Abstract: A heat transfer apparatus is disclosed. The heat transfer apparatus includes a heat pipe containing heat transfer liquid. Disposed in the heat pipe is a centrifugal rotor assembly having fixed magnets on the rotor blades. A magnetic field is generated by a magnetic coil assembly that surrounds the heat pipe. The rotor assembly rotates in response to the magnetic field, agitating the heat transfer liquid. A second embodiment is a liquid heat transfer system that includes a heat absorption chamber, a pump, and a heat exchanger where circulation and cooling of the heat transfer liquid occurs outside of the heat absorption chamber.

Abstract: An apparatus for varying a temperature of a device under test (DUT). The apparatus comprises a plate having a surface area configured to couple to the DUT to transfer heat to and from the DUT by way of conduction. A heat exchanger is connected to the plate to set a temperature of the surface area of the plate to one of a range of temperatures by way of conduction. The heat exchanger circulates a plurality of fluids that each have a different nominal temperature, and the flow rates of the fluids are adjustable to vary the temperature of the surface area of the plate, thereby varying the temperature of the DUT.

Abstract: A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a portion of the heat sink projects from the package, forming a post. A heat transfer assembly having a shaft with an aperture is heated until the aperture expands sufficiently to allow the heat transfer assembly to be fitted on the post with a minimum of force. Upon cooling, a tight joint is formed between the heat sink and the heat transfer assembly.

Abstract: A device for receiving thermal conduit comprising a thermally conductive material for coupling between an end of a conducting element of the thermal conduit and an end of an outer shell of the thermal conduit. The thermally conductive material is arranged to physically define a best thermal path from the end of the conducting element to the end of the outer shell such that substantially all thermal energy dissipated from the conducting element to the outer shell flows along the best thermal path. The length of the best thermal path is significantly greater than a nearest distance between the conducting element and the outer shell, and the conductive material is thin and manufactured of a poor thermal conductor such that the total energy dissipated along the best thermal path is reduced.

Abstract: An integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric device. By disposing an integrated circuit chip on the second plate and evaluating the chamber, the integrated circuit chip may be cooled to a sub-ambient temperature without internal or external condensation.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package also includes a carrier for holding the integrated circuit. The carrier is positioned within the cavity of the substrate. A thermally reactive connector is coupled to the carrier. The thermally reactive connector is for selectively coupling the carrier to the substrate when a temperature of the thermally reactive connector is above a first temperature such that the carrier is held in position within the opening. The thermally reactive connector is also for decoupling the carrier from the substrate when the carrier temperature is at the first temperature. In this manner, the number of thermal paths between the integrated circuit and the substrate of the integrated circuit is reduced.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a substrate having a cavity formed therein for enclosing an integrated circuit. The integrated circuit package also includes a carrier for holding the integrated circuit. The carrier is positioned within the cavity of the substrate. A thermally reactive connector is coupled to the carrier. The thermally reactive connector is for selectively coupling the carrier to the substrate when a temperature of the thermally reactive connector is above a first temperature such that the carrier is held in position within the opening. The thermally reactive connector is also for decoupling the carrier from the substrate when the carrier temperature is at the first temperature. In this manner, the number of thermal paths between the integrated circuit and the substrate of the integrated circuit is reduced.

Abstract: A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a portion of the heat sink projects from the package, forming a post. A heat transfer assembly having a shaft with an aperture is heated until the aperture expands sufficiently to allow the heat transfer assembly to be fitted on the post with a minimum of force. Upon cooling, a tight joint is formed between the heat sink and the heat transfer assembly.

Abstract: An acoustic duct using active noise cancellation to reduce the acoustic signature of a computer system is disclosed. The acoustic duct is coupled to a vent of a thermal box that encloses the components (the heat source) and the fan cooling system (the noise source) of the computer system. The acoustic duct is constructed as an acoustic waveguide such that the flow of air through the thermal box is not impeded. An anti-noise circuit that generates an anti-noise signal is positioned near the vent such that the anti-noise signal and the noise signal generated by the noise source propagate through and out of the acoustic duct in the same mode.

Abstract: A heat transfer apparatus is disclosed. The heat transfer apparatus includes a heat pipe containing heat transfer liquid. Disposed in the heat pipe is a centrifugal rotor assembly having fixed magnets on the rotor blades. A magnetic field is generated by a magnetic coil assembly that surrounds the heat pipe. The rotor assembly rotates in response to the magnetic field, agitating the heat transfer liquid. A second embodiment is a liquid heat transfer system that includes a heat absorption chamber, a pump, and a heat exchanger where circulation and cooling of the heat transfer liquid occurs outside of the heat absorption chamber.