Patents by Inventor Toyoichi Ueda

Toyoichi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and process for producing the same
    Patent number: 4803543
    Abstract: In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.
    Type: Grant
    Filed: December 4, 1981
    Date of Patent: February 7, 1989
    Assignees: Hitachi, Ltd., Hitachi Chemical Co., Hitachi Microcomputer Engineering Ltd.
    Inventors: Hideo Inayoshi, Akira Suzuki, Kunihiro Tsubosaki, Toyoichi Ueda, Daisuke Makino, Nobuo Ichimura, Kazunari Suzuki