Abstract: An IC mounting tool including a substantially arched spring plate having two opposite ends bilaterally horizontally extended outwards and formed into two opposite horizontal bearing sections and then into two opposite vertical tip sections, and two movable pawls inserted through the in vertical sliding slots of the vertical tip sections, wherein when the IC mounting tool is used to install an IC in an IC connector, the movable pawls are forced upwards to receive the keys thereof in respective slots of the horizontal bearing sections; when the IC mounting tool is used to remove an IC from an IC connector, the key of each movable pawl is extended out of the respective vertical tip section and clamped on the bottom side of the IC permitting the IC to be removed out of the IC connector when the IC mounting tool is pulled upwards.