Abstract: The present invention provides a metal-oxo complex represented by the following general formula (1), wherein in the general formula (1) above, “M” represents a molybdenum atom or a tungsten atom; “A” represents a carbon atom, a silicon atom, a germanium atom, a tin atom or a lead atom; X1 and X2 each independently represent a halogen atom; R1 to R5 each independently represent a hydrogen atom, a straight or branched chain alkyl group that is substituted or unsubstituted and has 1 to 20 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 20 carbon atoms; each of R1 to R3 may be bonded to one another to form a ring.

Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.

Abstract: A damping body for packaging includes, between an abutment adapted to abut against a precision substrate storage container upon packaging and an outer peripheral wall rising from an outer peripheral edge of a bottom part having the abutment, an outer peripheral bottom formed at a position distanced more from the abutment than is the precision substrate storage container, and a stepped part formed between the outer peripheral bottom and the abutment. Consequently, in the event of an impact from the outside, the stepped part collapses, so that the abutment favorably moves with respect to the outer peripheral bottom and thus can efficiently absorb the impact. This can prevent large impacts from instantaneously being exerted on the precision substrate storage container and efficiently damp drop impacts.

Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.

Abstract: A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover.

Abstract: A wafer storage container including a container body having an opening adapted to store wafers is disclosed. The container body includes a window and wafer support parts. Delivery components are attached to the exterior face part of the container body. The delivery components includes a bottom plate disposed at a bottom of the container body, a pair of side handles disposed at both sides of the container body, and a robotic flange disposed at a top of the container body. The container further is provided with a lid adapted to seal the opening of the container body. The lid includes a lid main body, a pair of latch mechanism disposed within the lid main body, a retainer member disposed at an inner surface of the lid main body, a seal gasket member disposed at a periphery of the lid main body such that it contacts a periphery of an opening part of the container body and a lid cover.

Abstract: A damping body for packaging includes, between an abutment adapted to abut against a precision substrate storage container upon packaging and an outer peripheral wall rising from an outer peripheral edge of a bottom part having the abutment, an outer peripheral bottom formed at a position distanced more from the abutment than is the precision substrate storage container, and a stepped part formed between the outer peripheral bottom and the abutment. Consequently, in the event of an impact from the outside, the stepped part collapses, so that the abutment favorably moves with respect to the outer peripheral bottom and thus can efficiently absorb the impact. This can prevent large impacts from instantaneously being exerted on the precision substrate storage container and efficiently damp drop impacts.

Abstract: A wafer storage container includes an outer peripheral portion located outside an outer peripheral edge of a wafer, and a placing portion which extends from a position lower than an uppermost surface of the outer peripheral portion to a radial inside of the wafer and on which the wafer is placed at a position lower than the uppermost surface of the outer peripheral portion. The placing portion includes a first inclined surface which descends toward the radial inside of the wafer and can be brought into contact with only the outer peripheral edge of the wafer when the wafer is placed and a second inclined surface which is on a rear side of the first inclined surface, ascends toward the radial inside of the wafer, and can be brought into contact with only the outer peripheral edge of a lower wafer when a plurality of wafer storage containers are stacked.

Abstract: The precision substrate storage container includes a bottom plate 20 removably attached to the bottom of a container body 1 in which a multiple number of semiconductor wafers are accommodated in alignment; a holder 50 removably supported on bottom plate 20; and a RFID system transponder 60 held in holder 50. Bottom plate 20 includes a base plate 21 opposing the rear bottom of container body 1 and a wall plate 30 erected on base plate 21. The base plate 21 is formed with a first supporting structure 40 for supporting holder 50 that is oriented in the horizontal direction and a second supporting structure 43 for supporting holder 50 that is oriented in the vertical direction so as to selectively change the position of holder 50 taking one of the two directions, longitudinal and transverse.

Abstract: A wafer storage container includes an outer peripheral portion located outside an outer peripheral edge of a wafer, and a placing portion which extends from a position lower than an uppermost surface of the outer peripheral portion to a radial inside of the wafer and on which the wafer is placed at a position lower than the uppermost surface of the outer peripheral portion. The placing portion includes a first inclined surface which descends toward the radial inside of the wafer and can be brought into contact with only the outer peripheral edge of the wafer when the wafer is placed and a second inclined surface which is on a rear side of the first inclined surface, ascends toward the radial inside of the wafer, and can be brought into contact with only the outer peripheral edge of a lower wafer when a plurality of wafer storage containers are stacked.

Abstract: The purpose is to provide a precision substrate storage container which is able to prevent communication failure and lowering of information transmission function by permitting its non-contact type information medium to change its directivity in multiple directions, and which brings no variation into information transmission ability even if it is used at different sites, with different equipment units or in other ways. The precision substrate storage container is comprised of: a bottom plate 20 removably attached to the bottom of a container body 1 in which a multiple number of semiconductor wafers are accommodated in alignment; a holder 50 removably supported on bottom plate 20; and a RFID system transponder 60 held in holder 50. Bottom plate 20 is composed of a base plate 21 opposing the rear bottom of container body 1 and a wall plate 30 erected on base plate 21.

Abstract: A seal member for a substrate storage container disposed between an opening end portion of a container body and a cover, which container body and cover form the container and which container body has the opening end portion and stores substrates, is disclosed. The seal member comprises a base body section formed of a first material and a covering section formed of a second material and covering at least a part of the base body section, wherein the covering section includes a seal forming portion for forming a seal in contact with one of the container body and the cover.

Abstract: A seal member (10) for a substrate storage container (20) disposed between an opening end portion of a container body (20a) and a cover (20b), which container body and cover form the container and which container body has the opening end portion and stores substrates, is disclosed. The seal member comprises a base body section (11) formed of a first material and a covering section (12) formed of a second material and covering at least a part of the base body section, wherein the covering section includes a seal forming portion for forming a seal in contact with one of the container body and the cover.

Abstract: A storage container for multiple wafers in alignment in its pod, includes: a hollow door element which opens and hermetically closes the open front of the pod; and a guide arrangement for guiding and positioning the door element into the open front when the door element is closed. This guide arrangement is configured of a first inclined guide portion, at least, formed in the underpart of the opening of the pod, gradually going outwards toward the distal end; and a second inclined guide portion, at least, formed in the underpart of the periphery of the door element, gradually going outwards from the inner side to the outer side and coming in contact with the first inclined guide portion when the door element is closed.