Patents by Inventor Tse-Hsine Laio

Tse-Hsine Laio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7474541
    Abstract: In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: January 6, 2009
    Assignee: Giga-Byte Technology Co., Ltd.
    Inventors: Tse-Hsine Laio, Ting-Kuo Kao
  • Patent number: 7300315
    Abstract: A structure of an interface card connector includes a connector body and a plurality of terminals provided on the connector body. The bottom surface of the connector body is divided into a terminal zone and a space zone along the transverse direction. The distal ends of the terminals project from the terminal zone toward the bottom surface of the connector body. The space zone is recessed toward the connector body to form a notch portion, so that the bottom surface formed by the space zone is higher than that formed by the terminal zone. The space zone is used to provide a space for arranging the electronic components on the main board, so that more space on the main board is spared for the circuit layout. With this arrangement, the problem of the insufficient space and area of the main board can be solved.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 27, 2007
    Assignee: Giga-Byte Technology Co. Ltd.
    Inventors: Chih-Ming Lai, Hou-Yuan Lin, Yung-Shun Kao, Tse-Hsine Laio
  • Publication number: 20070261882
    Abstract: In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 15, 2007
    Inventors: Tse-Hsine Laio, Ting-Kuo Kao
  • Publication number: 20070263362
    Abstract: A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.
    Type: Application
    Filed: May 12, 2006
    Publication date: November 15, 2007
    Inventors: Tse-Hsine Laio, Ting-Kuo Kao
  • Patent number: 7295441
    Abstract: A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: November 13, 2007
    Assignee: Giga-Gyte Technology Co. Ltd.
    Inventors: Tse-Hsine Laio, Ting-Kuo Kao
  • Publication number: 20070254526
    Abstract: A structure of an interface card connector includes a connector body and a plurality of terminals provided on the connector body. The bottom surface of the connector body is divided into a terminal zone and a space zone along the transverse direction. The distal ends of the terminals project from the terminal zone toward the bottom surface of the connector body. The space zone is recessed toward the connector body to form a notch portion, so that the bottom surface formed by the space zone is higher than that formed by the terminal zone. The space zone is used to provide a space for arranging the electronic components on the main board, so that more space on the main board is spared for the circuit layout. With this arrangement, the problem of the insufficient space and area of the main board can be solved.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chih-Ming Lai, Hou-Yuan Lin, Yung-Shun Kao, Tse-Hsine Laio