Abstract: A blade attachment tool includes a first support member supported by a pressing support portion supporting a blade formed of an elastic member configured to wipe/scrape liquid/solids spreading on an abutment surface by being pressed against the abutment surface and being long in one direction such that the blade is pressed against the abutment surface with a predetermined pressing force, a second support member supported to swing about a swing shaft extending in a longitudinal direction of the blade with respect to the first support member and configured such that a base end side of the blade is attached thereto, and an energizing member configured to apply a reaction force to a friction force that causes the second support member to swing about the swing shaft with respect to the first support member when the blade is pressed against the abutment surface to slide relatively to the abutment surface.

Abstract: A grinding material includes a base sheet and a grinding layer overlaid on a front face side of the base sheet and including abrasive grains and a binder for the abrasive grains. The grinding layer includes the abrasive grains of a plurality of types. Of the abrasive grains of the plurality of types, provided that first abrasive grains have the largest average diameter and second abrasive grains have the second largest average diameter, the percentage of the average diameter of the second abrasive grains with respect to that of the first abrasive grains is 5-70%. The total content of the abrasive grains in the grinding layer is preferably 50-85% by volume. The content of the first abrasive grains in the grinding layer is preferably 1-25% by volume. The first abrasive grains are preferably diamond abrasive grains and the second abrasive grains are preferably alumina abrasive grains.

Abstract: A blade attachment tool includes a first support member supported by a pressing support portion supporting a blade formed of an elastic member configured to wipe/scrape liquid/solids spreading on an abutment surface by being pressed against the abutment surface and being long in one direction such that the blade is pressed against the abutment surface with a predetermined pressing force, a second support member supported to swing about a swing shaft extending in a longitudinal direction of the blade with respect to the first support member and configured such that a base end side of the blade is attached thereto, and an energizing member configured to apply a reaction force to a friction force that causes the second support member to swing about the swing shaft with respect to the first support member when the blade is pressed against the abutment surface to slide relatively to the abutment surface.

Abstract: The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.

Abstract: A grinding material includes a base sheet and a grinding layer overlaid on a front face side of the base sheet and including abrasive grains and a binder for the abrasive grains. The grinding layer includes the abrasive grains of a plurality of types. Of the abrasive grains of the plurality of types, provided that first abrasive grains have the largest average diameter and second abrasive grains have the second largest average diameter, the percentage of the average diameter of the second abrasive grains with respect to that of the first abrasive grains is 5-70%. The total content of the abrasive grains in the grinding layer is preferably 50-85% by volume. The content of the first abrasive grains in the grinding layer is preferably 1-25% by volume. The first abrasive grains are preferably diamond abrasive grains and the second abrasive grains are preferably alumina abrasive grains.

Abstract: An abrasive film capable of preventing an undercut of an optical fiber after polishing, while providing a great grinding force is provided. An abrasive film includes a substrate and an abrasive layer overlaid on a top face side thereof, the abrasive layer including a resin binder and abrasive particles dispersed in the resin binder; the content of abrasive particles having a primary particle size of no less than 70 nm being no less than 10% by mass and no greater than 50% by mass with respect to the total abrasive particles; the content of the abrasive particles in the abrasive layer being no less than 84% by mass; and the indentation hardness of the abrasive layer being no greater than 370 N/mm2. The abrasive particles are preferably silica particles. An average thickness of the abrasive layer is preferably no less than 4 ?m and no greater than 15 ?m.

Abstract: It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 ?m and no greater than 70 ?m.

Abstract: Provided is an abrasive film not likely to cause an end face defect of an optical fiber connector due to variation in load conditions during polishing, while providing a great grinding force. The abrasive film comprises a substrate film and an abrasive layer overlaid thereon, the abrasive layer comprising abrasive particles and a binder therefor and a wear quantity of the abrasive layer being from 10 mg to 25 mg. A content of the abrasive particles in the abrasive layer is preferably no less than 85% by mass. The abrasive particles preferably comprise first abrasive particles (primary particle diameter: of no less than 10 nm and less than 50 nm), and second abrasive particles (primary particle diameter: no less than 50 nm and less than 250 nm). An average thickness of the abrasive layer is preferably from 4 ?m to 15 ?m. The abrasive particles are preferably silica particles.

Abstract: The purpose of the present invention is to provide a grinding material which has a superior grinding rate and planarizing accuracy, with the grinding rate being less likely to be reduced over a relatively long period of time. The present invention is directed to a grinding material including a base, a grinding layer overlaid on a front face side of the base and including grinding grains and a binder for the grinding grains, and an adhesion layer overlaid on a back face side of the base, in which the grinding grains are diamond grinding grains, a wear quantity of the grinding layer as determined by a Taber abrasion test is no less than 0.03 g and no greater than 0.18 g, and, an Asker D hardness measured from a front face side of the grinding layer is no less than 80° and no greater than 98°.

Abstract: It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 ?m and no greater than 70 ?m.

Abstract: Provided is an abrasive film not likely to cause an end face defect of an optical fiber connector due to variation in load conditions during polishing, while providing a great grinding force. The abrasive film comprises a substrate film and an abrasive layer overlaid thereon, the abrasive layer comprising abrasive particles and a binder therefor and a wear quantity of the abrasive layer being from 10 mg to 25 mg. A content of the abrasive particles in the abrasive layer is preferably no less than 85% by mass. The abrasive particles preferably comprise first abrasive particles (primary particle diameter: of no less than 10 nm and less than 50 nm), and second abrasive particles (primary particle diameter: no less than 50 nm and less than 250 nm). An average thickness of the abrasive layer is preferably from 4 ?m to 15 ?m. The abrasive particles are preferably silica particles.

Abstract: An abrasive film capable of preventing an undercut of an optical fiber after polishing, while providing a great grinding force is provided. An abrasive film includes a substrate and an abrasive layer overlaid on a top face side thereof, the abrasive layer including a resin binder and abrasive particles dispersed in the resin binder; the content of abrasive particles having a primary particle size of no less than 70 nm being no less than 10% by mass and no greater than 50% by mass with respect to the total abrasive particles; the content of the abrasive particles in the abrasive layer being no less than 84% by mass; and the indentation hardness of the abrasive layer being no greater than 370 N/mm2. The abrasive particles are preferably silica particles. An average thickness of the abrasive layer is preferably no less than 4 ?m and no greater than 15 ?m.

Abstract: The present invention provides a polishing film with which, even when water containing impurity ions is used as a polishing liquid, the abrasive particles comprising SiO2 are less apt to adhere to the polished surface, e.g., the polished surface of an end of an optical fiber itself, and which is less apt to cause the optical loss attributable to scratches or edge chips in the polished surface. The polishing film hence renders good finish-polishing quality possible. This polishing film is characterized by comprising a substrate and an abrasive layer which has been disposed on a surface of the substrate and which comprises abrasive particles comprising SiO2, a binder resin, and an adhesion inhibitor containing a phosphorus compound.