Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

Abstract: A method for analyzing a solid specimen comprises the steps of: preparing a pulsed laser beam having a frequency of at least 100 Hz and a half width of 1 .mu.sec or less; determining a laser irradiation region; irradiating the pulsed laser beam in an inert gas stream and vaporizing a part of the solid specimen to generate fine particles; transferring said fine particles to a detector; and performing elemental analysis in the detector. An apparatus comprises: laser oscillating device including a semiconductor laser; converging device for converging a laser beam; irradiating device for irradiating the converged laser beam to generate fine particles; an analyzer for performing elemental analysis; and transfer device for transferring the fine particles to said analyzer.