Patents by Inventor Toshinobu Takahashi

Toshinobu Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive of epoxy resin, CTBN and maleimide
    Patent number: 5292812
    Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.
    Type: Grant
    Filed: March 17, 1993
    Date of Patent: March 8, 1994
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi, Naoya Adachi
  • Process for producing printed wiring boards
    Patent number: 5153987
    Abstract: By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.
    Type: Grant
    Filed: April 10, 1989
    Date of Patent: October 13, 1992
    Assignees: Hitachi Chemical Company, Ltd., Hitachi, Condenser Co., Ltd., Yokohama Rubber Company Limited
    Inventors: Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshiro Okamura, Naoki Fukutomi, Hiroyoshi Yokoyama, Hideo Watanabe, Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi
  • Corrosion preventive resin composition
    Patent number: 4582889
    Abstract: There is disclosed a corrosion preventive resin composition comprising an epoxy resin and at least one curing agent therefor. The epoxy resin comprises at least 40 wt % of a specific type of urethane-modified epoxy resin which is obtained by reaction between a compound having at least one epoxy group and at least one hydroxyl group and a urethane bond-bearing compound having isocyanate end groups and obtained by reaction between a polyhydroxyl compound and a polyisocyanate compound. The curing agent for the epoxy resin is at least one member selected from the group consisting of polyamines, polyamides and polymercaptans, all of which are sparingly soluble in water.
    Type: Grant
    Filed: May 31, 1985
    Date of Patent: April 15, 1986
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Kiyonaga Yamaguchi, Toshinobu Takahashi, Shigeo Omote, Mimuo Kawaguchi