Abstract: A linear motor includes a magnet, a coil, and a jacket having an inside member that is comb-shaped having teeth, extending along a driving direction. The coil is engaged by the teeth of the comb-shaped member. A cooling medium flows through an inside space enclosed by the jacket. Unwanted deformation or breakage of the jacket can be avoided even if the pressure of the cooling medium is enlarged or the thickness of a small-thickness portion of the jacket is made smaller. A higher cooling efficiency is thus attainable by increasing the flow rate of the cooling medium.

Abstract: A simulation apparatus and a simulation method that are inexpensive, can achieve a higher execution speed and can perform simulation without using a peripheral circuit simulator under the same condition as that in the case of incorporating a program in hardware are provided. The simulation apparatus includes a storing portion that stores a program to be debugged containing a control operation of hardware, a debug support function for supporting the control operation and a debug support function management information, a writing portion that writes an instruction for invoking the debug support function into the program to be debugged based on the debug support function management information, an instruction fetching portion that fetches the instruction from the program to be debugged and, if the fetched instruction is the instruction for invoking the debug support function, fetches an instruction from the debug support function, and an instruction executing portion that executes this fetched instruction.

Abstract: A linear motor including a coil and a jacket which covers the coil and allows a cooling medium to be supplied through a space in the jacket. The jacket is made of an insulating material, such as a ceramic material or a high-polymer resinous material. The linear motor can include a reinforcing member in the jacket for strengthening the jacket against the pressure of the cooling medium. Also disclosed are a stage device, an exposure apparatus, and a device producing method using such a linear motor.

Abstract: The present invention reduces crosstalk, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip 1 having a first electrode pad 2 and a first wiring layer 9 in the main surface, and a second semiconductor chip 5 having a second electrode pad 6 and a second wiring layer 10 in the main surface confronting the first semiconductor chip. A bump 4 is provided for electrically coupling the first electrode pad 2 and the second electrode pad 6 together. An insulation layer 8 is disposed between the main surfaces of first semiconductor chip 1 and second semiconductor chip 5. An electro-conductive layer 7 is disposed between the main confronting surfaces of the first semiconductor chip and the second semiconductor chip.

Abstract: A microcomputer chip is formed with a CPU core, a peripheral circuit, a built-in ROM, and a built-in RAM. An emulation functional chip is formed with an emulation control circuit for controlling the whole process of emulation. First electrode pads formed on the functional surface of the microcomputer chip are electrically interconnected to second electrode pads formed on the functional surface of the emulation functional chip with connecting bumps interposed therebetween. The microcomputer chip and the emulation functional chip are modularized using an insulating resin with the first electrode pads being connected to the second electrode pads.

Abstract: The present invention reduces crosstalk noise, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip (1) having a first electrode pad (2) and a first wiring layer (9), and a second semiconductor chip (5) having a second electrode pad (6) and a second wiring layer (10). A bump (4) is provided for electrically coupling the first electrode pad (2) and the second electrode pad (6). An insulation layer 8 is disposed between confronting surfaces of the first semiconductor chip (1) and the second semiconductor chip (5). An electro-conductive layer (7) is disposed between the confronting surfaces of the first semiconductor chip and the second semiconductor chip.

Abstract: A projection exposure apparatus includes a projection lens system for projecting a pattern of an original upon a workpiece, an illumination optical system for illuminating the original with a light having a predetermined central wavelength, and a bandwidth changing arrangement effective to change the bandwidth of the light irradiating the original.

Abstract: An exposure apparatus for exposing a wafer to a circuit pattern formed on a reticle. The exposure apparatus includes a reticle stage for holding the reticle, a wafer stage for holding the wafer, a projection optical system for projecting the image of the circuit pattern onto the wafer, an illumination system for illuminating the reticle, the illumination system having a light source for providing an illumination light beam and optical elements for guiding the illumination light beam along an illumination light path, and a stop disposed in the illumination light path and at a position which is optically conjugate, with respect to the optical elements, with a plane in which the circuit pattern is placed, to intercept a part of the illumination light so that the area of the reticle which is not used for the pattern transfer is shielded from the illumination light without disposing any element in contact with or in the proximity of the reticle.

Abstract: The present invention relates to a plastic molding having satin finish type metallic luster. More particularly, it provides a molding of high accuracy and good appearance. The plastic molding of the present invention is produced by first applying satin finishing to the surface of the molding, providing a conductive coating thereon, applying polishing treatment on the surface of the coating, and forming a metal film thereon by metal plating.