Abstract: Provided is a photosensitive resin composition that makes it possible to suppress residue on a board. The photosensitive resin composition contains conductive particles (A) that have a coating layer that includes carbon, an alkali-soluble resin (B), a photoinitiator (C), and a solvent (D). The solvent (D) contains an amide solvent (dl).

Abstract: The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group; in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.

Abstract: The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); in which, in the general formulae (1) to (3), R4 represents a C2-C6 hydrocarbon group having an unsaturated double bond; R1 represents a single bond or a C1-C4 alkylene group; R2 in the general formula (2) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (3) represents an organic group; in which R2 in general formula (5) represents a hydrogen atom or a C1-C4 alkyl group; and R3 in the general formula (6) represents an organic group.

Abstract: Provided is a substrate whereby diffusion of light toward a backlight can be suppressed and luminance of an image display device can be enhanced. A substrate having, on a transparent substrate, (a) a color conversion light-emitting layer and (b) a light diffusion prevention layer in this order from the transparent substrate side, the refractive index of the light diffusion prevention layer with respect to a wavelength of 550 nm being 1.20-1.35.

Abstract: A resin composition which includes (a) a solvent, (b) silica particles, (c) a polysiloxane, and (d) a secondary or tertiary amine compound, wherein the solvent (a) includes an organic acid. From the resin composition, an even film is easily formed even on bases having protrusions and recesses, such as lens shapes. The resin composition has satisfactory storage stability.

Abstract: A resin composition including a polysiloxane (A) and a solvent (B), wherein the polysiloxane (A) contains at least one partial structure represented by any of the general formulae (1) to (3), and the relationship between the film thickness X and the film thickness Y, which respectively represent the thickness of a film produced by application of the resin composition and subsequent drying at 100° C. for 3 minutes and the thickness of the film after subsequent heating at 230° C. for 5 minutes, satisfies the following inequation: (X?Y)/x?0.05. The resin composition exhibits excellent coating properties on rugged surface and has excellent planarization properties even if the resin composition is in a form of thin film. (R1 represents a single bond or a C1-4 alkyl group; R2 represents a C1-4 alkyl group; and R3 represents an organic group.

Abstract: The invention provides a photosensitive coloring composition comprising a specific combination of a coloring agent, a photopolymerization initiator, and a photopolymerizable component that ensures excellent pattern processability and serves to produce a solid state imaging element with high image quality.

Abstract: The present invention provides a negative photosensitive resin composition including the following (a) to (d): (a) metallic compound particles, (b) a polysiloxane compound, (c) a compound having at least 1 group containing an ?,?-unsaturated carboxylate ester structure, and (d) a photopolymerization initiator, the composition also including (e) a compound containing maleimide group.

Abstract: A resin composition which includes (a) a solvent, (b) silica particles, (c) a polysiloxane, and (d) a secondary or tertiary amine compound, wherein the solvent (a) includes an organic acid. From the resin composition, an even film is easily formed even on bases having protrusions and recesses, such as lens shapes. The resin composition has satisfactory storage stability.

Abstract: The invention provides a photosensitive coloring composition comprising a specific combination of a coloring agent, a photopolymerization initiator, and a photopolymerizable component that ensures excellent pattern processability and serves to produce a solid state imaging element with high image quality.

Abstract: The present invention provides a negative photosensitive resin composition including the following (a) to (d): (a) metallic compound particles, (b) a polysiloxane compound, (c) a compound having at least 1 group containing an ?,?-unsaturated carboxylate ester structure, and (d) a photopolymerization initiator, the composition also including (e) a compound containing maleimide group.