Abstract: A board comprising a frame comprised of a thermoplastic resin in which an insert part is embedded and metallized over the entire surface by a metal film. In particular, a method of embedding an insert part, while preventing the metal film from being depositing on the female screw in the insert part, a first aspect of which, at first, forming a metal film on the entire surface of the frame including a through hole in the frame, then press fitting the insert part into the through hole. In the second aspect, before the frame in, which the insert part is held, is formed with the metal film, a masking member that covers the entire surface of the female screw of the insert part is attached.

Abstract: An information processing device including a personal authentication function by reading a fingerprint. The device has a detection structure having an improved detection function. The information processing device (mobile telephone device 2) has a fingerprint read function and a case (4) having a window (20), a fingerprint sensor (22) arranged in the case and having a sensor surface (24) exposed to the window, and a frame (electrode 42) arranged inside or on the case and forming an opening (50) for exposing the sensor surface of the fingerprint sensor from the window, so that the frame is in contact with a finger through the window of the case.

Abstract: An information processing device including a personal authentication function by reading a fingerprint. The device has a detection structure having an improved detection function. The information processing device (mobile telephone device 2) has a fingerprint read function and a case (4) having a window (20), a fingerprint sensor (22) arranged in the case and having a sensor surface (24) exposed to the window, and a frame (electrode 42) arranged inside or on the case and forming an opening (50) for exposing the sensor surface of the fingerprint sensor from the window, so that the frame is in contact with a finger through the window of the case.

Abstract: A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.

Abstract: A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Abstract: A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Abstract: A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.

Abstract: A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.

Abstract: Magnetic recording media comprise a lubricated magnetic recording layer formed on at least one side of a permanent substrate. The magnetic recording layer comprises a contact layer of a polymer material which contains polyvinyl alkyl ether in an amount of from 5 to 30% by weight, based on the total weight of the polymer material, which is impregnated with a lubricant so as to improve the wear durability of the magnetic recording media.