Abstract: A thermoelectric device is provided that includes a top plate with surface including a first and second portion. A first plurality of thermoelectric elements are coupled to the first portion, and a second plurality of thermoelectric elements are coupled to the second portion. A base plate is coupled to the first and second plurality of thermoelectric elements. The first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements. The second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements, and the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

Abstract: In accordance with one embodiment of the present invention, a method of manufacturing a thermoelectric device is disclosed. The method includes forming a wafer of thermoelectric material and coupling the wafer to a stiff backing such that a bottom side of the wafer faces the stiff backing and a top side of the wafer faces away from the stiff backing. The method also includes reducing a thickness of the wafer by removing a portion of the wafer from the top side, and dicing the wafer into a plurality of blocks. At least a portion of the plurality of blocks are then coupled with a permanent substrate.