Patents by Inventor Trent T. Ward

Trent T. Ward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for reducing removal forces for CMP pads
    Patent number: 8308528
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to a platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: November 13, 2012
    Assignee: Round Rock Research, LLC
    Inventor: Trent T. Ward
  • APPARATUS AND METHOD FOR REDUCING REMOVAL FORCES FOR CMP PADS
    Publication number: 20090298395
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Application
    Filed: August 4, 2009
    Publication date: December 3, 2009
    Applicant: Micron Technology, Inc.
    Inventor: Trent T. Ward
  • Apparatus and method for reducing removal forces for CMP pads
    Patent number: 7585425
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: September 8, 2009
    Assignee: Micron Technology, Inc.
    Inventor: Trent T. Ward
  • Method for reducing removal forces for CMP pads
    Patent number: 6991740
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: January 31, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Trent T. Ward
  • Apparatus and method for reducing removal forces for CMP pads
    Patent number: 6814834
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: November 9, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Trent T. Ward
  • Apparatus and method for reducing removal forces for CMP pads
    Publication number: 20020144780
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Application
    Filed: May 31, 2002
    Publication date: October 10, 2002
    Inventor: Trent T. Ward
  • Apparatus and method for reducing removal forces for CMP pads
    Patent number: 6398905
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: June 4, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Trent T. Ward
  • Apparatus and method for reducing removal forces for CMP pads
    Patent number: 6036586
    Abstract: An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
    Type: Grant
    Filed: July 29, 1998
    Date of Patent: March 14, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Trent T. Ward