Patents by Inventor Toshiyuki Asai
Toshiyuki Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11772006Abstract: A method for cleaning a vaporizer that vaporizes, at normal temperature and pressure, a source material in a liquid state, and supplies the vaporized source material to a reactor through a supply pipe, includes a cleaning step of passing the source material to the vaporizer while maintaining the source material in a liquid state to clean the vaporizer.Type: GrantFiled: August 26, 2021Date of Patent: October 3, 2023Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Hiroki Otani, Mitsuhiro Kawasaki, Toshiyuki Asai
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Publication number: 20210387106Abstract: A method for cleaning a vaporizer that vaporizes, at normal temperature and pressure, a source material in a liquid state, and supplies the vaporized source material to a reactor through a supply pipe, includes a cleaning step of passing the source material to the vaporizer while maintaining the source material in a liquid state to clean the vaporizer.Type: ApplicationFiled: August 26, 2021Publication date: December 16, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Hiroki OTANI, Mitsuhiro KAWASAKI, Toshiyuki ASAI
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Patent number: 9096454Abstract: A method of manufacturing a sheet glass includes: a re-draw process forming a sheet glass by, heating and softening a glass preform manufactured by float method, and extending the glass preform to a desirable plate thickness. An extension direction in which the glass preform is extended by the re-draw process is 90 degrees with respect to a direction in which molten glass is fed in the float method.Type: GrantFiled: March 14, 2014Date of Patent: August 4, 2015Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kousuke Nakao, Toshiyuki Asai
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Patent number: 9027364Abstract: A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.Type: GrantFiled: July 14, 2011Date of Patent: May 12, 2015Assignee: Furukawa Electric Co., Ltd.Inventors: Toshiyuki Asai, Tetsuo Suzuki
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Publication number: 20140196501Abstract: A method of manufacturing a sheet glass includes: a re-draw process forming a sheet glass by, heating and softening a glass preform manufactured by float method, and extending the glass preform to a desirable plate thickness. An extension direction in which the glass preform is extended by the re-draw process is 90 degrees with respect to a direction in which molten glass is fed in the float method.Type: ApplicationFiled: March 14, 2014Publication date: July 17, 2014Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kousuke Nakao, Toshiyuki Asai
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Publication number: 20120006063Abstract: A method includes forming a glass ribbon by heating and softening a glass plate preform and drawing the glass plate preform to a predetermined thickness in a heating furnace; and performing coring on the glass ribbon in order to form circular substrates in a straight line along a longitudinal direction of the glass ribbon.Type: ApplicationFiled: July 14, 2011Publication date: January 12, 2012Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Toshiyuki Asai, Tetsuo Suzuki
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Patent number: 7766651Abstract: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.Type: GrantFiled: March 21, 2007Date of Patent: August 3, 2010Assignee: Tamura FA System CorporationInventors: Toshiyuki Asai, Motohiro Yamane, Takayuki Matsuoka, Atsushi Tanaka
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Publication number: 20080014542Abstract: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.Type: ApplicationFiled: March 21, 2007Publication date: January 17, 2008Applicant: TAMURA FURUKAWA MACHINERY CORPORATIONInventors: Toshiyuki ASAI, Motohiro Yamane, Takayuki Matsuoka, Atsushi Tanaka
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Publication number: 20070284408Abstract: A reflow furnace comprises: carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, a control device to control an oxygen concentration in a high temperature gas after being burned, and a returning device to return the high temperature gas with the oxygen concentration controlled after being burned to the heating chamber.Type: ApplicationFiled: May 30, 2007Publication date: December 13, 2007Applicant: TAMURA FURUKAWA MACHINERY CORPORATIONInventors: Toshiyuki ASAI, Motohiro Yamane, Takayuki Matsuoka, Atsushi Tanaka
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Publication number: 20070057020Abstract: A flux collection system is proposed in which in a buffering area between an inlet and a heating chamber of a reflow furnace, blowing in-furnace ambient gas to a printed circuit board from a position under a carrier device and sucking ambient gas at a lower section of the carrier device cause a device to prevent outside air from entering and ambient gas from releasing the ambient gas including flux component to be blown out from a narrowing mechanism to collide with a partition plate and promote mixture of solidified flux and liquefied flux to collect flux easily.Type: ApplicationFiled: August 29, 2006Publication date: March 15, 2007Applicant: The Furukawa Electric Co., Ltd.Inventors: Motomu SHIBAMURA, Toshiyuki Asai, Takayuki Matsuoka, Takayuki Ando, Atsushi Tanaka
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Patent number: 6871890Abstract: The bumper mounting structure includes a front side member 1 and a bumper reinforcing member 2. In assembly, the tip end of the front side member 1 is connected with the bumper reinforcing member 2. The tip end of the member 1 is opened and provided with a slant part 10, forming a weakened part in the member 1. When an impact load causes the bumper reinforcing member 2 to be deformed, the deformation of the front side member 1 is induced at its opened end because of its weakened structure. Consequently, it is possible to carry out the effective absorption of impact energy without elevating a reaction force abruptly.Type: GrantFiled: April 11, 2003Date of Patent: March 29, 2005Assignee: Nissan Motor Co., Ltd.Inventors: Manabu Sato, Toshiyuki Asai, Haruaki Nakatsukasa
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Patent number: 6736449Abstract: A vehicle front structure including a pair of front side members extending in a fore-and-aft direction of the vehicle, each including a first front end portion with a first leading end, and a pair of subframes extending along the front side members on a lower side thereof, each including a second front end portion with a second leading end. The first and second front end portions are connected with each other via a connecting portion therebetween. An abutment member in the form of a tie-down hook or a first cross member is connected with the subframes via the connecting portion. The abutment member includes a front end forward offset from the first and second leading ends of the front side members and the subframes and a portion placed at substantially same height as the second front end portion.Type: GrantFiled: July 29, 2002Date of Patent: May 18, 2004Assignee: Nissan Motor Co., Ltd.Inventors: Toshiyuki Takahashi, Yasushi Murakami, Toshiyuki Asai
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Publication number: 20030218343Abstract: The bumper mounting structure includes a front side member 1 and a bumper reinforcing member 2. In assembly, the tip end of the front side member 1 is connected with the bumper reinforcing member 2. The tip end of the member 1 is opened and provided with a slant part 10, forming a weakened part in the member 1. When an impact load causes the bumper reinforcing member 2 to be deformed, the deformation of the front side member 1 is induced at its opened end because of its weakened structure. Consequently, it is possible to carry out the effective absorption of impact energy without elevating a reaction force abruptly.Type: ApplicationFiled: April 11, 2003Publication date: November 27, 2003Inventors: Manabu Sato, Toshiyuki Asai, Haruaki Nakatsukasa
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Publication number: 20030025359Abstract: A vehicle front structure including a pair of front side members extending in a fore-and-aft direction of the vehicle, each including a first front end portion with a first leading end, and a pair of subframes extending along the front side members on a lower side thereof, each including a second front end portion with a second leading end. The first and second front end portions are connected with each other via a connecting portion therebetween. An abutment member in the form of a tie-down hook or a first cross member is connected with the subframes via the connecting portion. The abutment member includes a front end forward offset from the first and second leading ends of the front side members and the subframes and a portion placed at substantially same height as the second front end portion.Type: ApplicationFiled: July 29, 2002Publication date: February 6, 2003Applicant: Nissan Motor Co., Ltd.Inventors: Toshiyuki Takahashi, Yasushi Murakami, Toshiyuki Asai