Abstract: Louver segments of a heat transfer fin each have a longitudinal central portion disposed at the center of the louver segment in a direction crossing the flow of a fluid and longitudinal end portions each disposed on either side of the longitudinal central portion and sectioned into parts. Each louver segment has a configuration such that an area of the longitudinal central portion projected in the direction of the flow of the fluid is larger than an area of each of the longitudinal end portions projected in the direction of the flow of the fluid, with respect to the same width of the passage of the fluid.

Abstract: A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

Abstract: In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40.degree. C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50.degree. to 60.degree. C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.

Abstract: A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

Abstract: An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

Abstract: A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid.

Abstract: A double effect air cooled absorption refrigerating machine consisting of fans provided on one side frame member out of the upper, lower and four side frame members which constitute a frame of a machine body, an air cooled heat exchanger provided on the remaining three side frame members and composed of an air cooled absorber and an air cooled condenser, and an evaporator, a high-temperature regenerator, a low-temperature regenerator, a solution heat exchanger and some other parts, all of which are provided on the inner side so as to be surrounded by the side frame members, the machine having a small installation area.

Abstract: The present invention relates to a louvered heat transfer fin in which the air-passing resistance of the louver is varied so as to increase the overall heat exchange quantity, and thereby to greatly enhance the heat transfer performance of the fin. The arrangement of each louver is such that the projection area in the vicinity of the longitudinal central portion of the louver projected in the direction in which air passes is larger than the projection area of each of the longitudinal end sides of the louver projected in the same direction.

Abstract: A heat exchanger, e.g. that used in an air-conditioner, having a plurality of spaced plate-fins with narrow distance in parallel and a plurality of heat transfer pipes passing through said fins, said fins being coated with an aqueous coating composition comprising 100 parts by weight of a resin composition for water paint in solids content, 5 to 95 parts by weight of a surface active agent and 5 to 65 parts by weight of synthetic silica and baked at a temperature of 120.degree. C. to 200.degree. C. for 10 to 40 minutes to give a coating film of 3 to 20 .mu.m, has excellent hardness and corrosion resistance without damaging hydrophilic properties.

Abstract: An expansion valve has a refrigerant inlet passage, a refrigerant outlet passage, a valve chest to which both the passages open, a diaphragm chamber communicating with a heat-sensitive bulb through a tube of small diameter, and a valve body actuated in response to the operation of a diaphragm, the valve body being disposed facing a valve seat in the valve chest to regulate a passage defined between the valve seat and the valve body, to thereby control the flow rate of a refrigerant. The valve seat is adapted to be axially movable along the inner wall of the valve chest. In addition, means are provided for moving the valve seat in accordance with a change in pressure in the refrigerant circuit.

Abstract: In a cross finned tube heat exchanger including a multiplicity of side-by-side fin plates, and a plurality of heat transfer tubes extending through the fin plates at least in one row to provide a serpentine flow passage for a heat transfer medium which exchanges heat with another heat transfer medium flowing across the surfaces of the fin plates, a multiplicity of stepped louvers are formed on the wall of each fin plate between the adjacent heat transfer tubes of the same row. The stepped louvers each extending in a direction at right angles to the direction of air flow across the surfaces of the fin plates include at least one tilting rise wall and may differ from one another in shape depending on their positions. The stepped louvers on each fin plate may be arranged in the form of waves or uniform in height with respect to the direction in which each fin plate extends. The adjacent stepped louvers have edges varying in vertical positions.

Abstract: A cross-fin tube type heat exchanger having a large number of parallel fins and a plurality of heat transfer tubes extended through and fixed to the fins, so that heat may be exchanged between a first heat exchanging medium flowing through the heat transfer tubes and a second heat exchanging medium flowing along the surfaces of the fin, across the walls of the heat transfer tubes and through the fins. In the portions of each fin between adjacent heat transfer tubes of the same row, formed are a number of slits perpendicular to the direction of flow of the second heat exchanging medium. Each elongated section defined between each pair of adjacent slits is bent along its breadthwise bisector line and is raised in the form of a bridge to constitute an upwardly convexed louver element. The upwardly convexed louver element may have a cross section with an obtuse apex angle, or may have an arcuate cross section.