Abstract: A support structure is provided between, preferably approximately midway between, a semiconductor die and the inner ends of the lead fingers of a lead frame. Intermediate portions of bond wires connecting the die to the lead fingers are bonded, or tacked, to an upper surface of the support structure. In this manner, the length of the bond wires can be doubled, and the lead fingers can be commensurately further from the die so that a greater number of lead fingers of a given size and spacing can be provided, while avoiding the problems associated with long bond wires.

Abstract: In contrast to the conventional automated bonding system, an electronic device (10) is mounted within a surrounding ring frame (12, 14) of insulating material by means of a plurality of individually applied tapes or ribbons (16) of electrically conductive material. A protective coating (18) may be applied to the assembly after bonding.

Abstract: For physical protection and to reduce stress, an electronic device (10) is mounted within a cavity in a housing (14) which constitutes an encapsulating member. The housing is preferably formed as two premoulded piece parts (14a, 14b). A leadframe (12) extends into the housing (14) in the manner of a sandwich construction. The device (10) may be mounted on a heat sink (16).

Abstract: An electronic device (10) encased within a moulded package body (11) has a leadframe (12) extending therefrom. In order to protect the leads (16) for the electronic device a guard ring (14) is provided on the leadframe. By making the guard ring independently of the moulded package body and fitting it separately to the leadframe one can deal with packages of any size in a simple manner and irrespective of the material of the package body (11).

Abstract: A power component such as a power transistor is mounted on an insulating substrate of, e.g., beryllia by using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lands, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimized if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.