Abstract: According to a defect pattern evaluation method of an embodiment, defects are detected by performing optical defect inspection on a pattern on a substrate. Then, the defects are classified according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects. Further, a computer calculates a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region. Then, the defect occurrence rate of each pattern layout is output as an evaluation result.

Abstract: According to a defect pattern evaluation method of an embodiment, defects are detected by performing optical defect inspection on a pattern on a substrate. Then, the defects are classified according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects. Further, a computer calculates a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region. Then, the defect occurrence rate of each pattern layout is output as an evaluation result.

Abstract: A method for inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process, setting region segments in the wafer, setting a region number for each segment, calculating foreign substance density of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount, calculating failure density in the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount, calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount, and identifying a processing process cause of failure occurrence.

Abstract: The present invention provides a linear pattern detection method which can extract and detect linear patterns distinguished by a microscopic defect distribution profile even if skipped measurements are taken. The linear pattern detection method acquires a defect map created based on results of defect inspection of a wafer; divides the defect map into a plurality of first segments; calculates a correlation coefficient of a point sequence in each of the first segments, the point sequence corresponding to a defect group contained in the first segments; calculates a total number of those first segments in which the correlation coefficient is equal to or larger than a first threshold; and determines that the wafer contains a linear pattern if the total number is equal to or larger than a second threshold.

Abstract: In order to provide a polylactic acid polymer composition to be thermoformed and a polylactic acid polymer sheet to be thermoformed which show good formability during thermoforming while maintaining impact resistance and heat resistance, and a thermoformed article obtained from the polylactic acid polymer sheet, according to the present invention, a polylactic acid polymer composition is used which comprises a mixture of an essentially amorphous polylactic acid polymer and a crystalline polylactic acid polymer, wherein the essentially amorphous polylactic acid polymer is present at the rate of more than 50% of the crystalline polylactic acid.

Abstract: The present invention provides a linear pattern detection method which can extract and detect linear patterns distinguished by a microscopic defect distribution profile even if skipped measurements are taken. The linear pattern detection method acquires a defect map created based on results of defect inspection of a wafer; divides the defect map into a plurality of first segments; calculates a correlation coefficient of a point sequence in each of the first segments, the point sequence corresponding to a defect group contained in the first segments; calculates a total number of those first segments in which the correlation coefficient is equal to or larger than a first threshold; and determines that the wafer contains a linear pattern if the total number is equal to or larger than a second threshold.

Abstract: A failure detecting method has inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process, setting a plurality of region segments in the wafer, setting a region number for each of the region segments, calculating foreign substance density in each of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount, calculating failure density in each of the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount, calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount, and

Abstract: An aliphatic polyester film on which an inorganic gas-barrier film is formed by deposition to improve the gas barrier properties of the aliphatic polyester wherein the adhesion between the aliphatic polyester film and the deposited gas-barrier film has been improved. The aliphatic polyester film is biaxially stretched and comprises at least two layers (layers A and B). Each of the layers A and B contain an amorphous polylactic acid resin and a crystalline polylactic acid resin in a predetermined ratio.

Abstract: An aliphatic polyester film on which an inorganic gas-barrier film is formed by deposition to improve the gas barrier properties of the aliphatic polyester wherein the adhesion between the aliphatic polyester film and the deposited gas-barrier film has been improved. The aliphatic polyester film is biaxially stretched and comprises at least two layers (layers A and B). Each of the layers A and B contain an amorphous polylactic acid resin and a crystalline polylactic acid resin in a predetermined ratio.

Abstract: In order to provide a polylactic acid polymer composition to be thermoformed and a polylactic acid polymer sheet to be thermoformed which show good formability during thermoforming while maintaining impact resistance and heat resistance, and a thermoformed article obtained from the polylactic acid polymer sheet, according to the present invention, a polylactic acid polymer composition is used which comprises a mixture of an essentially amorphous polylactic acid polymer and a crystalline polylactic acid polymer, wherein the essentially amorphous polylactic acid polymer is present at the rate of more than 50% of the crystalline polylactic acid.

Abstract: An adhesive tape comprises a base sheet of a polypropylene resin, an adhesive layer formed on one side of the base sheet and a roughened surface layer formed on the other side of the base sheet and composed of a polypropylene resin containing fine inorganic filler particles, in which the roughened surface layer has a thickness of not more than the maximum particle diameter of said fine inorganic filler particles and is substantially free from voids or cracks, and the total percent light transmittance of the tape is at least 90%.

Abstract: An adhesive tape comprises a base sheet of a polypropylene resin, an adhesive layer formed on one side of the base sheet and a roughened surface layer formed on the other side of the base sheet and composed of a polypropylene resin containing fine inorganic filler particles, in which the roughened surface layer has a thickness of not more than the maximum particle diameter of said fine inorganic filler particles and is substantially free from voids or cracks, and the total percent light transmittance of the tape is at least 90%.