Patents by Inventor Toshimitsu Nagao

Toshimitsu Nagao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating film and plating film production method
    Patent number: 11912612
    Abstract: The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: February 27, 2024
    Assignees: OKUNO CHEMICAL INDUSTRIES CO., LTD., PANASONIC HOLDINGS CORPORATION
    Inventors: Mayu Tsukuda, Toshimitsu Nagao, Junichi Katayama, Kazuya Shimada, Masahito Hayamizu, Toshihiko Sakata, Shuhei Fuku, Asuka Hirooka
  • PLATING FILM AND PLATING FILM PRODUCTION METHOD
    Publication number: 20230391664
    Abstract: The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Applicants: OKUNO CHEMICAL INDUSTRIES CO., LTD., PANASONIC HOLDINGS CORPORATION
    Inventors: Mayu Tsukuda, Toshimitsu Nagao, Junichi Katayama, Kazuya Shimada, Masahito Hayamizu, Toshihiko Sakata, Shuhei Fuku, Asuka Hirooka
  • COPPER-TIN ALLOY PLATING BATH
    Publication number: 20170204528
    Abstract: An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1): R—(CH2)l—S—(CH2)m—S—(CH2)n—R??(1), wherein R is H, OH, or SO3Na, and l, m, and n are each independently an integer of 0 to 3, and a hydroxyl group-containing aromatic compound.
    Type: Application
    Filed: July 28, 2015
    Publication date: July 20, 2017
    Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Takamitsu Tsujimoto, Toshimitsu Nagao, Kenji Hara, Junichi Katayama, Kuniaki Otsuka
  • MULTILAYER PLATING FILM AND ARTICLE HAVING MULTILAYER PLATING FILM
    Publication number: 20170114470
    Abstract: An object of the present invention is to provide multilayer plating film with excellent corrosion resistance. The present invention provides a multilayer plating film containing at least a chrome plating film and a tin-nickel plating film, the chrome plating film being the outermost layer, and the tin-nickel plating film being formed below the chrome plating film by using an acidic tin-nickel alloy plating solution containing a divalent tin compound, a nickel compound, a triamine compound, and a fluoride.
    Type: Application
    Filed: June 16, 2015
    Publication date: April 27, 2017
    Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Toshimitsu Nagao, Takamitsu Tsujimoto, Kenji Hara, Junichi Katayama, Kuniaki Otsuka
  • PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT
    Publication number: 20100155255
    Abstract: The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.
    Type: Application
    Filed: May 16, 2008
    Publication date: June 24, 2010
    Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD.
    Inventors: Toshimitsu Nagao, Yusuke Yoshikane, Junji Yoshikawa, Toru Morimoto, Toshiya Murata, Kazuya Satou