.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: June 11, 2002
    Assignee: DuPont Toray Co. Ltd.
    Inventors: Shingo Ito, Toshikazu Matsuda, Masao Umezawa
  • Publication number: 20010039790
    Abstract: The present invention provides a process whereby high quality, well-coalesced spandex can be made by dry-spinning a high-melting thermoplastic polyurethane, bundling the as-spun filaments into a side-by-side relationship, and passing the bundled filaments over or through a guide. The spandex made by this method has high-heat settability, high denier uniformity, good knittability and weavability, and provides fabrics having good surface uniformity.
    Type: Application
    Filed: February 23, 2001
    Publication date: November 15, 2001
    Inventors: Masao Umezawa, Hideki Nakanishi, Toshikazu Matsuda
  • Patent number: 6225435
    Abstract: A viscosity-stable solution of a polyurethaneurea, in the substantial absence of viscosity stabilizers, and spandex dry-spun therefrom, prepared from certain polyether glycols and aliphatic diisocyanates and ethylene diamine, are provided.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: May 1, 2001
    Assignee: DuPont Toray Co. Ltd.
    Inventors: Shingo Ito, Toshikazu Matsuda, Masao Umezawa
  • Patent number: 6214145
    Abstract: The present invention provides a process whereby high quality, well-coalesced spandex can be made by dry-spinning a high-melting thermoplastic polyurethane, bundling the as-spun filaments into a side-by-side relationship, and passing the bundled filaments over or through a guide. The spandex made by this method has high heat-settability, high denier uniformity, good knittability and weavability, and provides fabrics having good surface uniformity.
    Type: Grant
    Filed: January 21, 1999
    Date of Patent: April 10, 2001
    Assignee: DuPont Toray Co., Ltd.
    Inventors: Masao Umezawa, Hideki Nakanishi, Toshikazu Matsuda
  • Patent number: 5859171
    Abstract: A polyimide copolymer containing a block polyimide polymer component composed of a rigid aromatic diamine compound and an aromatic tetracarboxylic acid compound and a random polyimide copolymer component composed of a flexible aromatic diamine compound and at least two types of aromatic tetracarboxylic acid compounds is prepared by a two-stage polymerization process. Resin molded products prepared from the polyimide copolymer have high modulus, low thermal expansion and low water absorption and can be used as TAB base films that require higher processability and precision.
    Type: Grant
    Filed: May 21, 1997
    Date of Patent: January 12, 1999
    Assignee: DuPont Toray
    Inventors: Kouichi Sawasaki, Michihiro Kubo, Toshikazu Matsuda
  • Patent number: 5820709
    Abstract: A vehicle tire wheel has a tire (31) and a rim (32) with elastic members (39) formed on left and right side flange pares (37). The tire (31) is mounted to the rim (32) so that the elastic members (39) cone in contact with left and right side bead parts (35) of the tire (31). The elastic members reduce undesirable force exerted on the left and right side bead parts (35) from the rim (32).
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: October 13, 1998
    Assignee: National Tire Co., Ltd.
    Inventor: Toshikazu Matsuda
  • Patent number: 5637990
    Abstract: A power control apparatus for protecting an electrical circuit from excessive current and in particular for protecting it from a large and fast transition pulse caused by a rapid current polarity transition. At least two switching devices are coupled in series or in parallel between a power supply and a load. A gate signal is generated to change the switching devices from conductive state to nonconducting state in response to detection of an excessive current state. The gate signal is delayed by a predetermined period of time to change the switching devices into the nonconducting state after all of the switching devices are saturated so that the rapid current polarity transition is eliminated.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: June 10, 1997
    Assignee: Sony/Tektronix Corporation
    Inventors: Katsuhisa Kato, Toshihiko Onozawa, Tatsuya Murofushi, Toshikazu Matsuda
  • Patent number: 4530993
    Abstract: Disclosed is a polyimide film consisting essentially of 2,2'-dichloro-4,4'-biphenylene pyromellitimide units. This film has high tensile characteristics and excellent heat resistance.
    Type: Grant
    Filed: November 2, 1984
    Date of Patent: July 23, 1985
    Assignee: Director General of Agency of Industrial Science & Technology
    Inventors: Takuma Jinda, Toshikazu Matsuda, Masanori Sakamoto