Patents by Inventor Trupti D. Gawai
Trupti D. Gawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990370Abstract: Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device includes forming an opening in an electrically insulative material at least partially over a first electrically conductive feature and a second electrically conductive feature. The method can further include forming a ring of electrically conductive material around a sidewall of the insulative material defining the opening, wherein the ring of electrically conductive material includes (a) a first via portion over the first electrically conductive feature, (b) a second via portion over the second electrically conductive feature, and (c) connecting portions extending between the first and second via portions. Finally, the method can include removing the connecting portions of the ring of electrically conductive material to electrically isolate the first via portion from the second via portion.Type: GrantFiled: October 21, 2022Date of Patent: May 21, 2024Assignee: Micron Technology, Inc.Inventors: Trupti D. Gawai, David S. Pratt, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed, Chelsea M. Jordan, Radhakrishna Kotti
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Patent number: 11924730Abstract: Methods, systems, and devices for operating emergency prevention sensor systems are described. Devices can include a plurality of components including a sensor component, a processor, and memory. In an example, a method can include receiving at a processor signaling from a plurality of environmental sensing devices, each having at least one biodegradable component, in an area of concern, wherein the area of concern corresponds to a particular set of coordinates in a database, determining environmental characteristics of an emergency associated with the area of concern based, at least in part, on the signaling, and determining a preventive action based on the determined characteristics. In another example, a number of components of the sensing devices are biodegradable.Type: GrantFiled: November 23, 2020Date of Patent: March 5, 2024Assignee: Micron Technology, Inc.Inventors: Shruthi Kumara Vadivel, Anshika Sharma, Deepti Verma, Fatma Arzum Simsek-Ege, Trupti D. Gawai, Lavanya Sriram
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Integrated Circuitry, Array Of Cross-Point Memory Cells, Method Used In Forming Integrated Circuitry
Publication number: 20230371282Abstract: Integrated circuitry comprises a horizontally-elongated insulative wall directly above a conductive node. The wall comprises insulative material. A conductive via extends through the wall to the conductive node. A conductive line is directly above the wall and directly above the conductive via. The conductive via directly electrically couples together the conductive line with the conductive node. Insulator material is longitudinally-along laterally-opposing sides of the wall. An interface of the insulative material of the wall and the insulator material are on each of the laterally-opposing sides of the wall. Other embodiments, including method, are disclosed.Type: ApplicationFiled: May 11, 2022Publication date: November 16, 2023Applicant: Micron Technology, Inc.Inventors: David A. Kewley, Kevin Baker, Trupti D. Gawai -
Publication number: 20230329612Abstract: Methods, devices, and systems related to determining driver capability are described. In an example, a method can include receiving, at a computing device, data associated with a driver from a sensor, inputting the data into an artificial intelligence (AI) model, performing an AI operation using the AI model, and determining whether the driver is capable of driving a vehicle based on an output of the AI model.Type: ApplicationFiled: April 14, 2022Publication date: October 19, 2023Inventors: Lisa R. Copenspire-Ross, Nkiruka Christian, Trupti D. Gawai, Josephine T. Hamada, Anda C. Mocuta
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Patent number: 11784077Abstract: A method for determining overlay measurements includes orienting a wafer to align portions of lines of a pattern of an overlay mark with a direction in which a source emits light at the wafer and align other portions of the lines of the pattern to extend in a direction perpendicular to the direction in which the illumination source emits light at the wafer. The method includes capturing at least one image of the wafer via an imager sensor. The method also includes determining contrasts of regions of the overlay mark and determining a location of the overlay mark. Overlay marks include a pattern defining an array of columns. Each column includes a set of continuous lines oriented parallel to each other and extending in a first direction within a first region of a column and extending in a second different direction in a second region of the column.Type: GrantFiled: December 18, 2019Date of Patent: October 10, 2023Assignee: Micron Technology, Inc.Inventors: Denzil S. Frost, Richard T. Housley, David S. Pratt, Trupti D. Gawai
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Publication number: 20230113573Abstract: Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device includes forming an opening in an electrically insulative material at least partially over a first electrically conductive feature and a second electrically conductive feature. The method can further include forming a ring of electrically conductive material around a sidewall of the insulative material defining the opening, wherein the ring of electrically conductive material includes (a) a first via portion over the first electrically conductive feature, (b) a second via portion over the second electrically conductive feature, and (c) connecting portions extending between the first and second via portions. Finally, the method can include removing the connecting portions of the ring of electrically conductive material to electrically isolate the first via portion from the second via portion.Type: ApplicationFiled: October 21, 2022Publication date: April 13, 2023Inventors: Trupti D. Gawai, David S. Pratt, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed, Chelsea M. Jordan, Radhakrishna Kotti
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Publication number: 20230064985Abstract: Methods, systems, and devices associated with a smart scent library are described. An apparatus can include a processing resource and a memory resource having instructions executable to store data representing a number of chemical compositions in a smart scent library. The instructions can be executable to receive data, including a chemical composition, and compare the chemical composition to the number of chemical compositions. The instructions can be executable to identify the chemical composition in response to matching at least a portion of the chemical composition to one of the number of chemical compositions, and transmit data associated with the identified chemical composition.Type: ApplicationFiled: September 1, 2021Publication date: March 2, 2023Inventors: Trupti D. Gawai, Brooke Spencer, Erica A. Ellingson
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Patent number: 11574842Abstract: Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device includes forming an opening in an insulative material at least partially over an electrically conductive feature. The method can further include forming a ring of electrically non-conductive material extending at least partially about a sidewall of the insulative material that defines the opening. The method can further include removing a portion of the ring to form an opening over the electrically conductive feature, and then depositing an electrically conductive material into the opening in the ring to form a conductive via electrically coupled to the electrically conductive feature.Type: GrantFiled: April 14, 2021Date of Patent: February 7, 2023Assignee: Micron Technology, Inc.Inventors: Trupti D. Gawai, David A. Kewley, Aaron M. Lowe, Radhakrishna Kotti, David S. Pratt
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Patent number: 11515204Abstract: Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device includes forming an opening in an electrically insulative material at least partially over a first electrically conductive feature and a second electrically conductive feature. The method can further include forming a ring of electrically conductive material around a sidewall of the insulative material defining the opening, wherein the ring of electrically conductive material includes (a) a first via portion over the first electrically conductive feature, (b) a second via portion over the second electrically conductive feature, and (c) connecting portions extending between the first and second via portions. Finally, the method can include removing the connecting portions of the ring of electrically conductive material to electrically isolate the first via portion from the second via portion.Type: GrantFiled: December 29, 2020Date of Patent: November 29, 2022Assignee: Micron Technology, Inc.Inventors: Trupti D. Gawai, David S. Pratt, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed, Chelsea M. Jordan, Radhakrishna Kotti
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Publication number: 20220342386Abstract: Methods, devices, and systems related to process control in manufacturing are described. In an example, a method can include receiving data from a first process control device affixed to a first manufacturing tool of a first type, identifying one or more attributes of the data via a second processing resource of a second process control device affixed to a second manufacturing tool of a second type different from the first type, determining one or more settings for the second manufacturing tool via the second processing resource in response to identifying the one or more attributes of the data, and sending a command including the one or more settings to the second manufacturing tool from the second process control device.Type: ApplicationFiled: July 11, 2022Publication date: October 27, 2022Inventors: Fatma Arzum Simsek-Ege, Shruthi Kumara Vadivel, Deepti Verma, Anshika Sharma, Lavanya Sriram, Trupti D. Gawai
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Publication number: 20220336277Abstract: Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device includes forming an opening in an insulative material at least partially over an electrically conductive feature. The method can further include forming a ring of electrically non-conductive material extending at least partially about a sidewall of the insulative material that defines the opening. The method can further include removing a portion of the ring to form an opening over the electrically conductive feature, and then depositing an electrically conductive material into the opening in the ring to form a conductive via electrically coupled to the electrically conductive feature.Type: ApplicationFiled: April 14, 2021Publication date: October 20, 2022Inventors: Trupti D. Gawai, David A. Kewley, Aaron M. Lowe, Radhakrishna Kotti, David S. Pratt
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Patent number: 11385618Abstract: Methods, devices, and systems related to process control in manufacturing are described. In an example, a method can include receiving data from a first process control device affixed to a first manufacturing tool of a first type, identifying one or more attributes of the data via a second processing resource of a second process control device affixed to a second manufacturing tool of a second type different from the first type, determining one or more settings for the second manufacturing tool via the second processing resource in response to identifying the one or more attributes of the data, and sending a command including the one or more settings to the second manufacturing tool from the second process control device.Type: GrantFiled: August 19, 2020Date of Patent: July 12, 2022Assignee: Micron Technology, Inc.Inventors: Fatma Arzum Simsek-Ege, Shruthi Kumara Vadivel, Deepti Verma, Anshika Sharma, Lavanya Sriram, Trupti D. Gawai
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Publication number: 20220208606Abstract: Methods of manufacturing semiconductor devices, and associated systems and devices, are disclosed herein. In some embodiments, a method of manufacturing a semiconductor device includes forming an opening in an electrically insulative material at least partially over a first electrically conductive feature and a second electrically conductive feature. The method can further include forming a ring of electrically conductive material around a sidewall of the insulative material defining the opening, wherein the ring of electrically conductive material includes (a) a first via portion over the first electrically conductive feature, (b) a second via portion over the second electrically conductive feature, and (c) connecting portions extending between the first and second via portions. Finally, the method can include removing the connecting portions of the ring of electrically conductive material to electrically isolate the first via portion from the second via portion.Type: ApplicationFiled: December 29, 2020Publication date: June 30, 2022Inventors: Trupti D. Gawai, David S. Pratt, Ahmed M. Elsied, David A. Kewley, Dale W. Collins, Raju Ahmed, Chelsea M. Jordan, Radhakrishna Kotti
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Publication number: 20220167138Abstract: Methods, systems, and devices for operating emergency prevention sensor systems are described. Devices can include a plurality of components including a sensor component, a processor, and memory. In an example, a method can include receiving at a processor signaling from a plurality of environmental sensing devices, each having at least one biodegradable component, in an area of concern, wherein the area of concern corresponds to a particular set of coordinates in a database, determining environmental characteristics of an emergency associated with the area of concern based, at least in part, on the signaling, and determining a preventive action based on the determined characteristics. In another example, a number of components of the sensing devices are biodegradable.Type: ApplicationFiled: November 23, 2020Publication date: May 26, 2022Inventors: Shruthi Kumara Vadivel, Anshika Sharma, Deepti Verma, Fatma Arzum Simsek-Ege, Trupti D. Gawai, Lavanya Sriram
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Publication number: 20220075369Abstract: Apparatuses, and methods related machine learning (ML) with sensor information relevant to a location of a roadway are described. Memory systems including processing resource and memory resources receive sensor information from a sensor associated with a vehicle and a relevant to a location on a roadway. The received sensor information from the vehicle can be operated upon, using a ML algorithm, and an instruction can be transmitted based on ML algorithm. In an example, a method can include receiving, at a processing resource, sensor information from a sensor associated with a first vehicle and relevant to a location on a roadway, operating on the received sensor information associated with the first vehicle using a ML algorithm stored in a memory resource accessible by the processing resource, transmitting instructions relevant to the location, based on the sensor information associated with the first vehicle that was operated upon by the ML algorithm.Type: ApplicationFiled: September 4, 2020Publication date: March 10, 2022Inventors: Fatma Arzum Simsek-Ege, Deepti Verma, Anshika Sharma, Lavanya Sriram, Trupti D. Gawai
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Publication number: 20220057777Abstract: Methods, devices, and systems related to process control in manufacturing are described. In an example, a method can include receiving data from a first process control device affixed to a first manufacturing tool of a first type, identifying one or more attributes of the data via a second processing resource of a second process control device affixed to a second manufacturing tool of a second type different from the first type, determining one or more settings for the second manufacturing tool via the second processing resource in response to identifying the one or more attributes of the data, and sending a command including the one or more settings to the second manufacturing tool from the second process control device.Type: ApplicationFiled: August 19, 2020Publication date: February 24, 2022Inventors: Fatma Arzum Simsek-Ege, Shruthi Kumara Vadivel, Deepti Verma, Anshika Sharma, Lavanya Sriram, Trupti D. Gawai
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Publication number: 20210193493Abstract: A method for determining overlay measurements includes orienting a wafer to align portions of lines of a pattern of an overlay mark with a direction in which a source emits light at the wafer and align other portions of the lines of the pattern to extend in a direction perpendicular to the direction in which the illumination source emits light at the wafer. The method includes capturing at least one image of the wafer via an imager sensor. The method also includes determining contrasts of regions of the overlay mark and determining a location of the overlay mark. Overlay marks include a pattern defining an array of columns. Each column includes a set of continuous lines oriented parallel to each other and extending in a first direction within a first region of a column and extending in a second different direction in a second region of the column.Type: ApplicationFiled: December 18, 2019Publication date: June 24, 2021Inventors: Denzil S. Frost, Richard T. Housley, David S. Pratt, Trupti D. Gawai