Abstract: A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.

Abstract: A semiconductor memory device is provided which includes a plurality of data lines, at least one redundant data line, one common data line, a plurality of column switches installed between the plurality of data lines and the redundant data line and one common data line, and a column decoder for controlling the plurality of column switches. The column decoder operates to turn the column switch on. The column switch is connected to a plurality of data lines, excluding any defective data and redundant data lines during the test mode state.

Abstract: A pair of DRAM chips 1A and 1B are mounted opposedly to each other with wiring means such as lead frames put therebetween, the lead frames being substantially integral with external terminals 3B. Then, these DRAM chips and lead frames are connected together by the conventional wire bonding method. Each chip is bonded with an associated lead frame and each lead frame is disposed as plural lead frame conductors contacting mutually lead frame conductors associated with similarly function bonding pads, i.e. external terminals of the chips, of the other one of the pair of chips. Ones or plural pairs of the thus-connected DRAM chips and lead frames are stacked and corresponding leads of the lead frames are connected in common to form a laminate. The plural DRAM chips thus mounted are activated selectively in accordance with a predetermined chip selection signal.

Abstract: To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.

Abstract: Each of a plurality of memory arrays is divided into a plurality of memory mats MAT00L-MAT07L to MAT10R-MAT17R in directions in which word lines and bit lines extend. First common data lines, that is, sub-IO lines, are provided which correspond to these memory mats and which are disposed in parallel to the word lines. Bit lines designating the corresponding memory mats are selectively connected to the first common data lines. Second common data lines, that is, main IO line groups MIOG0-MIOG7, are also provided and are disposed in parallel to the bit lines. Designated sub-IO lines are selectively connected to the second common data lines. Moreover, a plurality of main amplifiers forming a main amplifier unit MAU0 are orderly arranged in the direction in which the bit lines extend.

Abstract: A semiconductor integrated circuit memory structure is provided which uses macro-cellulated circuit blocks that can permit a very large storage capability (for example, on the order of 64 Mbits in a DRAM) on a single chip. To achieve, this, a plurality of macro-cellulated memory blocks can be provided, with each of the memory blocks including a memory array as well as additional circuitry such as address selection circuits and input/output circuits. Other peripheral circuits are provided on the chip which are common to the plurality of macro-cell memory blocks. The macro-cell memory blocks themselves can be formed in an array so that their combined storage capacity will form the large overall storage capacity of the chip. The combination of the macro-cell memory blocks and the common peripheral circuitry for controlling the memory blocks permits a faster and more efficient refreshing operation for a DRAM. This is enhanced by a LOC (Lead On Chip) arrangement used in conjunction with the memory blocks.

Abstract: To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.

Abstract: A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.

Abstract: A semiconductor memory device is provided which includes a plurality of data lines coupled to memory cells and to a detecting arrangement for detecting if logical levels of each of the data lines coincide to each other or not. A test read arrangement is also provided which stores the same information, in advance, in plural memory cells so that if there is a defect in one of the memory cells, this can be detected by the detecting arrangement.

Abstract: The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.