Abstract: Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.

Abstract: Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof.

Abstract: A curable organopolysiloxane composition is provided. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The curable organopolysiloxane composition can be cured to form a cured product. The cured product generally exhibits an excellent adhesion property against various substrates without cracking and delamination occurring after a thermal shock test.

Abstract: A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive layer on a substrate or member. The liquid curable silicone adhesive composition comprises: a curable reactive organopolysiloxane which has a radical reactive group and a condensation reactive group in the same molecule or throughout the mixture; a condensation reaction catalyst; an organic peroxide; an adhesion imparting agent; and a crosslinkable silane. Herein, regarding the storage modulus (G?1) of a cured product obtained by primarily curing the composition in the presence of moisture approximately at room temperature, along with the storage elastic modulus (G?2) of a cured pro duct obtained by curing the composition, the increase rate (?) of the storage elastic modulus is at least 50%.

Abstract: Provided is a curable organopolysiloxane composition having: high thermal conductivity, excellent deep curability under room temperature, excellent adhesion to various base materials, and excellent tight fitting properties to heat dissipating components and the like; a thermally conductive member containing the same; and a heat dissipating structure using the same. A multicomponent curable organopolysiloxane composition comprises: a diorganopolysiloxane with a molecular terminal blocked by a hydroxysilyl group; (B) a diorganopolysiloxane with a molecular terminal blocked by an alkoxysilyl group; (C) a thermally conductive filler; (D) an organic silicon compound serving as a surface treating agent of component (C); (E) a component selected from alkylalkoxysilanes and specific adhesion-imparting agents; and (F) a catalytic amount of a condensation-reaction catalyst.

Abstract: A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25° C. between 50 and 100,000 mPa·s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 ?m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 ?m, comprising a thermoplastic resin with a softening point between 40° C. and 200° C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25° C.

Abstract: Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof.

Abstract: Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.

Abstract: Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof.

Abstract: A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive layer on a substrate or member. The liquid curable silicone adhesive composition comprises: a curable reactive organopolysiloxane which has a radical reactive group and a condensation reactive group in the same molecule or throughout the mixture; a condensation reaction catalyst; an organic peroxide; an adhesion imparting agent; and a crosslinkable silane. Herein, regarding the storage modulus (G?1) of a cured product obtained by primarily curing the composition in the presence of moisture approximately at room temperature, along with the storage elastic modulus (G?2) of a cured pro duct obtained by curing the composition, the increase rate (?) of the storage elastic modulus is at least 50%.

Abstract: Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.

Abstract: A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25° C. between 50 and 100,000 mPa·s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 ?m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 ?m, comprising a thermoplastic resin with a softening point between 40° C. and 200° C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25° C.

Abstract: An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.

Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.

Abstract: Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.

Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

Abstract: An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.

Abstract: A curable silicone composition comprises at least (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation reaction catalyst, (D) an approximately spherical silica fine powder having an average particle diameter of 50 ?m or less and (E) glass fibers having an average fiber length of 1,000 ?m or less and an average fiber diameter of 30 ?m or less. A cured product produced by curing the curable silicone composition is also disclosed.

Abstract: The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.