Abstract: This invention provides a material for a multi-layer circuit board, excellent in insulating property and burying properties and free from occurrence of cracks, a production method, and a multi-layer circuit board using the insulating material. The invention provides an insulating material having a curable composition layer wherein the curable composition layer contains 0 to 50 pieces/cm2 of foreign matter having particle sizes falling within a range of 30 to 50 ?m, a production method, and a production method for a multi-layer circuit board using the insulating material.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 &mgr;m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 &mgr;m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 &mgr;m or less.

Abstract: This invention provides a material for a multi-layer circuit board, excellent in insulating property and burying properties and free from occurrence of cracks, a production method, and a multi-layer circuit board using the insulating material. The invention provides an insulating material having a curable composition layer wherein the curable composition layer contains 0 to 50 pieces/cm2 of foreign matter having particle sizes falling within a range of 30 to 50 &mgr;m, a production method, and a production method for a multi-layer circuit board using the insulating material.

Abstract: A press-through package obtained by placing objects to be packed, in the accommodating pockets formed by vacuum forming or the like of a sheet made of a thermoplastic norbornene type resin, particularly preferably a hydrogenated product of ring-opening polymerization product of a dicyclopentadiene type monomer, and then closing the openings of pockets of the sheet with another sheet such as metal foil to pack the objects to be packed, which package makes the packed objects clearly visible in the pocket portions, prevents the deterioration of the packed objects by moisture bacause of its excellent water vapor barrier properties, and is good in production efficiency.

Abstract: The present invention discloses a polycyclic norbornene-based ring-opening polymer which comprises(A) 90-5% by mol of a repeating unit represented by the following formula [I] or the alkyl-substituted derivative thereof, and(B) 10-95% by mol of at least one repeating unit selected from a repeating unit represented by the following formula [II], the alkyl-substituted derivative thereof, a repeating unit represented by the following formula [III], the alkyl-substituted derivative thereof, or the alkylidene-substituted derivative thereof, and which has an intrinsic viscosity [.eta.] of 0.01-20 dl/g as determined in toluene at 25.degree. C., the hydrogenation products thereof, and a process for production thereof ##STR1## wherein ------ denotes a single bond or a double bond.

Abstract: The present invention relates to a process for bonding a molded article of a thermoplastic saturated norbornene resin in which when the molded article is bonded to an adherend widely different from the molded article in coefficient of linear expansion, the adhesion surface of the molded article and that of the adherend are stuck together with an adhesive composed mainly of an epoxy resin which has an elasticity (Shore hardness D: about 40 or less) imparted by modification with a polymer having reactive silyl groups, and then the adhesive is cured. Thus, there is provided such an excellent bonding process that the adhesive strength is hardly deteriorated by a temperature change.