Abstract: The invention describes a method for lowering particle count after tungsten etch back, in which method a plasma ashing step is performed after a brush cleaning step to eliminate polymer residues that remain on the metal barrier layer after tungsten etch back. Another tungsten etch back process is further performed to remove a tungsten oxide film that is formed by reacting the tungsten layer with an O2 gas used in the plasma ashing step.

Abstract: A method for fabricating a passivation layer and a liquid crystal display. For the fabrication method, a substrate is provided. An oxide layer, a first silicon nitride layer, a spin-on-glass (SOG) layer, and a second silicon nitride layer are sequentially formed over the substrate. The liquid crystal display has a controller, a dielectric layer, a metal layer, an oxide layer, a first silicon nitride layer, a spin-on-glass layer, and a second silicon nitride layer. The dielectric layer is positioned over the controller. A metal layer is positioned over the dielectric layer. An oxide layer is formed over the metal layer. A first silicon nitride layer is formed over the oxide layer. A spin-on-glass (SOG) layer is formed over the first silicon nitride layer. A second silicon nitride layer is formed over the SOG layer.

Abstract: The invention describes a method for lowering particle count after tungsten etch back, in which method a plasma ashing step is performed after a brush cleaning step to eliminate polymer residues that remain on the metal barrier layer after tungsten etch back. Another tungsten etch back process is further performed to remove a tungsten oxide film that is formed by reacting the tungsten layer with an O2 gas used in the plasma ashing step.

Abstract: A method for preventing the formation of recesses in the surface of a borophosphosilicate glass layer comprising the step of first forming a borophosphosilicate glass layer over a substrate, then forming a silicon nitride film having a thickness of about 300.ANG. to 1000.ANG. over the borophosphosilicate glass layer. Next, contact windows are formed, followed by cleaning with an RCA solution. The silicon nitride film provides a protective function preventing the formation of recesses on the borophosphosilicate glass surface. Consequently, no short-circuiting metal bridges caused by metal in the recesses after the deposition of metallic conducting wires are formed.

Abstract: An architecture of poly fuses includes a number of fuses, a dielectric layer, a sheet-like etching stop layer, and a passivation layer, wherein the sheet-like etching stop layer further includes a number of slices, and wherein each of the slices corresponds to one of the fuses underneath. The architecture of poly fuses according to the invention reduces the energy dispersion during the defective recovering process, and improves the recovery rate for defective memory cells.