Abstract: A system provides cooling to a storage device, such as solid-state drive, installed within a sealed compartment of an IHS (Information Handling System). The heat pipe extends between the storage device and a fan housing that seals a cooling fan in a physically isolated compartment from the sealed compartment of the IHS. A plurality of clips allow the heat pipe to be removably secured to an outer surface of the fan housing. A cooling plate is used to removably secure the heat pipe to a surface of the storage device. Once installed, the heat pipe transfers heat directly from the surface of the storage device to the outer surface of the sealed fan housing. The heat pipe may be uninstalled by removing screws that secure the cooling plate to the storage device and the heat pipe to the fan housing, allowing the storage device to be removed as needed.

Abstract: A method for cooling system components of information handling systems may include generating a first pulse width modulation (PWM) control signal for controlling at least one cooling fan configured to cool a system component, filtering the first PWM control signal, and applying the filtered first PWM control signal to the at least one cooling fan. The first PWM control signal may be used to control a component fan and then filtered to generate a filtered first PWM control signal used to control a system fan. The filtering of the control signal may include dampening the control signal such that the control signal is less responsive to temperature changes as the temperature nears a set temperature.

Abstract: Control signals, such as PWM control signals, can be used to control aspects of a cooling system and can be generated using proportional-integral-derivative (PID) control. PID control systems for cooling systems are designed based on default environmental and system characteristics and pre-programmed for operation prior to delivery to customers or end users. Changes in environmental and system characteristics, such as component aging, environmental variations, and variation in manufacturing from system to system, such as heat sink effectiveness and application of thermal pastes, can impact system level performance of the control system. Adjusting gain parameters for the P, I, and D components of a PID control signal can reduce negative impact on system performance resulting from such changes and allow the control system to better adjust to external factors.

Abstract: Adjusting a cooling fan speed control profile to account for system implementation factors, such as ambient temperature and usage history, can optimize power consumption and reduce the volume and variation of sound generated by shifts in fan speed in response to changes in system and component temperature. Adjusting a cooling fan speed control profile may include adjusting a maximum fan speed based on an ambient temperature or component temperature of the information handling system.

Abstract: Controlling an activation status of a proportional-integral-derivative (PID) controller for an information handling system cooling system, such as the on/off status of the PID controller, can reduce power consumption and processing and memory requirements for such a system. A decrease in resource consumption can be realized by deactivating the PID controller during certain periods and activating the PID controller during others. For example, the PID controller can be deactivated when a temperature of a system component falls below a threshold temperature and activated when the temperature of the system component rises above the threshold temperature.

Abstract: A method for cooling system components of information handling systems may include generating a first pulse width modulation (PWM) control signal for controlling at least one cooling fan configured to cool a system component, filtering the first PWM control signal, and applying the filtered first PWM control signal to the at least one cooling fan. The first PWM control signal may be used to control a component fan and then filtered to generate a filtered first PWM control signal used to control a system fan. The filtering of the control signal may include dampening the control signal such that the control signal is less responsive to temperature changes as the temperature nears a set temperature.

Abstract: Systems and methods are provided for cooling an IHS (Information Handling System) that may be docked in docking station. The IHS includes a docking plate exposed on the outer surface. When docked, the docking plate interfaces with a corresponding conductive element provided by the docking station in order to transfer heat from the IHS to the docking station. Within the IHS, an adaptive heatsink provides passive cooling to a processor of the IHS. When the IHS is docked, a portion of the adaptive heatsink contacts the docking plate and, via the conductive element of the docking station, completes a thermal pathway to auxiliary cooling systems provided by the docking station, thus allowing the IHS to supporting higher operating temperatures. When the IHS is undocked, the adaptive heatsink is separated from the docking plate by an air gap, thus limiting the transfer of heat to the docking plate and maintaining safe surface temperatures.

Abstract: Embodiments provide the ability to store a pen device within an integrated docking compartment of an IHS (Information Handling System) that utilizes a touch-sensitive display, such as certain laptops and tablet devices. The pen device is stored within a docking compartment provided partially within a cooling structure that protrudes from the bottom of the enclosure of the IHS, thus creating an air gap below the IHS that allows heated air to be vented from underneath the IHS. The docking compartment may include charging contacts that interface with charging contacts on the pen device when docked in order to charge internal batteries that power sensors integrated into the pen device. By integrating the docking compartment into the cooling structure, a pen device may be protected from damage and loss while still supporting the thin applications.

Abstract: Embodiments provide the ability to store a pen device within an integrated docking compartment of an IHS (Information Handling System) that utilizes a touch-sensitive display, such as certain laptops and tablet devices. The pen device is stored within a docking compartment provided partially within a cooling structure that protrudes from the bottom of the enclosure of the IHS, thus creating an air gap below the IHS that allows heated air to be vented from underneath the IHS. The docking compartment may include charging contacts that interface with charging contacts on the pen device when docked in order to charge internal batteries that power sensors integrated into the pen device. By integrating the docking compartment into the cooling structure, a pen device may be protected from damage and loss while still supporting the thin applications.

Abstract: A data processing equipment structure includes a plurality of sidewalls and a ceiling panel, which, together, define an enclosed space. The structure further includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row within the enclosed space. At least one separation panel divides the enclosed space into a front plenum at a front side of the row and a rear plenum at a rear side of the row. Cool air in the front plenum is isolated from heated exhaust air in the rear plenum.

Abstract: A data processing equipment structure includes a plurality of sidewalls and a ceiling panel, which, together, define an enclosed space. The structure further includes at least one equipment enclosure and at least one cooling unit arranged in side-to-side relationship in a row within the enclosed space. At least one separation panel divides the enclosed space into a front plenum at a front side of the row and a rear plenum at a rear side of the row. Cool air in the front plenum is isolated from heated exhaust air in the rear plenum.

Abstract: Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

Abstract: Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

Abstract: Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

Abstract: A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.

Abstract: A device comprising a first thermal interface material, and a first micro-channel cold plate. The first thermal interface material is in physical communication with a first plurality of memory modules of a computer system. The first micro-channel cold plate is in physical communication with the first thermal interface material. The first micro-channel cold plate is adapted to allow a fluid flow through a first plurality of micro-channels, and configured to remove a first amount of heat produced by the first memory modules of the computer system through the first thermal interface material.

Abstract: A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.

Abstract: An information handling system including a heat generating component positioned within the information handling system, a heat transfer surface in thermal communication with the heat generating component and a medium comprising water and gold thiolate nanoparticles, wherein the medium is in thermal communication with the heat transfer surface.

Abstract: A heat conduction apparatus includes a sealed body having an inside surface and defining a cavity. A capillary structure is on the inside surface of the sealed body. A working fluid is in the cavity and includes nanoparticles. The heat conduction apparatus may be coupled to a heat producing component in order to provide greater heat dissipation capability than is provided by a heat conduction apparatus with a conventional working fluid.