Abstract: A packing apparatus, in particular for provisions in a squeezed style package, is provided comprising a hopper to supply a predetermined amount of the provisions into a synthetic resin film tube, a heat-seal and fusion cutting device disposed beneath the hopper to heat seal and cut the tube, a squeezing device disposed beneath the heat-seal and cutting device comprising two pairs of horizontal parallel bars disposed at right angles such that the confronting bars of each of the pairs are adapted to be moved towards and away from each other, a taping device disposed near the squeezing device and adapted to tape around the squeezed portion of the packing with an adhesive tape, a cutting device to sever the adhesive tape after taping, and a driving means to actuate the various components in a synthronized manner.