Abstract: A congestion prediction device, a congestion prediction method, and a storage medium are provided. A mapping outputs an output variable when input variables are input to the mapping. The output variable indicates a degree of congestion in a predetermined specific area. The mapping is learned in advance by machine learning. The input variables include congestion variables. Each of the congestion variables indicates a degree of congestion in the specific area at regular time intervals within a specific period. The output variable indicates a degree of congestion after a lapse of the regular time interval from an end time of the specific period.

Abstract: Disclosed herein is a coil component that includes a coil part embedded in a magnetic element body. The coil part has a structure in which plural interlayer insulating films and plural conductor layers having a coil pattern are alternately stacked. At least one of the conductor layers has a clearance area having no coil pattern and extending radially outward from a center axis of the coil part. The magnetic element body includes a first magnetic resin layer provided in an inner diameter area of the coil part, a second magnetic resin layer provided in a radially outside area of the coil part, and a fifth magnetic resin layer filled in the clearance area and contacting the first and second magnetic resin layers.

Abstract: A printing apparatus includes a mounting unit, a tank, a pump, a detection unit, an obtainment unit, and a control unit. The mounting unit is configured so that a head that ejects ink can be mounted in a replaceable manner. The tank contains ink to be supplied to the head via a tube. The pump discharges ink to an outside of the head. The detection unit detects that the head mounted on the mounting unit has been replaced. The obtainment unit obtains information of a usage history which indicates whether or not the head mounted as a replacement has been used. The control unit controls a discharge operation, which is performed by the pump after head replacement, to be changed based on the information of the usage history.

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

Abstract: Provided is a carrier including a handle and a load-carrying platform, which enables construction of a multi-tier assembly. A carrier includes caster mounting portions formed on a lower surface of a load-carrying platform, a handle that extends outward from a first side edge portion of the load-carrying platform and has an upper surface with an engaged portion being one of a recess and a through hole, and an engaging portion that projects downward from a lower surface of a second side edge portion opposed to the first side edge portion and is engageable with the engaged portion. Connection of a plurality of carriers achieves an integral and flat placement surface composed of placement surfaces, each being the upper surface of the load-carrying platform of the carrier.

Abstract: Provided is a carrier including a handle and a load-carrying platform, which enables construction of a multi-tier assembly. A carrier includes caster mounting portions formed on a lower surface of a load-carrying platform, a handle that extends outward from a first side edge portion of the load-carrying platform and has an upper surface with an engaged portion being one of a recess and a through hole, and an engaging portion that projects downward from a lower surface of a second side edge portion opposed to the first side edge portion and is engageable with the engaged portion. Connection of a plurality of carriers achieves an integral and flat placement surface composed of placement surfaces, each being the upper surface of the load-carrying platform of the carrier.

Abstract: A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.

Abstract: A processing method of a workpiece with a circular disc shape includes sticking a tape to one surface of the workpiece and integrating the workpiece and a frame through the tape, holding the workpiece by a holding unit with the interposition of the tape, and irradiating the other surface of the workpiece located on the opposite side to the one surface with a pulsed laser beam having such a wavelength as to be absorbed by the workpiece from the side of the other surface. In irradiating the laser beam, the other surface is annularly irradiated with the laser beam in the state in which the orientation of the laser beam is adjusted in such a manner that the laser beam has an angle of incidence formed due to inclination with respect to a normal to the other surface of the workpiece by a predetermined angle.

Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

Abstract: A processing performance confirmation method for a laser processing apparatus that processes a workpiece with a laser beam of a wavelength having absorption in the workpiece. The method includes a holding step of holding the workpiece by a chuck table of the laser processing apparatus, a processing mark forming step of moving the workpiece and a condensing point of the laser beam relative to each other in a predetermined direction intersecting a thickness direction of the workpiece at right angles while changing the condensing point in height, thereby to form a processing mark on an upper surface of the workpiece, a imaging step of imaging a plurality of regions of the processing mark formed in the processing mark forming step, and a confirmation step of confirming processing performance of the laser processing apparatus based on images acquired in the imaging step.

Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.

Abstract: An ice-making container including a container body having an opening formed in its upper part and being flexible so as to be deformable by being grasped and an inner container configured to be insertable into and removable from the container body through the opening, in which an ice-making area for making ice is formed between an inner peripheral surface of the container body and an outer peripheral surface of the inner container, in the state where the inner container is placed in the container body, and the ice-making area is formed as an area where the ice made in the ice-making area is crushed in response to deformation of the container body being grasped.

Abstract: There is provided an ice-making container including a container body having an opening formed in its upper part and being flexible so as to be deformable by being grasped and an inner container configured to be insertable into and removable from the container body through the opening, in which an ice-making area for making ice is formed between an inner peripheral surface of the container body and an outer peripheral surface of the inner container, in the state where the inner container is placed in the container body, and the ice-making area is formed as an area where the ice made in the ice-making area is crushed in response to deformation of the container body being grasped.