Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Abstract: There is provided a semiconductor laser element which can change band gap wavelengths without change of composition of a multiple quantum well active layer and a method for fabricating a semiconductor laser module. In the method for fabricating a semiconductor laser element wherein a multiple quantum well active layer is formed on a semiconductor substrate with a crystal growth method, an insulation film is formed at the upper part of the multiple quantum well active layer, an electrode film is moreover formed on the insulation film and at least a part of the electrode film is electrically connected to the multiple quantum well active layer, distortion of the multiple quantum well active layer is controlled in the semiconductor laser element fabrication process after the process of the crystal growth method.

Abstract: A semiconductor laser device which ensures high yield, high reliability and high power output by reduction in tensile strain in its active region for improvement in the COD level. The device comprises: a semiconductor crystal-growing portion having an active layer for conversion of electric energy into light energy and a mesa structure protruding on the one side; and an electrode film which is electrically connected with the top face of the mesa structure. The electrode film has a tensile strain and stretches sideward from the mesa structure. In the device, there is a strain control film which is polymerized with the electrode film part stretching sideward from the mesa structure and has a compressive stress.

Abstract: The present invention is to reduce the package cost and secure the high reliability in an optical module having an optical device and an optical fiber.

Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Abstract: There is provided a semiconductor laser element which can change band gap wavelengths without change of composition of a multiple quantum well active layer and a method for fabricating a semiconductor laser module. In the method for fabricating a semiconductor laser element wherein a multiple quantum well active layer is formed on a semiconductor substrate with a crystal growth method, an insulation film is formed at the upper part of the multiple quantum well active layer, an electrode film is moreover formed on the insulation film and at least a part of the electrode film is electrically connected to the multiple quantum well active layer, distortion of the multiple quantum well active layer is controlled in the semiconductor laser element fabrication process after the process of the crystal growth method.

Abstract: In a module for optical communication comprising an optical fiber including an axial-end surface, and an optical element including an optical surface facing to the axial-end surface in such a manner that a light is transmitted between the optical surface and the axial-end surface, a synthetic resin is arranged between the optical surface and the axial-end surface so that the light is transmitted through the synthetic resin between the optical surface and the axial-end surface.

Abstract: An optical module shown in FIG. 2 is disclosed having following components. (1) A substrate on which optical parts and an optical fiber are mounted. An optical fiber is fixed in the V-groove formed on the substrate so that the optic axis of the optical parts and the fiber is adjusted. (2) A bottom plastic package having a concave surface for the substrate mounted thereon and several leads pins being fixed to the first plastic package. (3) A upper plastic package for sealing optical parts and the fiber being fixed to the bottom plastic package, the outer surface of the upper plastic package being plated by metal, and the upper plastic package and at least one of the lead pins conducted. According to this, it is possible to provide optical transmission module or optical module having advantage of capable of using plastic package and electromagnetic interference free with simplified structure.

Abstract: A semiconductor laser device which ensures high yield, high reliability and high power output by reduction in tensile strain in its active region for improvement in the COD level. The device comprises: a semiconductor crystal-growing portion having an active layer for conversion of electric energy into light energy and a mesa structure protruding on the one side; and an electrode film which is electrically connected with the top face of the mesa structure. The electrode film has a tensile strain and stretches sideward from the mesa structure. In the device, there is a strain control film which is polymerized with the electrode film part stretching sideward from the mesa structure and has a compressive stress.

Abstract: The present invention is to reduce the package cost and secure the high reliability in an optical module having an optical device and an optical fiber.

Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Abstract: In a module for optical communication comprising an optical fiber including an axial-end surface, and an optical element including an optical surface facing to the axial-end surface in such a manner that a light is transmitted between the optical surface and the axial-end surface,

Abstract: An optical transmission module or an optical module has a receptacle attached adjacent to an optical component module or package, and a plug configured to connect vertically with the receptacle from above the module. The outer peripheral shape of the housing is designed to fit within an area of the receptacle that faces upwardly to receive the plug in an insertion direction extending vertically downwardly. In the housing of the plug, a ferrule is attached to an end of an optical fiber and a sleeve covers the optical fiber and the ferrule. A knob is used for moving the optical fiber, the sleeve and the ferrule in the lightwave propagation direction, which is transverse to the plug insertion direction.

Abstract: A module for optical communication includes an optical fiber having an axial-end surface and an optical element having an optical surface facing the axial-end surface in such a manner that light is transmitted between the optical surface and the axial-end surface. The optical surface defines a first plane that is not perpendicular to the longitudinal axis of the optical fiber. A synthetic resin is provided between the optical surface of the optical element and the axial-end surface of the optical fiber so that light is transmitted through the synthetic resin.

Abstract: An optical transmission module or an optical module has a receptacle attached adjacent to an optical component module or package, and a plug configured to connect vertically with the receptacle from above the module. The outer peripheral shape of the housing is designed to fit within an area of the receptacle that faces upwardly to receive the plug in an insertion direction extending vertically downwardly. In the housing of the plug, a ferrule is attached to an end of an optical fiber and a sleeve covers the optical fiber and the ferrule. A knob is used for moving the optical fiber, the sleeve and the ferrule in the lightwave propagation direction, which is transverse to the plug insertion direction. Before connecting the plug, the knob is retracted to pull the ferrule and the sleeve within the plug housing.

Abstract: An optical transmission module or an optical module has a receptacle attached adjacent to an optical component module or package, and a plug configured to connect vertically with the receptacle from above the module. The outer peripheral shape of the housing is designed to fit within an area of the receptacle that faces upwardly to receive the plug in an insertion direction extending vertically downwardly. In the housing of the plug, a ferrule is attached to an end of an optical fiber and a sleeve covers the optical fiber and the ferrule. A knob is used for moving the optical fiber, the sleeve and the ferrule in the lightwave propagation direction, which is transverse to the plug insertion direction. Before connecting the plug, the knob is retracted to pull the ferrule and the sleeve within the plug housing.

Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Abstract: The present invention is to reduce the package cost and secure the high reliability in an optical module having an optical device and an optical fiber.

Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.

Abstract: In order to position an optical semiconductor chip with high accuracy and without adjustment, a recess for controlling the displacement of the optical semiconductor chip is formed in a position in which the optical semiconductor chip on an optical element mounting substrate having an optical waveguide formed in the surface thereof is fixed.