Patents by Inventor Toshimitsu Takeda

Toshimitsu Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932021
    Abstract: A recording apparatus includes a tank including a chamber configured to store liquid to be supplied to a recording head that ejects the liquid and a filling port from which the liquid is injected into the chamber, and an injection auxiliary member configured to assist injecting of the liquid into the chamber from the filling port, the injection auxiliary member including a first and a second flow channels each defined by a first or a second upper end portion that opens toward outside of the tank and a first or a second lower end portion that opens toward inside of the tank, wherein the second flow channel has an expansion portion arranged in a middle portion between the second upper end portion and the second lower end portion and configured to form a step to expand a cross-sectional area.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: March 19, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yusuke Naratani, Koya Iwakura, Hideaki Matsumura, Tetsu Hamano, Nobuhiro Toki, Daiju Takeda, Fumie Kameyama, Koki Shimada, Shota Asada, Ken Takenaga, Yusuke Tanaka, Yuta Araki, Taiji Maruyama, Atsushi Matsuyama, Kousuke Tanaka, Toshimitsu Takahashi, Nanae Uchinuno
  • Patent number: 9903538
    Abstract: A connector capable of easily holding, and establishing electrical connection of, an LED module substrate and achieving highly-reliable electrical connection is provided. The connector for holding, and establishing electrical connection of, an LED module substrate includes: a lower cover member for placing the LED module substrate thereon; and an upper cover member pivotally attached to an end of the lower cover member. The upper cover member includes a feeding connection terminal configured to be elastically in contact with a feeding pad provided in the LED module substrate. When the upper cover member is closed relative to the lower cover member with a pivotal movement, the connection terminal elastically connects with a surface of the feeding pad while sliding thereon.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: February 27, 2018
    Assignee: SMK Corporation
    Inventors: Toshimitsu Takeda, Katsuhiro Kinoshita
  • Publication number: 20170102115
    Abstract: A connector capable of easily holding, and establishing electrical connection of, an LED module substrate and achieving highly-reliable electrical connection is provided. The connector for holding, and establishing electrical connection of, an LED module substrate includes: a lower cover member for placing the LED module substrate thereon; and an upper cover member pivotally attached to an end of the lower cover member. The upper cover member includes a feeding connection terminal configured to be elastically in contact with a feeding pad provided in the LED module substrate. When the upper cover member is closed relative to the lower cover member with a pivotal movement, the connection terminal elastically connects with a surface of the feeding pad while sliding thereon.
    Type: Application
    Filed: March 18, 2016
    Publication date: April 13, 2017
    Inventors: Toshimitsu TAKEDA, Katsuhiro KINOSHITA
  • Publication number: 20140179139
    Abstract: There is provided a connector for an LED module board excellent in assembly, heat dissipation and insulation. The connector for an LED module board for holding and electrically connecting the LED module board includes: a lower cover member on which the LED module board is placed; and an upper cover member having a connection terminal brought into elastic contact with a power supply pad included in the LED module board, wherein at least a portion of the lower cover member at a position of a bottom face of the LED module board is made of a thermally-conductive and insulating material, the upper cover member is structured so that light emitted from the LED module board is directed outward, and the upper cover member is engaged with the lower cover member in a state in which the LED module board is placed on the lower cover member.
    Type: Application
    Filed: July 11, 2013
    Publication date: June 26, 2014
    Inventors: Katsuyoshi Tanaka, Toshimitsu Takeda
  • Patent number: 6936676
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at ? position and a polyamine having at least two amino groups within its molecule wherein ? position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room t
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: August 30, 2005
    Assignee: Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • Publication number: 20040192873
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Application
    Filed: April 13, 2004
    Publication date: September 30, 2004
    Applicant: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • Patent number: 6756466
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: June 29, 2004
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • Publication number: 20040106766
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at a position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, ro
    Type: Application
    Filed: November 24, 2003
    Publication date: June 3, 2004
    Applicant: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • Publication number: 20030139559
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Application
    Filed: November 12, 2002
    Publication date: July 24, 2003
    Applicant: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • Patent number: 6525159
    Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at &agr; position and a polyamine having at least two amino groups within its molecule wherein &agr; position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: February 25, 2003
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hiroyuki Okuhira, Naoya Adachi, Kazunori Ishikawa, Toshimitsu Takeda, Yo Kotani
  • Patent number: 5747627
    Abstract: A room temperature curing polyurethane composition comprises a polyisocyanate compound or polyurethane prepolymer (A), an oxazolidine compound (B) having at least one oxazolidine ring, a compound (C) for accelerating the opening of the oxazolidine ring, and optionally a modified carbodiimide (D). The inventive polyurethane composition excels in storage stability and freedom of foaming when curing.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: May 5, 1998
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Kazushi Kimura, Toshimitsu Takeda, Hiroyuki Hosoda, Kazunori Ishikawa, Hiroyuki Okuhira
  • Patent number: D744425
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: December 1, 2015
    Assignee: SMK Corporation
    Inventor: Toshimitsu Takeda
  • Patent number: D749518
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: February 16, 2016
    Assignee: SMK CORPORATION
    Inventor: Toshimitsu Takeda
  • Patent number: D753592
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: April 12, 2016
    Assignee: SMK CORPORATION
    Inventor: Toshimitsu Takeda
  • Patent number: D764414
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: August 23, 2016
    Assignee: SMK Corporation
    Inventor: Toshimitsu Takeda
  • Patent number: D816036
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: April 24, 2018
    Assignee: SMK Corporation
    Inventors: Toshimitsu Takeda, Katsuhiro Kinoshita