Patents by Inventor Toshio Okuno
Toshio Okuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6590406Abstract: An apparatus for inspecting a display board or a circuit board in which an inspection terminal 4 of an inspection probe block B is pressed into contact with an electrode pad 3 of a display board or a circuit portion P for inspection. A probe block supporting frame member 2 has an expandable and contractible structure, and when the probe block supporting frame member 2 is expanded, a board supporting frame member 1 can be relatively advanced. Due to the relative advancement of the board supporting frame member 1, the display board or the circuit board P protrudes forward of a distal end of the terminal 4 of the probe block B through an enlarged opening area 16 of the probe supporting frame member 2, so that the display board or the circuit board P supported on the board supporting frame member 1 can be exchanged with another board.Type: GrantFiled: October 12, 2001Date of Patent: July 8, 2003Assignees: Soshotech Co., Ltd, Adtec Engineering Co., Ltd.Inventors: Toshio Okuno, Gunji Mizutani, Masatomo Nagashima, Tadashi Furumi
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Patent number: 6577145Abstract: A unit has inspection block blocks mounted thereon in parallel, wherein a plurality of inspection probe blocks are inserted into and removed from a guide rail through a slider so that the probe blocks can be loaded or replaced. Each probe block is slidingly moved along the guide rail so that its positional adjustment can be made in an extension length of the guide rail. Only one kind of support base can commonly be used by inserting and removing different probe blocks with respect to the support base and the positional adjustment can be done. The unit with inspection probe blocks mounted thereon in parallel includes a support base and a plurality of inspection probe blocks each having a plurality of blocks and arranged on the support base in parallel.Type: GrantFiled: November 7, 2001Date of Patent: June 10, 2003Assignees: Soshotech Co., Ltd., Adtec Engineering Co., Ltd.Inventors: Toshio Okuno, Masatomo Nagashima, Atsushi Oguma, Tadashi Furumi
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Patent number: 6556004Abstract: A supporting framework for a display panel or a probe block is capable of properly coping with display panels of different sizes in a testing apparatus. By moving a framework 1 with a display panel supported thereon or by moving frame members 2, 3, 4, 5 of the framework 1 with a probe block supported thereon, an opening (or space) defined by the respective frame members can be enlarged or reduced.Type: GrantFiled: September 12, 2001Date of Patent: April 29, 2003Assignees: Soshotech Co., Ltd., Adtec Engineering Co., Ltd.Inventors: Toshio Okuno, Gunji Mizutani, Masatomo Nagashima
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Publication number: 20020196038Abstract: The present invention provides a probe unit in which satisfactory resilient shifting action of a lead portion supporting a conductive bump and a supplementary pressure imparting resilient body is realized, and a wiping action is taken place between the conductive bump and an external contact, thereby soundly press-contacting the conductive bump with respect to the external contact.Type: ApplicationFiled: June 19, 2002Publication date: December 26, 2002Inventors: Toshio Okuno, Toshio Kunimasu
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Patent number: 6450469Abstract: A rectangular support framework for a flat panel display as an object to be tested or a testing probe block is disclosed.Type: GrantFiled: May 5, 2000Date of Patent: September 17, 2002Assignees: Soshotech Co., Ltd, Adtec Engineering Co., Ltd.Inventor: Toshio Okuno
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Patent number: 6398561Abstract: A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead 12 formed by etching a conductive foil 11, and a bump 5 formed by electric casting by means of plating. The bump 5 and the lead 12 are formed of different metals, respectively, and the bump 5 is connected to a surface of the lead 12 through a conductive connecting material 10. The lead 12 is intimately contacted at a surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8. A basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17.Type: GrantFiled: July 11, 2001Date of Patent: June 4, 2002Assignees: Soshotech Co., Ltd., Yamaichi Electronics Co., Ltd.Inventors: Toshio Okuno, Etsuji Suzuki
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Publication number: 20020053918Abstract: To provide a unit with inspection block blocks mounted thereon in parallel, wherein a plurality of inspection probe blocks are inserted into and removed from a guide rail through a slider so that the probe blocks can be loaded or replaced. Each probe block is slidingly moved along the guide rail so that its positional adjustment can be made in an extension length of the guide rail. Only one kind of support base can commonly be used by inserting and removing different probe blocks with respect to the support base and the positional adjustment can be done.Type: ApplicationFiled: November 7, 2001Publication date: May 9, 2002Inventors: Toshio Okuno, Masatomo Nagashima, Atsushi Oguma, Tadashi Furumi
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Publication number: 20020043982Abstract: To enable exchange of a display board or a circuit board generally in an occupation space at the time of inspection of a board, to eliminate the need of a side space which is conventionally needed for use of exchange, and to greatly miniaturize an apparatus for inspecting a display board or a circuit board.Type: ApplicationFiled: October 12, 2001Publication date: April 18, 2002Inventors: Toshio Okuno, Gunji Mizutani, Masatomo Nagashima, Tadashi Furumi
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Publication number: 20020030149Abstract: To provide a supporting framework for a display panel or a probe block capable of properly coping with display panels of different sizes in a testing apparatus. By moving a framework 1 with a display panel supported thereon or by moving frame members 2, 3, 4, 5 of the framework 1 with a probe block supported thereon, an opening (or space) defined by the respective supporting frameworks 1 can be enlarged or reduced.Type: ApplicationFiled: September 12, 2001Publication date: March 14, 2002Inventors: Toshio Okuno, Gunji Mizutani, Masatomo Nagashima
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Publication number: 20020031921Abstract: To provide a contact structure of a lead in which a contract structure having a lead and a bump made of suitable metals, respectively, is formed easily and in which the bump and the lead are soundly connected together in terms of electricity and strength.Type: ApplicationFiled: July 11, 2001Publication date: March 14, 2002Inventors: Toshio Okuno, Etsuji Suzuki
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Patent number: 6351885Abstract: A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.Type: GrantFiled: May 15, 1998Date of Patent: March 5, 2002Assignees: Yamaichi Electronics Co., Ltd., Shoshotech Co., Ltd.Inventors: Etsuji Suzuki, Akira Yonezawa, Toshio Okuno
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Publication number: 20010015012Abstract: A structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of the insulating base is raised from the surface of the insulating base to form a projection and a surface of the projection is covered with a part of a lead forming the wiring pattern to form a conductive bump.Type: ApplicationFiled: May 15, 1998Publication date: August 23, 2001Inventors: ETSUJI SUZUKI, AKIRA YONEZAWA, TOSHIO OKUNO
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Patent number: 6217343Abstract: A multipoint conductive sheet having a plurality of conductive electrons arranged, in a multipoint fashion, on an insulative sheet such that the conductive electrons extend from a first main surface of the insulative sheet all the way to a second main surface through a thickness of the insulative sheet, each of the conductive electrons being provided at one end thereof with a first contact end which is arranged, in a multipoint fashion, on the first main surface and at the other end with a second contact end which is arranged, in a multipoint fashion, on the second main surface, wherein a slit or a slot is formed adjacent to each of the conductive electrons in such a manner as to extend through the insulative sheet, the slit or slot is allowed to extend at least two ways of each of the conductive electrons, the conductive electrons are each arranged on a sheet piece at an inner region of each of the slits or slots, and the conductive electrons can be displaced towards the first and second main surfaces whileType: GrantFiled: June 1, 1999Date of Patent: April 17, 2001Assignee: Shoshotech Co., Ltd.Inventor: Toshio Okuno
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Patent number: 6211691Abstract: A probe unit having a plurality of elongate leads disposed longitudinally in an array on a surface of an insulative sheet. Tip portions of the leads aligned along an end edge of the sheet are capable of being brought into contact, under pressure, with corresponding electrode pads of an electronic part. An insulative material is embedded in at least those areas of grooves between the tip portions of the leads. Slots, which are smaller in width than the leads, are formed between the tip portions of the leads. The tip portions of the leads have a reduced width and are longitudinally disposed on wide comb tooth like pieces of the insulative sheet isolated by the slots, and the insulative materials isolated by the slots are longitudinally intimately disposed along the opposite ends of the tip portions of the leads.Type: GrantFiled: June 1, 1999Date of Patent: April 3, 2001Assignee: Soshotech Co., Ltd.Inventor: Toshio Okuno
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Patent number: 6181150Abstract: A contact probe includes a plurality of leads arranged in array on a surface of an insulating film in an intimately contacted manner. A distal end portion of each of the leads is contacted, under pressure, with an electronic part. Each of the leads is provided with an anchor portion projecting from a mating surface thereof with respect to the insulating film and anchored in the insulating film, and the anchor portion is engaged with the insulating film.Type: GrantFiled: June 5, 1998Date of Patent: January 30, 2001Assignee: Soshotech Co., Ltd.Inventor: Toshio Okuno
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Patent number: 6111418Abstract: In the contact probe 1 having an array of leads 3 densely attached to a surface of an insulative film 2, pressure contact ends are formed by one end of the leads 3 being arranged in an array along one end edge portion of the insulative film 3. Slots are formed in the one end edge portion of the insulative film 2 such that the slots 9 are open between adjacent contact ends. When the lead ends arranged in the array on the surface of the insulative film are contacted under pressure with a given electronic part, a sufficient degree of freedom of flexure of the contact ends is obtained, so that the contact ends are contacted under pressure with the external terminals of the electronic part.Type: GrantFiled: February 19, 1998Date of Patent: August 29, 2000Assignee: Soshotech Co., Ltd.Inventors: Toshio Okuno, Hiroshi Katakawa, Narutoshi Kobashi, Kenichi Okamoto
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Patent number: 5492573Abstract: A high-strength stainless steel for use as a material of a fuel injection nozzle or a fuel injection needle of an internal combustion engine. The stainless steel is an as annealed martensitic stainless steel which exhibits a hardness not less than HRC 58 after quenching and tempering heat-treatment. The limit swaging ratio of said as annealed martensitic stainless steel is not less than 75%. The hardness of said as annealed martensitic stainless steel is not higher than HB 157. Preferably, the number of carbides having sizes of 0.2 .mu.m or less occupies not more than 50% of the total carbides, and wherein the limit swaging ratio of said as annealed martensitic stainless steel is not less than 75% or the hardness of said as annealed martensitic stainless steel is not higher than HB 157. Preferably, the stainless steel has a chemical composition containing, by weight: 0.4 to 0.6% of C; not more than 0.5% of Si; not more than 0.5% of Mn; 8.0 to 13.0% of Cr; 0.1 to 2.Type: GrantFiled: April 18, 1994Date of Patent: February 20, 1996Assignees: Hitachi Metals, Ltd., Nippondenso Co., Ltd.Inventors: Katsuaki Fukushima, Toshio Okuno, Masakazu Ito, Keizo Takeuchi, Toshiaki Terada
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Patent number: 5169459Abstract: The present invention provides a material which is superior in all of peel resistance, corrosion resistance and abrasion resistance against alcoholic fuels.The material comprises an Fe-Cr-C based steel or Fe-Cr-C-Cu based steel. For applications wherein members formed from the material are subjected to impacts, the Cr content is within the range of at least 8.0% and less than 16.0%, the relation between the C content and the Cr content satisfies % Cr+25.times.% C.ltoreq.32 based on weight, and the ratio of the area of a primary carbide to the total sectional area of the material is 1.5% or less. For non-impact applications Cr content is more than 12.0% and less than 16.0%, % C and % Cr satisfy % Cr+25.times.% C>32, and the ratio of the area of a primary carbide to the total sectional area of the material is 8.0% or less. This material is especially superior in peel resistance against alcoholic fuels. The Fe-Cr-C based steel may optionally contain Cu, Si, Mn, W, Mo, V, Co, and Ni.Type: GrantFiled: July 12, 1991Date of Patent: December 8, 1992Assignee: Hitachi Metals, Ltd.Inventors: Katsuaki Fukushima, Toshio Okuno, Masakazu Ito
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Patent number: 5032356Abstract: A high fatigue strength metal band saw backing material of the present invention comprises 0.27 to 0.40% of C, not more than 0.35% of Si, 0.3 to 1.2% of Mn, 0.45 to 0.75% of Ni, more than 3.0% to 4.5% of Cr, 1.5 to 2.3% of one or two of Mo and W in terms of "Mo+W/2", 0.03 to 0.2% of one or two of V and Nb in terms of "V+Nb/2", in terms of percent by weight, the balance Fe and inevitable impurities. The metal band saw can maintain its high fatigue strength even if it is subjected to heat treatment under the same conditions as those for high speed steel used as an edge material and thus exhibits excellent properties as a metal band saw backing material.Type: GrantFiled: April 17, 1990Date of Patent: July 16, 1991Assignee: Hitachi Metals, Ltd.Inventors: Atushi Kumagai, Toshio Okuno, Yoshihiro Minagi, Katuaki Fukushima
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Patent number: 4729872Abstract: Isotropic tool steel consisting essentially of necessary elements as tool steel, less than 0.005 weight % of S and less than 30 ppm of O, the balance being substantially Fe. The necessary elements are, by weight, 0.10-0.70% of C, 2.00% or less of Si, 2.00% or less of Mn, 7.00% or less of Cr, 0.20-12.00% of W and/or Mo alone or in combination (1/2W+Mo), 3.00% or less of V. They may further include at least one of 4.00% or less of Ni, 6.50% or less of Co and 0.20% or less of N. The isotropic tool steel has cleanliness with respect to non-metallic inclusions defined by JIS G 0555 of dA60.times.400.ltoreq.0.010% and d(B+C)60.times.400.ltoreq.0.020%, and a ratio of transverse direction toughness to longitudinal direction toughness of more than 0.70. Since it is highly resistant to the generation and propagation of cracks and fracture, dies for hot working made therefrom can enjoy a long life.Type: GrantFiled: September 10, 1986Date of Patent: March 8, 1988Assignee: Hitachi Metals, Ltd.Inventors: Tamiya Kishida, Mitsuru Suzuki, Toshio Okuno, Atsusuke Nakao