Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.

Abstract: A short, high density interposer. The interposer has multiple contacts, with upwards and downwards-facing contact surfaces. Each of the contacts may be formed as a beam stamped from a sheet of metal. Two sheets of metal may be used in forming the interposer. A first sheet may be stamped with upwards facing contacts. A second sheet may be stamped with downwards facing contacts. Bases of the beams on the first sheet may be fused with bases of the beams on the second sheet, creating a conducting path through the interposer, with compliant contacts at each end. The joined contacts may be separated from the sheets from which they are stamped and held together with an insulative base of the interposer. Beams shaped to form contacts in the interposer may be closely spaced when stamped in a sheet of metal and may have a low height.

Abstract: A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.

Abstract: A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A short, high density interposer. The interposer has multiple contacts, with upwards and downwards-facing contact surfaces. Each of the contacts may be formed as a beam stamped from a sheet of metal. Two sheets of metal may be used in forming the interposer. A first sheet may be stamped with upwards facing contacts. A second sheet may be stamped with downwards facing contacts. Bases of the beams on the first sheet may be fused with bases of the beams on the second sheet, creating a conducting path through the interposer, with compliant contacts at each end. The joined contacts may be separated from the sheets from which they are stamped and held together with an insulative base of the interposer. Beams shaped to form contacts in the interposer may be closely spaced when stamped in a sheet of metal and may have a low height.

Abstract: A cable termination assembly configured for mounting to an interior portion of a printed circuit board. The cable termination assembly has a frame shaped to receive a paddle card to which a plurality of cables are terminated. A lid, when closed, may force the paddle card into contact with an interposer, which in turn may be pressed into a printed circuit board on which the cable termination assembly is mounted. Electrical signals may pass between the cables and traces in the printed circuit board via the paddle card and interposer. The termination assembly may be mounted near a processor or other high speed component on the printed circuit board, enabling high speed signals to be coupled with low loss between a periphery of the printed circuit board, or even a location off the printed circuit board, and the high speed component.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A plug connector for an electronic device has a deformable seal positioned on it such that when the plug connector is mated to the electronic device a liquid-tight seal is formed between the plug connector and the electronic device. A seal may also be positioned within a receptacle connector cavity of the electronic device such that it forms a liquid-tight seal to a plug connector when the plug connector is mated to the electronic device.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A plug connector for an electronic device has a deformable seal positioned on it such that when the plug connector is mated to the electronic device a liquid-tight seal is formed between the plug connector and the electronic device. A seal may also be positioned within a receptacle connector cavity of the electronic device such that it forms a liquid-tight seal to a plug connector when the plug connector is mated to the electronic device.

Abstract: Contact structures for devices, where contacts in the contact structures provide a proper normal force while consuming a minimal amount of surface area, depth, and volume in a device and where the contact structures prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.

Abstract: Contact structures for devices, where contacts in the contact structures may provide a sufficient normal force to provide a good electrical connection with corresponding contacts while consuming a minimal amount of surface area, depth, and volume in a device, and where the contact structures may prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: An electrical interconnection system with high speed, high density electrical connectors. One of the connectors includes a mating contact portion that has multiple contact surface. The mating contact portion has multiple segments, each with a contact surface, such that multiple points of contact to a complementary mating contact portion in a mating connector are provided for mechanical robustness. Such a mating contact may have parallel elongated members on which the mating surface are positioned, providing for the possibility of more than two contact surface per mating contact portion. The mating contact surfaces may be positioned on the elongated members such that the points of contact are at different distances from the distal end of the mating contact portion.

Abstract: A mesh network of printed circuit boards (PCBs) including a first PCB coupled to a second rigid PCB by way of an interlocking connection is provided. The interlocking connection has a degree of freedom that allows the first and second PCBs to form a twist angle between each other; the interlocking connector configured to provide electrical coupling between active components disposed in each of the first and second PCBs. A method of forming a substrate fabric including a mesh network as above is also provided. Further provided is a method of activating the mesh network of printed circuit boards as above.

Abstract: Contact structures for devices, where contacts in the contact structures may provide a sufficient normal force to provide a good electrical connection with corresponding contacts while consuming a minimal amount of surface area, depth, and volume in a device, and where the contact structures may prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.

Abstract: Contact structures for devices, where contacts in the contact structures provide a proper normal force while consuming a minimal amount of surface area, depth, and volume in a device and where the contact structures prevent or limit the ingress of fluid or debris into the device. On example may provide a contact structure having a frame. The frame may be arranged to be placed in an opening in a device enclosure for an electronic device or the frame may be part of the electronic device. The frame may include a number of passages, each passage for a contact of the contact structure. Each contact may be held to the frame by a pliable membrane. Each contact may connect to a board in the electronic device via a compliant conductive path.