Patents by Inventor Toshimitsu Takeda
Toshimitsu Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932021Abstract: A recording apparatus includes a tank including a chamber configured to store liquid to be supplied to a recording head that ejects the liquid and a filling port from which the liquid is injected into the chamber, and an injection auxiliary member configured to assist injecting of the liquid into the chamber from the filling port, the injection auxiliary member including a first and a second flow channels each defined by a first or a second upper end portion that opens toward outside of the tank and a first or a second lower end portion that opens toward inside of the tank, wherein the second flow channel has an expansion portion arranged in a middle portion between the second upper end portion and the second lower end portion and configured to form a step to expand a cross-sectional area.Type: GrantFiled: December 20, 2022Date of Patent: March 19, 2024Assignee: Canon Kabushiki KaishaInventors: Yusuke Naratani, Koya Iwakura, Hideaki Matsumura, Tetsu Hamano, Nobuhiro Toki, Daiju Takeda, Fumie Kameyama, Koki Shimada, Shota Asada, Ken Takenaga, Yusuke Tanaka, Yuta Araki, Taiji Maruyama, Atsushi Matsuyama, Kousuke Tanaka, Toshimitsu Takahashi, Nanae Uchinuno
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Patent number: 9903538Abstract: A connector capable of easily holding, and establishing electrical connection of, an LED module substrate and achieving highly-reliable electrical connection is provided. The connector for holding, and establishing electrical connection of, an LED module substrate includes: a lower cover member for placing the LED module substrate thereon; and an upper cover member pivotally attached to an end of the lower cover member. The upper cover member includes a feeding connection terminal configured to be elastically in contact with a feeding pad provided in the LED module substrate. When the upper cover member is closed relative to the lower cover member with a pivotal movement, the connection terminal elastically connects with a surface of the feeding pad while sliding thereon.Type: GrantFiled: March 18, 2016Date of Patent: February 27, 2018Assignee: SMK CorporationInventors: Toshimitsu Takeda, Katsuhiro Kinoshita
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Publication number: 20170102115Abstract: A connector capable of easily holding, and establishing electrical connection of, an LED module substrate and achieving highly-reliable electrical connection is provided. The connector for holding, and establishing electrical connection of, an LED module substrate includes: a lower cover member for placing the LED module substrate thereon; and an upper cover member pivotally attached to an end of the lower cover member. The upper cover member includes a feeding connection terminal configured to be elastically in contact with a feeding pad provided in the LED module substrate. When the upper cover member is closed relative to the lower cover member with a pivotal movement, the connection terminal elastically connects with a surface of the feeding pad while sliding thereon.Type: ApplicationFiled: March 18, 2016Publication date: April 13, 2017Inventors: Toshimitsu TAKEDA, Katsuhiro KINOSHITA
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Publication number: 20140179139Abstract: There is provided a connector for an LED module board excellent in assembly, heat dissipation and insulation. The connector for an LED module board for holding and electrically connecting the LED module board includes: a lower cover member on which the LED module board is placed; and an upper cover member having a connection terminal brought into elastic contact with a power supply pad included in the LED module board, wherein at least a portion of the lower cover member at a position of a bottom face of the LED module board is made of a thermally-conductive and insulating material, the upper cover member is structured so that light emitted from the LED module board is directed outward, and the upper cover member is engaged with the lower cover member in a state in which the LED module board is placed on the lower cover member.Type: ApplicationFiled: July 11, 2013Publication date: June 26, 2014Inventors: Katsuyoshi Tanaka, Toshimitsu Takeda
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Patent number: 6936676Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at ? position and a polyamine having at least two amino groups within its molecule wherein ? position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room tType: GrantFiled: November 24, 2003Date of Patent: August 30, 2005Assignee: Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20040192873Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: ApplicationFiled: April 13, 2004Publication date: September 30, 2004Applicant: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Patent number: 6756466Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: GrantFiled: November 12, 2002Date of Patent: June 29, 2004Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20040106766Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at a position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, roType: ApplicationFiled: November 24, 2003Publication date: June 3, 2004Applicant: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Publication number: 20030139559Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: ApplicationFiled: November 12, 2002Publication date: July 24, 2003Applicant: THE YOKOHAMA RUBBER CO., LTD.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Patent number: 6525159Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-partType: GrantFiled: March 30, 1999Date of Patent: February 25, 2003Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
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Patent number: 5747627Abstract: A room temperature curing polyurethane composition comprises a polyisocyanate compound or polyurethane prepolymer (A), an oxazolidine compound (B) having at least one oxazolidine ring, a compound (C) for accelerating the opening of the oxazolidine ring, and optionally a modified carbodiimide (D). The inventive polyurethane composition excels in storage stability and freedom of foaming when curing.Type: GrantFiled: August 19, 1996Date of Patent: May 5, 1998Assignee: The Yokohama Rubber Co., Ltd.Inventors: Kazushi Kimura, Toshimitsu Takeda, Hiroyuki Hosoda, Kazunori Ishikawa, Hiroyuki Okuhira
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Patent number: D744425Type: GrantFiled: February 3, 2014Date of Patent: December 1, 2015Assignee: SMK CorporationInventor: Toshimitsu Takeda
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Patent number: D749518Type: GrantFiled: July 9, 2015Date of Patent: February 16, 2016Assignee: SMK CORPORATIONInventor: Toshimitsu Takeda
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Patent number: D753592Type: GrantFiled: February 5, 2014Date of Patent: April 12, 2016Assignee: SMK CORPORATIONInventor: Toshimitsu Takeda
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Patent number: D764414Type: GrantFiled: April 7, 2014Date of Patent: August 23, 2016Assignee: SMK CorporationInventor: Toshimitsu Takeda
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Patent number: D816036Type: GrantFiled: December 28, 2015Date of Patent: April 24, 2018Assignee: SMK CorporationInventors: Toshimitsu Takeda, Katsuhiro Kinoshita