Abstract: A deposition device includes: a cooling unit that cools workpieces; a rotating table main body that rotates around a vertical axis, this rotating table main body having a cooling unit placement portion on which the cooling unit is placed and workpiece placement portions which are arranged so as to surround the periphery of the cooling unit placement portion and on which the workpieces are placed respectively; a lifting mechanism that lifts and lowers the cooling unit, inside the space, between a first position in which the cooling unit is placed on the rotating table main body and a second position in which the cooling unit is spaced upward from the rotating table main body and faces side surfaces of the workpieces placed on the workpiece placement portions; and refrigerant piping attached to the chamber and detachably connected to the cooling unit to supply the refrigerant to the cooling unit.

Abstract: A heat treatment apparatus includes: a plurality of rollers guiding a substrate, each of the rollers having a roller width greater than a substrate width; a heater including a heating surface which has a width greater than the substrate width; and a heat shield member arranged between a heating surface exposed portion of the heating surface, which is exposed while protruding from an end of the substrate in a width direction of the substrate along the width direction and a roller exposed portion of the specific roller included in the plurality of rollers, the roller exposed portion being exposed while protruding from the end of the substrate in the width direction to the same direction in which the heating surface exposed portion protrudes, the heat shield member shielding heat radiation from the heating surface exposed portion to an outer circumferential surface of the roller exposed portion.

Abstract: A heat treatment apparatus includes: a plurality of rollers guiding a substrate, each of the rollers having a roller width greater than a substrate width; a heater including a heating surface which has a width greater than the substrate width; and a heat shield member arranged between a heating surface exposed portion of the heating surface, which is exposed while protruding from an end of the substrate in a width direction of the substrate along the width direction and a roller exposed portion of the specific roller included in the plurality of rollers, the roller exposed portion being exposed while protruding from the end of the substrate in the width direction to the same direction in which the heating surface exposed portion protrudes, the heat shield member shielding heat radiation from the heating surface exposed portion to an outer circumferential surface of the roller exposed portion.

Abstract: Provided is a deposition device which can secure work space without vertical overlap of the deposition unit and the units upstream and downstream thereof. This deposition device is provided with a deposition unit (16), and upstream and downstream units (14, 18) arranged to the left and right thereof.

Abstract: A deposition device includes: a cooling unit that cools workpieces; a rotating table main body that rotates around a vertical axis, this rotating table main body having a cooling unit placement portion on which the cooling unit is placed and workpiece placement portions which are arranged so as to surround the periphery of the cooling unit placement portion and on which the workpieces are placed respectively; a lifting mechanism that lifts and lowers the cooling unit, inside the space, between a first position in which the cooling unit is placed on the rotating table main body and a second position in which the cooling unit is spaced upward from the rotating table main body and faces side surfaces of the workpieces placed on the workpiece placement portions; and refrigerant piping attached to the chamber and detachably connected to the cooling unit to supply the refrigerant to the cooling unit.

Abstract: A degassing device, allowing efficient maintenance and including upper and lower rollers which advance a film-forming material in an advancement direction while vertically conveying the same, a plate heater arranged adjacently to the film-forming material moving back and forth between the rollers, and a chamber including an outer wall. The outer wall includes a front wall and a rear wall each including an upper roller support unit and a lower roller support unit. In at least one of the front wall and the rear wall, a between-roller opening is formed in the region between the upper roller support unit and the lower roller support unit, and the between-roller openings have a shape cutting across the moving film-forming material and the plate heater in the advancement direction.

Abstract: The disclosed plasma CVD apparatus (1) is provided with a vacuum chamber (3); a pair of deposition rollers (2, 2) disposed within the vacuum chamber (3) that are connected to both poles of an AC power supply and around which a substrate (W) is wound; a gas-supplying device (5) that supplies process gas containing a source gas to a deposition zone (D) which is a portion of or all of the region that is on one side of a line linking the centers of rotation of the pair of deposition rollers (2, 2); and a magnetic-field-generating device (7) that, by means of the AC power supply being applied to each of the deposition rollers (2, 2), forms a magnetic field that causes the source gas in a predetermined region to become plasma. The magnetic-field-generating device (7) causes the source gas in the region adjacent to the surface of the portion of the pair of deposition rollers (2, 2) located within the deposition zone (D) to become plasma, forming a plasma region (P).

Abstract: Provided is a continuous deposition apparatus wherein replacement operations of a feeding unit and a take-up unit are easily performed. The continuous deposition apparatus is provided with: a vacuum chamber (1); a deposition roller (2); evaporation sources (7L1, 7L2, 7R) which supply a deposition material to a film substrate from the side of the film substrate which is wound on the deposition roller and on which a coating is to be deposited; a feeding unit (3) which supplies the film substrate to the deposition roller (2); and a take-up unit (4) which takes up the film substrate after the coating is deposited thereon.

Abstract: A CVD apparatus (1) is provided with: a plurality of deposition chamber units (6) which each comprise a deposition roller (2, 2) connected to a plasma power source and a unit chamber for deposition (60) housing the deposition roller (2, 2), and are disposed such that the deposition rollers (2, 2) form a line in a horizontal direction; and a connection chamber unit (7) which comprises a unit chamber for connection (70) coupled to the unit chamber for deposition (60) of the deposition chamber unit (6) and interposed between the adjacent deposition chamber units (6) to connect the deposition chamber units (6). A substrate (W) is transferred while being rolled around the respective deposition rollers (2, 2) of the respective deposition chamber units (6), and the deposition chamber units (6) decompose source gas by plasma generated near the deposition rollers (2, 2) by application of voltage to the deposition rollers (2, 2) to perform deposition processing on the substrate on the deposition rollers (2, 2).

Abstract: The disclosed plasma CVD apparatus (1) is provided with a vacuum chamber (3); a pair of deposition rollers (2, 2) disposed within the vacuum chamber (3) that are connected to both poles of an AC power supply and around which a substrate (W) is wound; a gas-supplying device (5) that supplies process gas containing a source gas to a deposition zone (D) which is a portion of or all of the region that is on one side of a line linking the centers of rotation of the pair of deposition rollers (2, 2); and a magnetic-field-generating device (7) that, by means of the AC power supply being applied to each of the deposition rollers (2, 2), forms a magnetic field that causes the source gas in a predetermined region to become plasma. The magnetic-field-generating device (7) causes the source gas in the region adjacent to the surface of the portion of the pair of deposition rollers (2, 2) located within the deposition zone (D) to become plasma, forming a plasma region (P).

Abstract: Provided is a continuous deposition apparatus wherein replacement operations of a feeding unit and a take-up unit are easily performed. The continuous deposition apparatus is provided with: a vacuum chamber (1); a deposition roller (2); evaporation sources (7L1, 7L2, 7R) which supply a deposition material to a film substrate from the side of the film substrate which is wound on the deposition roller and on which a coating is to be deposited; a feeding unit (3) which supplies the film substrate to the deposition roller (2); and a take-up unit (4) which takes up the film substrate after the coating is deposited thereon.