Abstract: A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.

Abstract: A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.

Abstract: A semiconductor module includes: a sealing resin sealing an insulation circuit board so that a second metal layer is exposed to a rear plane and the rear plane is warped downward in a convex shape; and a cylindrical member including a center outer peripheral surface formed such that an upper portion is embedded in the sealing resin and including an unevenness and a lower outer peripheral surface provided below the center outer peripheral surface and smoother than the center outer peripheral surface and provided such that a bottom plane of a lower end of the lower outer peripheral surface is exposed from the rear plane of the sealing resin and the lower outer peripheral surface above the lower end of the lower outer peripheral surface is sealed by the sealing resin and is disposed near the end of the sealing resin in relation to the insulation circuit board.

Abstract: A semiconductor module includes: a sealing resin sealing an insulation circuit board so that a second metal layer is exposed to a rear plane and the rear plane is warped downward in a convex shape; and a cylindrical member including a center outer peripheral surface formed such that an upper portion is embedded in the sealing resin and including an unevenness and a lower outer peripheral surface provided below the center outer peripheral surface and smoother than the center outer peripheral surface and provided such that a bottom plane of a lower end of the lower outer peripheral surface is exposed from the rear plane of the sealing resin and the lower outer peripheral surface above the lower end of the lower outer peripheral surface is sealed by the sealing resin and is disposed near the end of the sealing resin in relation to the insulation circuit board.

Abstract: A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

Abstract: A method for producing a semiconductor device includes laser welding to bond an upper terminal and a lower terminal as internal wiring members of the semiconductor device. When the upper terminal is fixed to the lower terminal by the laser welding, a gap between an upper surface of the lower terminal and a lower surface of the upper terminal is equal to or more than 20 ?m and equal to or less than 400 ?m.

Abstract: A semiconductor device has a heat dissipating base; a patterned insulating substrate attached to the heat dissipating base with a solder therebetween; a semiconductor chip attached to a conductive pattern of the patterned insulating substrate with a solder therebetween; a first conductor attached to the semiconductor chip with a solder therebetween; a resin case attached to the heat dissipating base with an adhesive; and a second conductor attached to the first conductor by laser welding. The second conductor formed by rolling has stripe-shaped rolling traces formed on a surface thereof in a rolling direction and is disposed on the first conductor such that the rolling traces are arranged in a same direction.

Abstract: A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

Abstract: A method for producing a semiconductor device includes laser welding to bond an upper terminal and a lower terminal as internal wiring members of the semiconductor device. When the upper terminal is fixed to the lower terminal by the laser welding, a gap between an upper surface of the lower terminal and a lower surface of the upper terminal is equal to or more than 20 ?m and equal to or less than 400 ?m.

Abstract: A semiconductor device has a heat dissipating base; a patterned insulating substrate attached to the heat dissipating base with a solder therebetween; a semiconductor chip attached to a conductive pattern of the patterned insulating substrate with a solder therebetween; a first conductor attached to the semiconductor chip with a solder therebetween; a resin case attached to the heat dissipating base with an adhesive; and a second conductor attached to the first conductor by laser welding. The second conductor formed by rolling has stripe-shaped rolling traces formed on a surface thereof in a rolling direction and is disposed on the first conductor such that the rolling traces are arranged in a same direction.

Abstract: An optical disk apparatus comprises an information generating circuit for inserting a predetermined number of resync codes in information to be recorded to generate record information, an optical disk driver for recording the record information generated by the information generating circuit on a predetermined region on a recording medium, and for reproducing the record information, recorded on the predetermined region on the recording medium by the recording circuit, a control circuit for computing an error ratio of data read out from the recording medium to data to be written, a detecting circuit for detecting the resync codes in the information reproduced by the reproducing circuit, and a counter for counting the resync codes detected by the detector.

Abstract: An optical head is first positioned at an initial position and is then moved along a radius of an optical disk. The optical head is moved by a predetermined distance corresponding to a distance from the initial position to a center of width of the control track. The optical head is stopped accurately at the center of the control track.

Abstract: An optical apparatus is disclosed for reproducing data by focusing a light beam onto an optical disk. The optical disk has a first area, a second area having a characteristic data of the disk and a third area having data to be reproduced. Each area is located on the disk along the radial direction from the inner portion of the disk to the outer portion of the disk. The optical apparatus includes an optical unit for directing the light beam onto the optical disk, the optical unit facing the first area at an initial condition and a driving unit for moving the optical unit in the radial direction from the inner portion to the outer portion. The optical apparatus further includes a detector for detecting the existence of the second area of the disk while the optical unit is moved by the driving unit.

Abstract: An optical apparatus includes an objective lens for directing a light beam on a disk medium to record data. The light beam from the disk medium is detected so as to generate a track-error signal. This track-error signal represents a location of the light beam with respect to a track of the disk medium. The optical apparatus further includes a flip-flop circuit for detecting a level of the amplitude of the track-error signal. Data recording is prohibited by an AND gate when the amplitude of the track-error signal exceeds the level.

Abstract: In order to access to a destination track, a CPU compares a present track number and a destination track number to derive out the track difference and the transfer direction of an objective lens in an optical head. Then, it derives out the sum of transfer time and processing time and determines whether or not sector "0" is passed during the total period of time. If it is determined that sector "0" is passed and when the objective lens is transferred inwardly of an optical disk, the number of tracks obtained by adding one to the track difference is supplied to a tracking controller. Then, the tracking controller drives a driving coil according to the received number of tracks so as to set the objective lens to the destination track. Further, if it is determined that sector "0" is passed and when the objective lens is transferred outwardly of the optical disk, the number of tracks obtained by subtracting one from the track difference is supplied to the tracking controller.

Abstract: An optical apparatus for focusing a light beam onto a disk medium, includes a motor for rotating the disk medium and an optical element for directing the light beam onto a plurality of sectors defined radially of the disk medium. The optical apparatus further includes a detector for detecting the light beam from the plurality of sectors of the disk medium so as to generate a pluralty of focus-error signals, each representing a distance of the optical element with respect to each of the plurality of sectors of the disk medium, and a memory for storing the plurality of focus-error signals detected from the plurality of the sectors of the disk medium. An adjuster is provided for adjusting the distance of the optical element with respect to each of the plurality of sectors of the disk medium in accordance with the plurality of focus-error signals stored in the memory.