Patents by Inventor Toshiyasu Ito

Toshiyasu Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984679
    Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: May 14, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai
  • Patent number: 11967785
    Abstract: A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: April 23, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yoshiharu Ishii, Toshiyasu Ito
  • Patent number: 11949179
    Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: April 2, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai
  • Publication number: 20240097374
    Abstract: An embodiment includes: a connector configured to allow a module substrate of a pluggable module to be inserted to the connector along an insertion-extraction direction Die and configured to be electrically connected to the module substrate; a cage having a cage body configured to accommodate the connector and defines a space in which the pluggable module is guided and inserted along the insertion-extraction direction Die. The connector and the cage body are mounted on a substrate such that the insertion-extraction direction Die is substantially orthogonal to the front side of the substrate and a fixing part for fixing the cage body to the substrate is provided at a rear end edge of the cage body located on the substrate side when mounted on the substrate.
    Type: Application
    Filed: June 2, 2023
    Publication date: March 21, 2024
    Inventor: Toshiyasu ITO
  • Publication number: 20240039195
    Abstract: Provided are a connector and a connector assembly that can reduce an insertion loss. A connector is configured such that a substrate is inserted along an insertion-extraction direction in a region between a first pin group and a second pin group. The contact pins each have: a curved part, curved convex toward the region and including a contact point contacted with an electrode pad of the substrate; and a straight first beam part, having a tip which is connected to a base end of the curved part, and a base end which is bent so as to be spaced away from the region.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 1, 2024
    Inventor: Toshiyasu ITO
  • Publication number: 20230420888
    Abstract: Provided is a connector having: a top pin group 120 having a plurality of contact pins 121, 122 aligned in a predetermined direction; and a bottom pin group having a plurality of contact pins aligned in the predetermined direction in which the bottom pin group is arranged so as to face the top pin group 120 and located on a mount substrate side. Each of the contact pins 121, 122 is at least either one of a signal pin 122 used for signaling and a ground pin 121 used for grounding, and the top pin group 120 includes a double ground configuration in which sets each including two signal pins 122 aligned between two ground pins 121 are aligned adjacent to each other in the predetermined direction.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 28, 2023
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20230420879
    Abstract: Provided is a connector including: a pin group having contact pins aligned in a predetermined direction; an alignment member formed extending in the predetermined direction and having an alignment groove at an end in a width direction orthogonal to the predetermined direction, the alignment groove being for aligning the contact pins; and a conductive member formed extending in the predetermined direction, coupled to the alignment member, and electrically connected to the contact pins used for grounding. The alignment member includes any one of a first protrusion and a first hole configured to accommodate the first protrusion in a center area in the predetermined direction, the conductive member includes the other of the first protrusion and the first hole in the center area in the predetermined direction, and the alignment member and the conductive member are coupled to each other by the first protrusion being secured in the first hole.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 28, 2023
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20230408778
    Abstract: A high-speed transmission connector includes a connector housing with a slot, upper and lower plate portions facing each other across the slot, first and second contact rows arranged face to face with each other within the connector housing, first and second caps supported in a hole of the upper plate portion and the lower plate portion, respectively. Each contact of the first and second contact row includes a receiving portion to receive a header of an external communication device. The receiving portion includes a receiving tip end portion facing an insertion side of the header and a curved portion extending from a rear end of the receiving tip end portion and bent in an arch shape.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 21, 2023
    Inventor: Toshiyasu ITO
  • Publication number: 20230352865
    Abstract: According to an embodiment, a high-speed transmission device includes a substrate, a control device on the substrate, a first connector, a second connector; and a cable assembly between the first connector and the second connector. The first connector is disposed at a position near the control device on the substrate and electrically connected to the control device via the substrate. The second connector is disposed at a position away from the control device on the substrate and equipped with an apparatus for transmitting / receiving a signal to and from the control device. The cable assembly includes a cable row, a paddle card substrate and a first conductive resin cover. Cables each transmitting a differential signal are arranged side by side in the cable row. The cables each comprise an internal conductor and an external conductor.
    Type: Application
    Filed: February 16, 2023
    Publication date: November 2, 2023
    Inventors: Toshiyasu ITO, Osamu SHIMIZU, Yoshihide KUROKI, Keita NOZAWA, Masashi TANAKA, Hiroaki KURIBAYASHI
  • Publication number: 20230352864
    Abstract: According to an embodiment, a high-speed transmission device includes a substrate, a control device on the substrate, a first connector, a second connector; and a cable assembly between the first connector and the second connector. The first connector is disposed at a position near the control device on the substrate and electrically connected to the control device via the substrate. The second connector is disposed at a position away from the control device on the substrate and equipped with an apparatus for transmitting / receiving a signal to and from the control device. The cable assembly includes a cable row, a paddle card substrate and a first conductive resin cover. Cables each transmitting a differential signal are arranged side by side in the cable row. The cables each comprise an internal conductor and an external conductor.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 2, 2023
    Inventors: Toshiyasu ITO, Osamu SHIMIZU
  • Patent number: 11678453
    Abstract: A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: June 13, 2023
    Assignees: YAMAICHI ELECTRONICS CO., LTD., HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Toshiyasu Ito, Hui Zhang, Jie Zhang, Xiaohui Li
  • Publication number: 20230134664
    Abstract: A connector for high-speed transmission includes a housing, a column of contacts and a metal member in the contacts. The housing includes an opening portion to be fitted into an external communication partner. The contact has a contact portion in contact with the communication partner, a first linear portion extending rearward from a rear end of the contact portion, a second linear portion bent and extending from a rear end of the first linear portion and a terminal portion soldered to an external substrate. The metal member shorts the contact for ground and is bent so as to avoid contacts other than the contact for ground. The metal member has a bent portion bent in a U-shape across the contacts other than the contact for ground, and is connected to the first and/or the second linear portion of the contact for ground.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 4, 2023
    Inventors: Hayane SUZUKI, Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 11626678
    Abstract: According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 11, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai, Taichi Enjoji
  • Patent number: 11600950
    Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: March 7, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Publication number: 20230029598
    Abstract: A socket includes a housing and a plurality of contacts. The housing is formed in a box-shape with an opening and is provided with a matrix of through holes at a bottom portion. The plurality of contacts includes ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of them and are passed through the through holes. The ground contacts adjacent to each other in the array direction are short-circuited.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 2, 2023
    Inventor: Toshiyasu ITO
  • Patent number: 11569618
    Abstract: A socket having a housing, a plurality of contacts, a plurality of insulating members and a plurality of conductive resin members is described. The housing is in a box shape with an opening and is provided with a matrix of penetration holes at a bottom portion. The plurality of contacts include contacts for ground and respective pairs of contacts for high-speed differential transmission. The plurality of insulating members support the plurality of contacts and are pressed into the housing so that the contacts are exposed on an opposite side of the opening from the penetration holes of the housing. The plurality of conductive resin members are fitted at positions of the plurality of insulating members in contact with the contacts for ground.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: January 31, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Toshiyasu Ito
  • Publication number: 20220393392
    Abstract: A connector (7) includes: a first connector part (10) having a first module side connection part connected to one end of an OSFP module in the front (F), having a first substrate side connection part connected to a substrate, and installed on the substrate; a second connector part (20) provided at a position such that the first module side connection part is interposed between the substrate and the second connector part (20), having a second module side connection part connected to one end of an OSFP module at the front (F), having a second substrate side connection part connected to the substrate, and stacked on the first connector part (10); and an intermediate part (30) provided between the first connector part (10) and the second connector part (20), and a cooling flow path in which air flows from the front (F) side toward the rear (R) side of the connector (7) is formed in the intermediate part (30).
    Type: Application
    Filed: October 9, 2019
    Publication date: December 8, 2022
    Inventors: Toshiyasu ITO, Masaaki SAITO
  • Publication number: 20220224040
    Abstract: A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 14, 2022
    Inventors: Yoshiharu Ishii, Toshiyasu Ito
  • Patent number: D968337
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: November 1, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Masaaki Saito
  • Patent number: D969749
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: November 15, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai, Taichi Enjoji