Patents by Inventor Toshinao Okitsu

Toshinao Okitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5310830
    Abstract: Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: May 10, 1994
    Assignee: Konishi Co., Ltd.
    Inventors: Toshinao Okitsu, Shinichi Sato
  • Patent number: 4431757
    Abstract: The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or synthetic resin emulsion to the aqueous solution of the high polymer. The solution B is an aqueous solution of a dialdehyde compound, or an aqueous solution or dispersion obtained by adding a crosslinking agent for crosslinking the high polymer of the solution A to the aqueous solution of the dialdehyde compound.
    Type: Grant
    Filed: July 19, 1982
    Date of Patent: February 14, 1984
    Assignee: Konishi Co., Ltd.
    Inventors: Toshinao Okitsu, Tomio Uchida
  • Patent number: 4075830
    Abstract: An adhesive composition which is in a wax-like or jelly-like state at room temperature comprising:(a) a water soluble or water dispersible polymer having adhesive properties;(b) an N-fatty acid acylated amino acid or a salt thereof; and(c) water or a mixture of water and one or more organic solvent(s) and/or plasticizer(s).
    Type: Grant
    Filed: April 26, 1976
    Date of Patent: February 28, 1978
    Assignee: Konishi Co., Ltd.
    Inventors: Shigeru Nagasawa, Toshinao Okitsu
  • Patent number: 4073756
    Abstract: An adhesive composition which is in a wax-like or jelly-like state at room temperature comprising:(a) an N-fatty acid acylated amino acid or an alkali metal salt, ammonium salt or amine salt of the acid;(b) a compound having in its molecule a polyoxyalkylene structure containing at least four oxyalkylene units;(c) a water soluble or water dispersible polymer having adhesive properties; and(d) water or a mixture of water and one or more organic solvent(s) and/or one or more plasticizer(s).
    Type: Grant
    Filed: April 26, 1976
    Date of Patent: February 14, 1978
    Assignee: Konishi Co., Ltd.
    Inventors: Yoshihiko Yotsuyanagi, Naganori Araki, Shigeru Nagasawa, Toshinao Okitsu