Patents by Inventor Toshiyuki Koyama
Toshiyuki Koyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190223464Abstract: The present invention provides lactic acid bacterium-containing chocolate containing a lactic acid bacterium in a living state, wherein the average particle size of the solid particles in the lactic acid bacterium-containing chocolate is larger than 1 ?m and less than 9 ?m, and a manufacturing method thereof.Type: ApplicationFiled: August 10, 2017Publication date: July 25, 2019Applicants: NITTO PHARMACEUTICAL INDUSTRIES, LTD., LOTTE CO., LTD.Inventors: Hiroaki ASHITANI, Toshiyuki KOYAMA, Yoko USAMIKRANK, Yusuke KABUKI, Yasunori YONEJIMA, Keiko HISA
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Publication number: 20180206540Abstract: By adding a viable lactic acid bacterium to a fat or oil composition, the present invention has succeeded in producing a lactic acid bacterium-containing fat or oil composition that has a high viability of the lactic acid bacterium and an excellent resistance to acids. By adding lactic acid bacteria powder or a chocolate with a high lactic acid bacterium concentration to a chocolate dough after tempering and before molding, moreover, the present invention has succeeded in producing a lactic acid bacterium-containing chocolate including a viable lactic acid bacterium by a simple producing method. Thus, provided is a lactic acid bacterium-containing chocolate with high palatability that contains a viable lactic acid bacterium.Type: ApplicationFiled: May 31, 2016Publication date: July 26, 2018Inventors: Hiroaki ASHITANI, Toshiyuki KOYAMA, Yoko USAMIKRANK, Tomokazu ISHIZUKA, Keiji TADOKORO, Yusuke KABUKI, Yasunori YONEJIMA, Keiko HISA
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Patent number: 9992918Abstract: Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.Type: GrantFiled: October 30, 2014Date of Patent: June 5, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hideaki Watanabe, Kiyoshi Imai, Shigeki Imafuku, Toshiyuki Koyama
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Patent number: 9867320Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.Type: GrantFiled: October 30, 2014Date of Patent: January 9, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hideaki Watanabe, Shigeki Imafuku, Toshiyuki Koyama
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Patent number: 9185916Abstract: A method of processing wheat flour that without detriment to secondary processability, improves the flavor and palate feelings thereof; processed wheat flour obtained by the processing method; and food utilizing the processed wheat flour. The method is characterized in that 10 to 55 pts·wt. of ethyl alcohol is homogeneously dispersed in 100 pts·wt. of wheat flour under such conditions that the total water content is ?20 wt. %, followed by evaporation of ethyl alcohol therefrom at ?50° C.Type: GrantFiled: May 6, 2005Date of Patent: November 17, 2015Assignee: LOTTE CO., LTDInventors: Masanori Ito, Kazuhiro Sano, Takahiro Kitamura, Koji Murakami, Toshiyuki Koyama
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Publication number: 20150128411Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.Type: ApplicationFiled: October 30, 2014Publication date: May 14, 2015Inventors: Hideaki WATANABE, Shigeki IMAFUKU, Toshiyuki KOYAMA
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Publication number: 20150128410Abstract: Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a chuck unit which chucks one of the plurality of leads of the electronic component to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.Type: ApplicationFiled: October 30, 2014Publication date: May 14, 2015Inventors: Hideaki WATANABE, Kiyoshi IMAI, Shigeki IMAFUKU, Toshiyuki KOYAMA
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Publication number: 20120189529Abstract: Disclosed is a carbon dioxide gas processing apparatus including an oxidization vessel for producing a magnesium oxide by oxidizing magnesium-containing powder in an atmosphere of a gas such as a carbon dioxide gas that contains oxygen as a constituent element thereof, a carbonate production tank that reserves water or a water solution therein and that introduces the magnesium containing oxygen as a constituent element produced in the oxidization vessel, and a carbon dioxide gas supplying means for supplying carbon dioxide gas to the carbonate production tank.Type: ApplicationFiled: September 14, 2010Publication date: July 26, 2012Applicant: AISIN SEIKI KABUSHIKI KAISHAInventors: Yoshiki Wakimoto, Toshiyuki Koyama, Hajime Minaki, Satoshi Fujii, Yoichi Harada
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Publication number: 20080095916Abstract: A method of processing wheat flour that without detriment to secondary processability, improves the flavor and palate feelings thereof, processed wheat flour obtained by the processing method; and fool utilizing the processed wheat flour. The method is characterized in that 10 to 55 pts.wt. of ethyl alcohol is homogeneously dispersed in 100 pts.wt. of wheat flour under such conditions that the total water content is ?20 wt. %, followed by evaporation of ethyl alcohol therefrom at ?50° C.Type: ApplicationFiled: May 6, 2005Publication date: April 24, 2008Applicant: Lotte Co., Ltd.Inventors: Masanori Ito, Kazuhiro Sano, Takahiro Kitamura, Koji Murakami, Toshiyuki Koyama
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Publication number: 20060016614Abstract: A guide belt is stretched over a drive pulley that rotates integrally with a head and a driven pulley situated at one side of the drive pulley. One end of the cable is fixedly attached to a part of the guide belt that is always in contact with the drive pulley when the head rotates, while the cable is extended along the guide belt. The cable is bent back in U shape at its midpoint and the cable on the other end side therefrom is extended along a guide member placed substantially in parallel with the guide belt between the drive pulley and the driven pulley. The other end of the cable is fixedly attached to the guide member.Type: ApplicationFiled: December 4, 2003Publication date: January 26, 2006Inventors: Dai Yokoyama, Satoshi Matsuoka, Toshiyuki Koyama
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Patent number: 6915561Abstract: This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.Type: GrantFiled: February 13, 2002Date of Patent: July 12, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Dai Yokoyama, Hideaki Watanabe, Kiyoshi Imai, Toshiyuki Koyama, Taira Ishii
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Patent number: 6715205Abstract: An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.Type: GrantFiled: October 16, 2001Date of Patent: April 6, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Watanabe, Dai Yokoyama, Toshiyuki Koyama, Hiromi Kinoshita
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Patent number: 6609295Abstract: A piezoelectric element is mounted to a clinch lever for detecting stress-strain generated therein when cutting and clinching leads of an electronic component that has been inserted in corresponding holes formed in a circuit board substrate. A detected voltage d is compared to a threshold voltage s selected from a plurality of threshold voltages preset in the device. When the detected voltage d exceeds the threshold voltage s, the insertion detecting section outputs a signal indicating that the insertion of the leads in the holes has been performed normally.Type: GrantFiled: October 25, 2001Date of Patent: August 26, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshiyuki Koyama, Satoshi Taniguchi
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Patent number: 6561407Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.Type: GrantFiled: January 25, 2002Date of Patent: May 13, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuyasu Nagafuku, Akihiko Wachi, Masaya Matsumoto, Toshiyuki Koyama
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Publication number: 20020108237Abstract: This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.Type: ApplicationFiled: February 13, 2002Publication date: August 15, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Dai Yokoyama, Hideaki Watanabe, Kiyoshi Imai, Toshiyuki Koyama, Taira Ishii
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Publication number: 20020060235Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.Type: ApplicationFiled: January 25, 2002Publication date: May 23, 2002Inventors: Nobuyasu Nagafuku, Akihiko Wachi, Masaya Matsumoto, Toshiyuki Koyama
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Patent number: 6382497Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.Type: GrantFiled: September 28, 2000Date of Patent: May 7, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuyasu Nagafuku, Akihiko Wachi, Masaya Matsumoto, Toshiyuki Koyama
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Publication number: 20020046463Abstract: An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.Type: ApplicationFiled: October 16, 2001Publication date: April 25, 2002Inventors: Hideaki Watanabe, Dai Yokoyama, Toshiyuki Koyama, Hiromi Kinoshita
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Patent number: 5283146Abstract: A photoconductive phthalocyanine composition is disclosed, comprising (A) a photoconductive phthalocyanine composition comprising 100 parts by weight of an unsubstituted phthalocyanine derivative and from 0.001 to 5 parts by weight of a nitro- or halogen-substituted phthalocyanine derivative and (B) from 0.01 to 10 parts by weight, per 100 parts by weight of the photoconductive phthalocyanine composition (A), of a phthalocyanine derivative having at least 4 electron attracting groups. A photosensitive layer formed of the photoconductive phthalocyanine composition produces digital signals whether input light is digital or not. It is useful as not only a photoreceptor for digital recording system of electrophotography but a photoreceptor for analogue light input in conventional PPC to provide a high quality image with sharp edges.Type: GrantFiled: June 29, 1992Date of Patent: February 1, 1994Assignee: Mitsubishi Petrochemical Co., Ltd.Inventors: Toyoshi Ohashi, Toshiaki Ishibashi, Junko Gouda, Akira Itsubo, Toshiyuki Koyama, Masatomi Ozawa, Katsutosi Iijima