Abstract: A first end of a linear conductor of a resonator is connected to a ground conductor on a first surface of a dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. A first end of a linear conductor of a resonator is connected to a ground conductor on a second surface of the dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. An input-output line is connected to the ground conductor on the second surface of the dielectric substrate through a via. An input-output line is opposed to the second ends of the linear conductor of the two resonators.

Abstract: A band pass filter (1) includes two resonators (8) and (10) including respectively linear conductors (9) and (11) disposed inside a dielectric substrate (2), and a pair of input-output lines (13) and (14) to which the two resonators (8) and (10) are connected in parallel. Both ends of the linear conductor (9) of the resonator (8) are left open. The resonator (10) includes vias (12A) and (12B) through which both ends of the linear conductor (11) of the resonator (10) are connected to a ground conductor (6) on a first surface (2A) of the dielectric substrate (2). The pair of input-output lines (13) and (14) include respectively vias (15A) and (15B) for connection to a ground conductor (7) that is disposed on a second surface (2B) of the dielectric substrate (2).

Abstract: A filter includes a multilayer substrate and resonators (8), (11), and (14) at three stages provided in the multilayer substrate and coupled to a next stage. The multilayer substrate is provided with a floating electrode for coupling an open end portion (9A2) of a linear conductor of the resonator (8) at an input stage and an open end portion (12B2) of a linear conductor of the resonator (11) at an output stage. The multilayer substrate is provided with a floating electrode for coupling an open end portion (9B2) of the linear conductor of the resonator (8) at the input stage and an open end portion (12A2) of the linear conductor of the resonator (11) at the output stage.

Abstract: A first end of a linear conductor of a resonator is connected to a ground conductor on a first surface of a dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. A first end of a linear conductor of a resonator is connected to a ground conductor on a second surface of the dielectric substrate through a via. A second end of the linear conductor of the resonator is left open. An input-output line is connected to the ground conductor on the second surface of the dielectric substrate through a via. An input-output line is opposed to the second ends of the linear conductor of the two resonators.

Abstract: A band pass filter (1) includes two resonators (8) and (10) including respectively linear conductors (9) and (11) disposed inside a dielectric substrate (2), and a pair of input-output lines (13) and (14) to which the two resonators (8) and (10) are connected in parallel. Both ends of the linear conductor (9) of the resonator (8) are left open. The resonator (10) includes vias (12A) and (12B) through which both ends of the linear conductor (11) of the resonator (10) are connected to a ground conductor (6) on a first surface (2A) of the dielectric substrate (2). The pair of input-output lines (13) and (14) include respectively vias (15A) and (15B) for connection to a ground conductor (7) that is disposed on a second surface (2B) of the dielectric substrate (2).

Abstract: This disclosure provides a wideband antenna including a feed line, a ground conductor plate and a radiating conductor element connected to the feed line and facing the ground conductor plate at a distance from the ground conductor plate. A parasitic conductor element is provided on a side opposite to the ground conductor plate as viewed from the radiating conductor plate and is insulated from these plates. A coupling adjusting conductor plate is positioned between the radiating conductor element and the parasitic conductor element, is configured to adjust an amount of coupling between them, overlaps an area where the radiating conductor element and the parasitic conductor element overlap, and straddles the radiating conductor element in a direction orthogonal to the direction of a current I that flows therein. Both end sides of the coupling adjusting conductor plate are electrically connected to the ground conductor plate via via-holes.

Abstract: A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.

Abstract: This disclosure provides a horizontal radiation antenna. The antenna includes a back-surface-side grounded conductor plate on a back surface of a substrate, a radiation element to which a coplanar line is connected on the front surface of the substrate, and a passive element closer to an end portion side of the substrate than the radiation element. A front-surface-side grounded conductor plate is provided at a substantially same height as the radiation element with respect to a thickness direction of the substrate, and a conductive wall surface capable of reflecting a high-frequency signal radiated from the radiation element is provided between the front-surface-side grounded conductor plate and the back-surface-side grounded conductor plate.

Abstract: This disclosure provides a horizontal radiation antenna including a grounded conductor plate on the back surface of a multilayer substrate, a radiation element to which a microstrip line is connected on a front surface of the multilayer substrate, and a passive element on an end portion side of the multilayer substrate compared with the radiation element. An intermediate grounded conductor plate is provided within the multilayer substrate between insulation layers and faces the microstrip line. The intermediate grounded conductor plate defines a notch portion whose end portion side is open. The intermediate grounded conductor surrounds the radiation element and the passive element in the notch portion. The intermediate grounded conductor is electrically connected to the grounded conductor plate.

Abstract: This disclosure provides a wideband antenna including a feed line, a ground conductor plate and a radiating conductor element connected to the feed line and facing the ground conductor plate at a distance from the ground conductor plate. A parasitic conductor element is provided on a side opposite to the ground conductor plate as viewed from the radiating conductor plate and is insulated from these plates. A coupling adjusting conductor plate is positioned between the radiating conductor element and the parasitic conductor element, is configured to adjust an amount of coupling between them, overlaps an area where the radiating conductor element and the parasitic conductor element overlap, and straddles the radiating conductor element in a direction orthogonal to the direction of a current I that flows therein. Both end sides of the coupling adjusting conductor plate are electrically connected to the ground conductor plate via via-holes.

Abstract: A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.

Abstract: This disclosure provides a horizontal radiation antenna including a grounded conductor plate on the back surface of a multilayer substrate, a radiation element to which a microstrip line is connected on a front surface of the multilayer substrate, and a passive element on an end portion side of the multilayer substrate compared with the radiation element. An intermediate grounded conductor plate is provided within the multilayer substrate between insulation layers and faces the microstrip line. The intermediate grounded conductor plate defines a notch portion whose end portion side is open. The intermediate grounded conductor surrounds the radiation element and the passive element in the notch portion. The intermediate grounded conductor is electrically connected to the grounded conductor plate.

Abstract: This disclosure provides a horizontal radiation antenna. The antenna includes a back-surface-side grounded conductor plate on a back surface of a substrate, a radiation element to which a coplanar line is connected on the front surface of the substrate, and a passive element closer to an end portion side of the substrate than the radiation element. A front-surface-side grounded conductor plate is provided at a substantially same height as the radiation element with respect to a thickness direction of the substrate, and a conductive wall surface capable of reflecting a high-frequency signal radiated from the radiation element is provided between the front-surface-side grounded conductor plate and the back-surface-side grounded conductor plate.

Abstract: Electrodes (2) and (3) are formed on the front face (1A) and the rear face (1B) of a dielectric substrate (1). Fan-shaped apertures (4A) and (4B) forming a resonator (4) are formed in the electrodes (2) and (3) such that the fan-shaped aperture (4A) opposes the fan-shaped aperture (4B). Accordingly, two parameters, that is, the radius and the central angle, of the fan-shaped apertures (4A) and (4B) can be used to set the resonant frequency of the resonator (4), thus improving the flexibility in design of the resonator (4).

Abstract: An oscillator device and a transmission and reception device that are usable for implementing high output and wide-band modulation and that can reduce the manufacturing cost. An oscillation circuit and a frequency control circuit including microstrip lines are formed on an oscillation circuit substrate. A TM010 mode resonator including resonator electrodes are formed on a dielectric substrate along with excitation electrodes to form a dielectric resonator chip. One of the resonator electrodes is fixed to a land of the oscillation circuit substrate with bumps, and also, the excitation electrodes are fixed to the microstrip with bumps. With this configuration, the TM010 mode resonator can be excited by using the excitation electrodes, and also, the dielectric resonator chip can be miniaturized and the manufacturing cost can be decreased accordingly.

Abstract: Electrodes (2) and (3) are formed on the front face (1A) and the rear face (1B) of a dielectric substrate (1). Fan-shaped apertures (4A) and (4B) forming a resonator (4) are formed in the electrodes (2) and (3) such that the fan-shaped aperture (4A) opposes the fan-shaped aperture (4B). Accordingly, two parameters, that is, the radius and the central angle, of the fan-shaped apertures (4A) and (4B) can be used to set the resonant frequency of the resonator (4), thus improving the flexibility in design of the resonator (4).

Abstract: To provide a TM010 mode resonator device, an oscillator device, and a transmission and reception device having radiation of an electromagnetic field suppressed and a high Q. A TM010 mode resonator 2 having circular resonator electrodes 2A and 2B, opposite to each other, formed on the top surface 1A and bottom surface 1B of a dielectric substrate 1, respectively, is formed. Furthermore, in the dielectric substrate 1, a plurality of through holes 3 having no electrode on the inner wall surface 3A thereof are formed along the circular resonator electrodes 2A and 2B, and an open-circuited end is formed by these through holes 3. Thus, an electromagnetic field generated in the dielectric substrate 1 is reflected totally at the boundary between the through holes and the air, and radiation of the electromagnetic field can be suppressed.

Abstract: A sector antenna apparatus mounted on a vehicle has a casing, in which six horn antennas having apertures over an angular range of 180 degrees and extending radially are accommodated. The proximal ends of the horn antennas are connected to an antenna changeover switch. A portion of the horn antennas which emits beam radiation in the forward and backward direction and diagonal direction of the vehicle have large apertures, and a portion of the horn antennas which emits beam radiation to the right and left of the vehicle have a small aperture. Thus, the required antenna characteristics, such as angular resolution, beam width, antenna gain, are achievable in the required direction.

Abstract: A projecting part is formed on the bottom surface of a dielectric substrate and a first conductive layer and a second conductive layer are respectively formed on the top surface and the bottom surface of the dielectric substrate. A plurality of through holes are formed along the left and the right of the projecting part. A coplanar line including a center electrode sandwiched between two grooves is provided on the top surface. Two slots connected to the top end of the coplanar line are formed at a position corresponding to the position of the projecting part, whereby a waveguide formed by the projecting part and the coplanar line are interconnected via the slots.

Abstract: A transmission line includes a dielectric substrate having first and second principal surfaces. A first conductive layer is provided on the first principal surface. A protrusion is provided on the second principal surface and a second conductive layer is formed so as to cover the outer surface of the protrusion. A slot is formed in the first principal surface such that the slot extends through the first conductive layer and faces the protrusion. Accordingly, a high-frequency signal does not radiate from the second principal surface and locally transmits with low loss between the bottom surface of the protrusion and the slot.