Patents by Inventor Tracy V. Reynolds
Tracy V. Reynolds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10522515Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: GrantFiled: February 25, 2019Date of Patent: December 31, 2019Assignee: Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Publication number: 20190279964Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: ApplicationFiled: February 25, 2019Publication date: September 12, 2019Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Patent number: 10256214Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: GrantFiled: June 19, 2017Date of Patent: April 9, 2019Assignee: Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Publication number: 20170294414Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: ApplicationFiled: June 19, 2017Publication date: October 12, 2017Applicants: Micron Technology, Inc., Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Patent number: 9717157Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: GrantFiled: February 9, 2015Date of Patent: July 25, 2017Assignee: Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Publication number: 20150156908Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: ApplicationFiled: February 9, 2015Publication date: June 4, 2015Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Patent number: 8987885Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: GrantFiled: January 15, 2013Date of Patent: March 24, 2015Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 8959759Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: GrantFiled: February 3, 2014Date of Patent: February 24, 2015Assignee: Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Publication number: 20140154844Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: ApplicationFiled: February 3, 2014Publication date: June 5, 2014Applicant: MICRON TECHNOLOGY, INC.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Patent number: 8644030Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: GrantFiled: January 14, 2009Date of Patent: February 4, 2014Assignee: Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Patent number: 8354301Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: GrantFiled: January 10, 2011Date of Patent: January 15, 2013Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Publication number: 20110147910Abstract: Several embodiments of microelectronic device packaging configurations with lead frames without downsets are disclosed herein. In one embodiment, the configuration includes a pair of microelectronic dies with active surfaces facing one another, and a lead frame positioned between the dies. The lead frame has no downset and extends from between the dies and protrudes out of an encapsulant material. In one embodiment the lead frame is connected to both an upper and a lower die. In other embodiments, the lead frame is connected to a first die by wirebonds and is not connected to a second die. The first and second die may be connected to one another by interconnects such as solder ball interconnects.Type: ApplicationFiled: December 21, 2009Publication date: June 23, 2011Applicant: MICRON TECHNOLOGY, INC.Inventors: Tracy V. Reynolds, Mark S. Johnson
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Patent number: 7944057Abstract: A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.Type: GrantFiled: December 4, 2009Date of Patent: May 17, 2011Assignee: Round Rock Research, LLCInventors: David J. Corisis, Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds
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Publication number: 20110104857Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: ApplicationFiled: January 10, 2011Publication date: May 5, 2011Applicant: MICRON TECHNOLOGY, INC.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 7868440Abstract: Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die.Type: GrantFiled: August 25, 2006Date of Patent: January 11, 2011Assignee: Micron Technology, Inc.Inventors: Stuart L. Roberts, Tracy V. Reynolds, Rich Fogal, Matt E. Schwab
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Patent number: 7851922Abstract: A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.Type: GrantFiled: September 9, 2008Date of Patent: December 14, 2010Assignee: Round Rock Research, LLCInventors: David J. Corisis, Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds
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Publication number: 20100177490Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: ApplicationFiled: January 14, 2009Publication date: July 15, 2010Applicant: MICRON TECHNOLOGY, INC.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Publication number: 20100078792Abstract: A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.Type: ApplicationFiled: December 4, 2009Publication date: April 1, 2010Applicant: MICRON TECHNOLOGY, INC.Inventors: David J. Corisis, Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds
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Publication number: 20090008797Abstract: A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.Type: ApplicationFiled: September 9, 2008Publication date: January 8, 2009Applicant: MICRON TECHNOLOGY, INC.Inventors: David J. Corisis, Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds
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Patent number: 7423336Abstract: A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.Type: GrantFiled: April 8, 2002Date of Patent: September 9, 2008Assignee: Micron Technology, Inc.Inventors: David J. Corisis, Jerry M. Brooks, Matt E. Schwab, Tracy V. Reynolds