Patents by Inventor Toshirou Okamura

Toshirou Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Engraved plate and substrate with conductor layer pattern using the same
    Patent number: 8673428
    Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: March 18, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Susumu Naoyuki, Hisashige Kanbara, Minoru Tosaka, Kyosuke Suzuki, Toshirou Okamura, Yoshihito Kikuhara, Masami Negishi, Tadayasu Fujieda, Kouichi Tsuyama
  • ENGRAVED PLATE AND SUBSTRATE WITH CONDUCTOR LAYER PATTERN USING THE SAME
    Publication number: 20100021695
    Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.
    Type: Application
    Filed: December 27, 2007
    Publication date: January 28, 2010
    Inventors: Susumu Naoyuki, Hisashige Kanbara, Minoru Tosaka, Kyosuke Suzuki, Toshirou Okamura, Yoshihito Kikuhara, Masami Negishi, Tadayasu Fujieda, Kouichi Tsuyama
  • Process for producing printed wiring board
    Patent number: 5309632
    Abstract: A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.
    Type: Grant
    Filed: November 2, 1992
    Date of Patent: May 10, 1994
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Yorio Iwasaki, Toshirou Okamura, Akishi Nakaso, Kiyoshi Hasegawa