Patents by Inventor Travis Acra

Travis Acra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11054749
    Abstract: An organic photoresist stripping composition and method of using the composition with silicon wafers having an insulating layer and metallization on the wafers, having an aryl sulfonic acid or alkylaryl sulfonic acid or mixtures thereof; 1,3-dihydroxybenzene (resorcinol) or sorbitol or mixtures thereof; one or more hydrocarbon solvents having a flash point of greater than about 65° C., and optionally less than about 0.5% by weight water based on the total weight of the composition. The composition may also be used for the removal of other materials from other substrates.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: July 6, 2021
    Assignee: Versum Materials US, LLC
    Inventors: Richard D. Peters, Michael Phenis, Travis Acra
  • Publication number: 20190361352
    Abstract: An organic photoresist stripping composition and method of using the composition with silicon wafers having an insulating layer and metallization on the wafers, having an aryl sulfonic acid or alkylaryl sulfonic acid or mixtures thereof; 1,3-dihydroxybenzene (resorcinol) or sorbitol or mixtures thereof; one or more hydrocarbon solvents having a flash point of greater than about 65° C., and optionally less than about 0.5% by weight water based on the total weight of the composition. The composition may also be used for the removal of other materials from other substrates.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 28, 2019
    Applicant: Versum Materials US, LLC
    Inventors: Richard D. Peters, Michael Phenis, Travis Acra
  • Patent number: 9650594
    Abstract: The disclosure is directed solutions and processes to remove substances from substrates. Optionally, the substances can include photoresist on semiconductor wafers. The solution may include a quaternary ammonium hydroxide, a first amine, a second amine, and a third amine with the total amount of amine being no greater than about 95% by weight of a total weight of the solution. Additionally, a solution may include at least one amine, a quaternary ammonium hydroxide, and water and be free of a polar solvent other than water with the solution having a dynamic viscosity that is no greater than about 60 centipoise.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: May 16, 2017
    Assignee: Dynaloy, LLC
    Inventors: Travis Acra, Richard Dalton Peters, Kimberly Dona Pollard, Donald James Pfettscher
  • Publication number: 20160215240
    Abstract: The disclosure is directed solutions and processes to remove substances from substrates. Optionally, the substances can include photoresist on semiconductor wafers. The solution may include a quaternary ammonium hydroxide, a first amine, a second amine, and a third amine with the total amount of amine being no greater than about 95% by weight of a total weight of the solution. Additionally, a solution may include at least one amine, a quaternary ammonium hydroxide, and water and be free of a polar solvent other than water with the solution having a dynamic viscosity that is no greater than about 60 centipoise.
    Type: Application
    Filed: January 22, 2015
    Publication date: July 28, 2016
    Applicant: Dynaloy, LLC
    Inventors: Travis Acra, Richard Dalton Peters, Kimberly Dona Pollard, Donald James Pfettscher
  • Patent number: 9158202
    Abstract: Compositions are described that are useful for removing organic and organometallic substances from substrates, for example, photoresist wafers. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic or organometallic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and specifically negative dry film photoresist from electronic devices.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 13, 2015
    Assignee: Dynaloy, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Yuanmei Cao, Spencer Erich Hochstetler, Michael Tod Phenis, Kimberly Dona Pollard
  • Publication number: 20150270155
    Abstract: The present invention relates to an accommodating device for accommodation and mounting of a wafer for application of a fluid to a top of the wafer with the following features: a revolving ring section with: d) a revolving upper edge, e) a revolving recess and f) a circumferential wall running from the upper edge to the recess, a contact plane (A) arranged within the ring section for the accommodation of the wafer on a contact surface of the wafer, wherein the ring section by means of accommodation of the wafer forms with said wafer an accommodating space for accommodation of the fluid.
    Type: Application
    Filed: November 21, 2012
    Publication date: September 24, 2015
    Applicant: EV GROUP INC.
    Inventors: Spencer Hochstetler, Richard Dalton Peters, Travis Acra
  • Publication number: 20150219996
    Abstract: Stripping compositions are described that are useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays. The stripping compositions may be suitable for removing photoresists, including acrylic-based negative dry film photoresist, from electronic devices. In one embodiment, the stripping compositions can include a polar protic solvent, an amine or alkanoamine, and a quaternary ammonium hydroxide. In one embodiment the stripping compositions can include a polar protic solvent and at least two alkanoamines. The stripping compositions may be free of polar aprotic solvents.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 6, 2015
    Applicant: Dynaloy, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Yuanmei Cao, Nichelle Maria Gilbert, Michael Tod Phenis, Kimberly Dona Pollard, Joshua Cummins, Meng Guo, Donald James Pfettscher
  • Patent number: 9029268
    Abstract: Processes are described to etch metals. In an embodiment, a process may include contacting a substrate with a stripping solution to remove photoresist from the substrate to produce a stripped substrate. The stripped substrate may include a plurality of solder pillars and a plurality of metal-containing field regions disposed around the plurality of solder pillars. In an illustrative embodiment, the plurality field regions may include copper. Additionally, the process may include rinsing the stripped substrate to produce a rinsed substrate. The rinsed substrate may be substantially free of a Sn layer or a Sn oxide layer. Further, the process may include contacting the rinsed substrate with an etch solution that is capable of removing an amount of one or more metals from the plurality of field regions.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: May 12, 2015
    Assignee: Dynaloy, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler, Kimberly Dona Pollard
  • Publication number: 20140141622
    Abstract: Processes are described to etch metals. In an embodiment, a process may include contacting a substrate with a stripping solution to remove photoresist from the substrate to produce a stripped substrate. The stripped substrate may include a plurality of solder pillars and a plurality of metal-containing field regions disposed around the plurality of solder pillars. In an illustrative embodiment, the plurality field regions may include copper. Additionally, the process may include rinsing the stripped substrate to produce a rinsed substrate. The rinsed substrate may be substantially free of a Sn layer or a Sn oxide layer. Further, the process may include contacting the rinsed substrate with an etch solution that is capable of removing an amount of one or more metals from the plurality of field regions.
    Type: Application
    Filed: November 21, 2012
    Publication date: May 22, 2014
    Applicant: DYNALOY, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler, Kimberly Dona Pollard
  • Publication number: 20140137894
    Abstract: A process is described that is useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays. A process is presented for applying a minimum volume of a chemical stripping composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The process may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and especially negative dry film photoresist from electronic devices.
    Type: Application
    Filed: November 21, 2012
    Publication date: May 22, 2014
    Applicant: DYNALOY, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler
  • Publication number: 20140137899
    Abstract: Processes are described to remove substances from substrates. In an embodiment, a process may include providing a substrate including a first side and a second side with a substance being disposed on at least a portion of the first side of the substrate. The process may also include contacting the substrate with a solution such that the first side of the substrate is coated with the solution, at least a portion of the second side is free of the solution and at least a portion of the substance is released from the first side of the substrate. Additionally, the process may include rinsing the substrate to remove at least a portion of the substance released from the first side of the substrate.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 22, 2014
    Applicant: DYNALOY, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Spencer Erich Hochstetler
  • Publication number: 20140142017
    Abstract: Compositions are described that are useful for removing organic and organometallic substances from substrates, for example, photoresist wafers. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic or organometallic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties, and specifically negative dry film photoresist from electronic devices.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 22, 2014
    Applicant: DYNALOY, LLC
    Inventors: Richard Dalton Peters, Travis Acra, Yuanmei Cao, Spencer Erich Hochstetler, Michael Tod Phenis, Kimberly Dona Pollard