Abstract: An electret condenser microphone is provided that can reduce parasitic capacitance and realize enhanced sensitivity. The electret condenser microphone includes a capacitor section including a fixed electrode having an electret member and a diaphragm electrode, a casing section housing the capacitor section, a circuit board including a converter circuit 4 for converting variations of capacitance of the capacitor section caused by vibrations of the diaphragm electrode to electric signals for output, and conducting elements for making the capacitor conductive with the circuit board, in which the casing section has a shape as viewed from top different from a shape of the capacitor as viewed from top to provide different distances between outer sides of the capacitor section and the casing section circumferentially of the capacitor section as viewed from top.

Abstract: An electret condenser microphone comprising a metal capsule having a top surface provided with sound receiving holes, a diaphragm, a back electrode plate that faces either one of surfaces of the diaphragm and that is provided separately from the capsule, and an electret layer formed on the back electrode plate or the diaphragm. The diaphragm, the back electrode plate and the electret layer are all mounted inside the capsule. The top surface includes a suctioned portion in its center on which suction force can be applied by a suction-type transporting device, and the sound holes are formed circumferentially around the suctioned portion.

Abstract: A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.

Abstract: In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone.

Abstract: An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.

Abstract: An electret condenser microphone includes a conductive capsule including an opening formed in a top member, a capacitor section including a diaphragm, a back electrode plate arranged to face either surface of the diaphragm, and a electret layer provided on the diaphragm or the back electrode plate, which are housed in the capsule, and a cap member provided between the capacitor section and the top member of the capsule and including an acoustic hole formed in a portion exposed to the outside through the opening, wherein the cap member further includes a suctioned portion formed in a central portion thereof to be drawn by a suction-type transporting device, the acoustic holes being arranged along the circumference of the suctioned portion.

Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.

Abstract: An electret condenser microphone is provided that can reduce parasitic capacitance and realize enhanced sensitivity The electret condenser microphone includes a capacitor section including a fixed electrode having an electret member and a diaphragm electrode, a casing section housing the capacitor section, a circuit board including a converter circuit 4 for converting variations of capacitance of the capacitor section caused by vibrations of the diaphragm electrode to electric signals for output, and conducting elements for making the capacitor conductive with the circuit board, in which the casing section has a shape as viewed from top different from a shape of the capacitor as viewed from top to provide different distances between outer sides of the capacitor section and the casing section circumferentially of the capacitor section as viewed from top.

Abstract: Two microphone assemblies 3 each having a main sound hole 61M and an auxiliary sound hole 61S are placed at a distance from each other facing the same direction, the main sound hole 61M being offset to one side with respect to an axis of an electret condenser microphone 4 and communicated with a rear face 4B of the electret condenser microphone 4 and the auxiliary sound hole 61S being offset to the opposite side of the axis of the electret condenser microphone 4 from the main sound hole 61M. The auxiliary sound holes 61S are provided in one face 1F of a housing 10 and the main sound holes 61M are provided in other faces 1R and 1L continuous with the face 1F of the housing 10. Directional axes extending from the respective auxiliary sound holes 61S to the respective main sound holes 61M are separated from each other at an angle.

Abstract: A condenser microphone comprises a casing body formed from a combination of a first plate member defining a top surface, a second plate member defining a bottom surface and an intermediate member provided between the first plate member and the second plate member, the top surface having an acoustic hole formed therein, a capacitor section including a diaphragm electrode, a fixed electrode, and an electret membrane provided in the diaphragm electrode or the fixed electrode, a converting circuit section for converting variations of capacitance of the capacitor section into electric signals for output, a conductive section for making the capacitor section electrically conductive with the converting circuit section, and conductive surface terminal elements extending from the top surface through side surfaces to the bottom surface among outer surfaces of the casing body to be conductive with the converting circuit section.

Abstract: A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.

Abstract: An electret condenser microphone comprising a metal capsule having a top surface provided with sound receiving holes, a diaphragm, a back electrode plate that faces either one of surfaces of the diaphragm and that is provided separately from the capsule, and an electret layer formed on the back electrode plate or the diaphragm. The diaphragm, the back electrode plate and the electret layer are all mounted inside the capsule. The top surface includes a suctioned portion in its center on which suction force can be applied by a suction-type transporting device, and the sound holes are formed circumferentially around the suctioned portion.

Abstract: An electro-acoustic transducer, for example a microphone, with a holder is provided with a block-shaped holder having on the front face a housing chamber housing a microphone main body with its acoustic holes situated on the external face, the microphone main body housed in the housing chamber, a plurality of connection electrodes connected to a plurality of terminal electrodes formed on the microphone main body, respectively, and a plurality of mounting electrodes exposed at each of a front face, a back face and a rear end face in correspondence with the plurality of connection electrodes.

Abstract: An object of the present invention is to provide a digital-output electret condenser microphone capable of being soldered on a wiring substrate of an apparatus by using a reflow furnace. An electret condenser microphone according to the present invention has an electret polymer film and a spacer that are formed of a heat-resistant material. Sound apertures are provided in a front panel of the electrically conductive capsule and/or the wiring substrate. Provided on the surface exposed in the open end of the electrically conductive capsule are multiple terminals, including at least a power supply terminal, a digital signal output terminal, and a clock input terminal. The terminals are protruded outward beyond a caulked part at the open end of the electrically conductive capsule.

Abstract: Affixed in intimate contact to the inside surface of a front board 10a of a conductive capsule 10 provided with a receiving sound aperture 10aa is a conductive back electrode board provided with air vent apertures 11a, 11b which are positioned not in alignment with the receiving sound aperture, these apertures 10a and 11a, 11b being connected by a slit 10ad. A polarized FEP film 12 which is an electret film is disposed on the surface of the back electrode board 11 opposite from the front board 10a, and a conductive diaphragm 14 is disposed on the surface of the FEP 12 opposite from the back electrode board 11 with a spacer 13 interposed therebetween which extends around the outer periphery of the opposite surface of the FEP 12. These component parts are accommodate in the capsule 10 to constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.

Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape. In the case where a component having a central terminal and a peripheral terminal is mounted on the mounting substrate, each part of the mounting substrate has the characteristics described below.

Abstract: An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.

Abstract: An electro-acoustic transducer, for example a microphone, with a holder is provided with a block-shaped holder having on the front face a housing chamber housing a microphone main body with its acoustic holes situated on the external face, the microphone main body housed in the housing chamber, a plurality of connection electrodes connected to a plurality of terminal electrodes formed on the microphone main body, respectively, and a plurality of mounting electrodes exposed at each of a front face, a back face and a rear end face in correspondence with the plurality of connection electrodes.

Abstract: In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone.

Abstract: Affixed in intimate contact to the inside surface of a front board 10a of a conductive capsule 10 provided with a receiving sound aperture 10aa is a conductive back electrode board provided with air vent apertures 11a, 11b which are positioned not in alignment with the receiving sound aperture, these apertures 10a and 11a, 11b being connected by a slit 10ad. A polarized FEP film 12 which is an electret film is disposed on the surface of the back electrode board 11 opposite from the front board 10a, and a conductive diaphragm 14 is disposed on the surface of the FEP 12 opposite from the back electrode board 11 with a spacer 13 interposed therebetween which extends around the outer periphery of the opposite surface of the FEP 12. These component parts are accommodate in the capsule 10 to constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.