Patents by Inventor Toshiyuki Sekido

Toshiyuki Sekido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5246524
    Abstract: A semiconductor wafer processing system having a plurality of processing devices forming a base processing line for processing in sequence a workpiece having a semiconductor wafer is provided with an auxiliary loader connected to one of the processing devices for supplying the workpiece forming a processing line different from the base processing line, and an auxiliary unloader connected to the one processing device for receiving the workpiece processed by the one processing device at times when the one processing device is not supplied the workpiece by the processing device upstream of the one processing device in the base processing line.
    Type: Grant
    Filed: May 9, 1989
    Date of Patent: September 21, 1993
    Assignee: Nitto Denko Corporation
    Inventors: Shigeji Kuroda, Toshiyuki Sekido, Kazuhiro Noda, Matsuro Kinbara