Patents by Inventor Toshio Okuda

Toshio Okuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8796817
    Abstract: A semiconductor device includes a multilayer substrate, a semiconductor element secured to an upper surface of the multilayer substrate, a first metal pattern located on a portion of a lower surface of the multilayer substrate, a dielectric having a higher permittivity than the multilayer substrate and located on the lower surface of the multilayer substrate, and a bottom surface electrode located on a bottom surface of the semiconductor device. The bottom surface electrode, the dielectric, and the first metal pattern together form a bypass capacitor.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: August 5, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Toshio Okuda
  • Publication number: 20140167282
    Abstract: A semiconductor device includes a multilayer substrate, a semiconductor element secured to an upper surface of the multilayer substrate, a first metal pattern located on a portion of a lower surface of the multilayer substrate, a dielectric having a higher permittivity than the multilayer substrate and located on the lower surface of the multilayer substrate, and a bottom surface electrode located on a bottom surface of the semiconductor device. The bottom surface electrode, the dielectric, and the first metal pattern together form a bypass capacitor.
    Type: Application
    Filed: August 26, 2013
    Publication date: June 19, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventor: Toshio Okuda
  • Patent number: 8174323
    Abstract: A high frequency amplifier includes a package substrate, an amplifying active device disposed on a top surface of the package substrate, a transmission line connected to the amplifying active device and transmitting a high frequency signal, a surface mounted device (SMD) component shunt-connected at a first end to the transmission line, a SMD component terminal connected to a second end of the SMD component and partially exposed at a back surface of the package substrate, and an external terminal partially exposed at the back surface of the package substrate and connected to a first end of the transmission line, opposite a second end of the transmission line that is connected to the amplifying active device.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: May 8, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventor: Toshio Okuda
  • Publication number: 20120068773
    Abstract: A high frequency amplifier includes a package substrate, an amplifying active device disposed on a top surface of the package substrate, a transmission line connected to the amplifying active device and transmitting a high frequency signal, a surface mounted device (SMD) component shunt-connected at a first end to the transmission line, a SMD component terminal connected to a second end of the SMD component and partially exposed at a back surface of the package substrate, and an external terminal partially exposed at the back surface of the package substrate and connected to a first end of the transmission line, opposite a second end of the transmission line that is connected to the amplifying active device.
    Type: Application
    Filed: November 23, 2011
    Publication date: March 22, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Toshio Okuda
  • Patent number: 8085094
    Abstract: A high frequency amplifier includes a package substrate, an amplifying active device disposed on a top surface of the package substrate, a transmission line connected to the amplifying active device and transmitting a high frequency signal, a surface mounted device (SMD) component shunt-connected at a first end to the transmission line, a SMD component terminal connected to a second end of the SMD component and partially exposed at a back surface of the package substrate, and an external terminal partially exposed at the back surface of the package substrate and connected to a first end of the transmission line, opposite a second end of the transmission line that is connected to the amplifying active device.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: December 27, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventor: Toshio Okuda
  • Publication number: 20110169576
    Abstract: A high frequency amplifier includes a package substrate, an amplifying active device disposed on a top surface of the package substrate, a transmission line connected to the amplifying active device and transmitting a high frequency signal, a surface mounted device (SMD) component shunt-connected at a first end to the transmission line, a SMD component terminal connected to a second end of the SMD component and partially exposed at a back surface of the package substrate, and an external terminal partially exposed at the back surface of the package substrate and connected to a first end of the transmission line, opposite a second end of the transmission line that is connected to the amplifying active device.
    Type: Application
    Filed: September 1, 2010
    Publication date: July 14, 2011
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Toshio Okuda
  • Patent number: 6683512
    Abstract: A high frequency module according to the present invention comprises a laminate board having a plurality of dielectric layers (11 to 18) stacked one on another, a branch filter circuit (DIP10) for separating a plurality of transceiver systems from each other, switch circuits (SW10, SW20) for switching the respective transceiver systems between transmitter branches (TX) and receiver branches (RX), power amplifiers (AMP10, AMP20) each comprising a matching circuit (MAT10, MAT20) and a high frequency amplification semiconductor device for amplifying a transmission signal having a frequency within a pass band of each of the transmitter branches (TX), and couplers (COP10, COP20) for monitoring outputs.
    Type: Grant
    Filed: June 14, 2002
    Date of Patent: January 27, 2004
    Assignee: Kyocera Corporation
    Inventors: Katsurou Nakamata, Shinji Isoyama, Teruyuki Shimura, Toshio Okuda
  • Publication number: 20020196085
    Abstract: A high frequency module according to the present invention comprises a laminate board having a plurality of dielectric layers (11 to 18) stacked one on another, a branch filter circuit (DIP10) for separating a plurality of transceiver systems from each other, switch circuits (SW10, SW20) for switching the respective transceiver systems between transmitter branches (TX) and receiver branches (RX), power amplifiers (AMP10, AMP20) each comprising a matching circuit (MAT10, MAT20) and a high frequency amplification semiconductor device for amplifying a transmission signal having a frequency within a pass band of each of the transmitter branches (TX), and couplers (COP10, COP20) for monitoring outputs.
    Type: Application
    Filed: June 14, 2002
    Publication date: December 26, 2002
    Applicant: KYOCERA CORPORATION
    Inventors: Katsurou Nakamata, Shinji Isoyama, Teruyuki Shimura, Toshio Okuda
  • Patent number: 6276380
    Abstract: A wind-resistant umbrella. The wind-resistant umbrella includes a holder cord (8) that is arranged offset with the stretcher (3) so that the cord (8) does not contact with the stretcher (3), thus avoiding any friction that may occur on an interface therebetween during the closing or opening of the umbrella. The wind-resistant umbrella includes an upper catch (10) that is selectable from designs that vary in resistance to wind. The wind-resistant umbrella includes a runner (4) having an enlarged pushing body (14) provided with guide grooves (18, 18′) that allow the runner (4) to pass therethrough downwardly along the shaft (1), thereby preventing the runner (4) from hitting against the upper catch (10).
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: August 21, 2001
    Inventor: Toshio Okuda
  • Patent number: 6236266
    Abstract: A bias circuit and bias supply method for a multistage power amplifier including heterojunction bipolar transistors for power amplifying a high frequency signal and suppressing an increase in Rx noise during low power output operation of the multistage power amplifier. The bias circuit outputs a control signal Vapc from an external control circuit to the base of only a first-stage amplifier HBT in the multistage power amplifier. To the base of the second and each later power amplifying stage HBT of the multistage power amplifier, the bias circuit supplies a bias current regulated by voltage stabilizers according to the control signal Vapc.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: May 22, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenichiro Choumei, Kazutomi Mori, Akira Inoue, Toshio Okuda
  • Patent number: 6202661
    Abstract: A windproof umbrella including a tension member formed of resilient material with inner and outer ends of the tension member being bent into hooks for connecting to the associated stay and joint member.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: March 20, 2001
    Inventor: Toshio Okuda
  • Patent number: 5467792
    Abstract: A shortenable umbrella, essentially comprises a strut 2, a stay 3, a link 4, a rod 5, a tension wire 6, a tension link 7, a spoke 8, a rib 9, a first joint member J1 and a second joint member j2 connected each other as shown in FIG. 4 to form one rib assembly of the totally six or eight rib assemblies of a four sectioned shortenable umbrella, characterized by forming two spaced stops (A) and (B) integrally with the rod 5 at the lower edges thereof, disposing a guide ring (R) around the section of the rod 5 defined by the stops and passing the tension wire 6 beneath the groove of the rod 5 through the guide ring (R) to thereby permit the guide ring (R) moving freely along the rod under the action of the tension wire during the closing and opening operations of the umbrella.
    Type: Grant
    Filed: October 12, 1994
    Date of Patent: November 21, 1995
    Inventor: Toshio Okuda
  • Patent number: 4794939
    Abstract: An umbrella in which at least a portion of the cover's peripheral edge is shirred. This shirred edge portion is stretched to a greater length when the umbrella is open and contracted to a lesser length when the umbrella is collapsed, thereby providing a taut appearance to the cover when the umbrella is open in the dome-shaped configuration. This invention is particularly useful when the cover is fabricated from a single piece of material, i.e., when the cover is not comprised of separate gores stitched together.
    Type: Grant
    Filed: May 12, 1987
    Date of Patent: January 3, 1989
    Assignee: `totes`, incorporated
    Inventor: Toshio Okuda
  • Patent number: 4658845
    Abstract: A mounting assembly for attaching an umbrella cover or cloth to the ribs of an umbrella without sewing includes a flattened section integrally formed in the rib near the tip having opposed upper and lower surfaces each formed with a seat, and a throughbore extending between the seats which receives a rivet. A peripheral portion of the umbrella cloth is first inserted through the bore in the flattened section, and then the rivet is inserted into the bore so that the umbrella cloth is clamped between the head of the rivet and the seat in the upper surface. The lower, deformable end portion of the stem of the rivet is thereafter flattened against the seat in the lower surface of the flattened section, with the umbrella cloth interposed therebetween, to securely attach the umbrella cloth to the rib.
    Type: Grant
    Filed: December 24, 1985
    Date of Patent: April 21, 1987
    Assignee: `totes`, incorporated
    Inventor: Toshio Okuda
  • Patent number: 4633894
    Abstract: A system in which an umbrella's cover is connected to a rib tip by clamping (and not tying) the cover to the rib tip. The clamp connector is structured so that the clamping pressure between the umbrella's cover and rib tip is actually increased as the umbrella is opened in response to the cover being drawn taut over the ribs. The clamp connector, in preferred form, includes a ring receivable on a ring seat, the cover being clamped between the ring and ring seat, and the ring seat being receivable on the end of a rib tip.
    Type: Grant
    Filed: October 24, 1984
    Date of Patent: January 6, 1987
    Assignee: `totes`, Incorporated
    Inventor: Toshio Okuda
  • Patent number: 4627455
    Abstract: A rib linkage system of the topless type. A stretcher rib connects the umbrella's runner with each cover rib, a support rib connects the umbrella's ferrule with each stretcher rib, and a control link connects each support rib with its associated cover rib. The connection of the support rib with the stretcher rib is by means of a split or bifurcated brace structure that enhances the stability of the linkage system when the umbrella is full opened. The control link, support rib, stretcher rib, and cover rib all cooperate to define a generally parallelogram configuration beneath the stretcher rib when the umbrella is in between its full opened and full closed positions, and to define a generally triangular configuration when the umbrella is full opened, again to enhance the stability of the linkage system when the umbrella is opened and also to permit the umbrella to collapse into a short and compact storage or full closed position.
    Type: Grant
    Filed: November 27, 1984
    Date of Patent: December 9, 1986
    Assignees: `totes`, incorporated, Fu Tai Umbrella Works Ltd.
    Inventors: Toshio Okuda, Tsun-Zong Wu
  • Patent number: 4616868
    Abstract: A handle having a cap and sleeve that cooperate to define a peripheral groove on the handle's exterior surface. The peripheral groove is interrupted by two posts located within the groove and spaced one from the other, each post defining an inner face positioned closer to the handle's axis that the groove's floor. A connector loop portion of a closed loop carrying strap is positioned within the groove, the posts cooperating with slot structure in the groove's floor to deflect the strap interiorly of the handle's wall and then out through a strap slot where a hand loop portion is formed.
    Type: Grant
    Filed: January 24, 1985
    Date of Patent: October 14, 1986
    Assignee: `Totes`, Incorporated
    Inventor: Toshio Okuda
  • Patent number: 4542758
    Abstract: An umbrella which may be folded into a form of a flat box includes a fixed capstan and a slide capstan which form a flat rectangle. The short edges of the rectangle may be rounded, if desired, the capstans then having an elongated shape. The fixed and slide capstans are provided with notches or grooves on their short edges, which radiate outwardly for the insertion of the ends of the struts. Additional notches or grooves extending generally between the opposing long edges of the capstans are provided for the insertion of additional ends of the struts. The capstans further include annular channels on their peripheries which intersect the notches. A wire is disposed in each annular channel and each wire penetrates through apertures formed in the ends of the struts to retain the struts and to permit them to rotate within the notches or grooves when opening and closing the umbrella.
    Type: Grant
    Filed: July 5, 1983
    Date of Patent: September 24, 1985
    Assignee: Ming Nan Wu
    Inventor: Toshio Okuda
  • Patent number: 4045450
    Abstract: The optical resolution of DL-pantolactone is effected by reacting DL-pantolactone or its alkali salt derived therefrom, respectively, with an optically active N-substituted aminophenylpropanol of the general formula: ##STR1## wherein R.sub.1 is a phenyl group which may be substituted and R.sub.2 is an aralkyl group in which the benzene ring may bear a substituent, or its mineral acid addition salt; separating the resulting diastereomers by the aid of difference in their dissolubility; and decomposing them to give the corresponding optical antipodes. This method can provide the antipodes in high purity and yield and can be carried out with ease.
    Type: Grant
    Filed: February 12, 1976
    Date of Patent: August 30, 1977
    Assignee: Alps Pharmaceutical Ind. Co., Ltd.
    Inventors: Akikazu Kinugasa, Toshio Okuda, Makoto Goto, Mitsuo Saito