Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).

Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).

Abstract: An electronic device may have an upper housing and a lower housing separated by a slot. An antenna module may be mounted in the lower housing and may include a cavity. An antenna element may be disposed within the cavity. Grounded traces may be patterned onto walls of the module and may be coupled to conductive walls of the lower housing by conductive gaskets. The antenna element may have a high band arm displaced farther into the cavity than a low band arm by a shim. The antenna module may have an acoustic port aligned with a speaker port. The acoustic port may allow sound waves from a speaker to pass into the cavity from the speaker port. The cavity may be configured to optimize an audio response of the speaker while concurrently optimizing radio-frequency performance of the antenna element.

Abstract: In at least one example, an electronic device can include a lower base portion including a housing. The housing can define an internal volume of the lower portion and a rear side defining an aperture. The device can also include an upper portion rotatably connected to the lower portion at the rear side, an audio component disposed in the internal volume, and a channel extending from the audio component to the aperture.